Laser processing apparatus

US2016172182A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016172182-A1
Application numberUS-201514957854-A
CountryUS
Kind codeA1
Filing dateDec 3, 2015
Priority dateDec 12, 2014
Publication dateJun 16, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator which oscillates a laser beam, an output power adjustment unit which adjusts output power of the laser beam, a condenser which converges the laser beam and irradiates the converged laser beam upon a workpiece held on a chuck table, and a rocking unit which is disposed between the laser oscillator and the condenser and rocks the laser beam oscillated by the laser oscillator in an X-axis direction and a Y-axis direction. A controller has a memory in which a processing controlling program for carrying out processing for the workpiece held on the chuck table and a marking controlling program for carrying out marking for the workpiece are stored. The processing controlling program and the marking controlling program are selected by a program selection signal from an inputting unit.

First claim

Opening claim text (preview).

What is claimed is: 1 . A laser processing apparatus, comprising: a chuck table having a holding face defined by an X axis and a Y axis for holding a workpiece thereon; laser beam irradiation means for irradiating a laser beam upon the workpiece held on the chuck table; X-axis moving means for moving the chuck table and the laser beam irradiation means relative to each other in the X-axis direction; Y-axis moving means for moving the chuck table and the laser beam irradiation means relative to each other in the Y-axis direction; and control means for controlling the laser beam irradiation means, the X-axis moving means and the Y-axis moving means; the laser beam irradiation means including laser beam oscillation means for oscillating a laser beam, output power adjustment means for adjusting output power of the laser beam oscillated by the laser beam oscillation means, a condenser configured to converge the laser beam oscillated by the laser beam oscillation means and irradiate the converged laser beam upon the workpiece held on the chuck table, and rocking means disposed between the laser beam oscillation means and the condenser for rocking the laser beam oscillated by the laser beam oscillation means in the X-axis direction and the Y-axis direction; the control means including a memory in which a processing controlling program for carrying out processing for the workpiece held on the chuck table and a marking controlling program for applying a marking to the workpiece are stored; the processing controlling program and the marking controlling program being selected by a program selection signal from inputting means. 2 . The laser processing apparatus according to claim 1 , wherein the laser beam irradiation means includes a wavelength conversion mechanism configured to convert a wavelength of the laser beam oscillated by the laser beam oscillation means.

Assignees

Inventors

Classifications

  • for identification or tracking · CPC title

  • alphanumeric information, e.g. words, letters or serial numbers · CPC title

  • used during dicing or grinding · CPC title

  • Wafer tapes, e.g. grinding or dicing support tapes · CPC title

  • Apparatus for mechanical treatment or grinding or cutting · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016172182A1 cover?
A laser beam irradiation unit of a laser processing apparatus includes a laser oscillator which oscillates a laser beam, an output power adjustment unit which adjusts output power of the laser beam, a condenser which converges the laser beam and irradiates the converged laser beam upon a workpiece held on a chuck table, and a rocking unit which is disposed between the laser oscillator and the c…
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/50. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Jun 16 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).