Film deposition device

Patent metadata

Field	Value
Publication number	US-2016160343-A1
Application number	US-201414905123-A
Country	US
Kind code	A1
Filing date	Jun 25, 2014
Priority date	Aug 6, 2013
Publication date	Jun 9, 2016
Grant date	—

Abstract

Provided is a film deposition device including a DMS target and a film-deposition power source, being capable of pre-sputtering the target by use of the film-deposition power source. The film deposition device includes: a film deposition chamber ( 10 ); first and second cathodes ( 20 A, 20 B) each having a target ( 24 ) and disposed next to each other in such an attitude that target surfaces ( 24 a ) faces a substrate in the film deposition chamber ( 10 ); a magnetic-field formation unit ( 30 ) forming a magnetic field in the vicinity of the surfaces ( 24 a ) of both targets ( 24 ); a film-deposition power source ( 40 ) connected to both of the cathodes ( 20 A, 20 B); and a shutter ( 50 ). The shutter ( 50 ) makes an opening-closing action between a close portion at which the shutter ( 50 ) is interposed between the substrate and the target surfaces ( 24 a ) of both cathodes to block the target surfaces ( 24 a ) collectively from the substrate and an open position to allow film deposition on the substrate through opening the space between the target surfaces ( 24 a ) and the substrate.

First claim

1 . A film deposition device, comprising:
a film deposition chamber that accommodates a substrate at a specific position; a first cathode and a second cathode each having a target, the first cathode and the second cathode being disposed next to each other in such an attitude that respective surfaces of the targets face the substrate disposed at the specific position; a magnetic-field formation unit that forms a magnetic field for magnetron sputtering in the vicinity of the surfaces of the respective targets of the first and second cathodes; a film-deposition power source that is connected to the first and second cathodes to apply voltage to the first and second cathodes; and a shutter capable of making an opening-closing action between a close portion at which the shutter is interposed between the substrate and the surfaces of the respective targets of the first and second cathodes to block the surfaces of the respective targets of the first cathode and the second cathode, collectively, from the substrate and an open position at which the shutter opens the space between the substrate and the surfaces of the respective targets of the first and second cathodes to allow film deposition on a surface of the substrate to be performed by the targets.

2 . The film deposition device according to claim 1 , wherein the first and second cathodes are disposed so as to orient the surfaces of the respective targets of the first and second cathodes in the same direction.

3 . The film deposition device according to claim 1 , wherein the shutter includes a pair of opening-closing members juxtaposed in the same direction as a juxtaposition direction in which the targets of the first and second cathodes are juxtaposed, each of the opening-closing members being supported by the film deposition chamber so as to be able to make a rotational movement about a rotational axis perpendicular to the juxtaposition direction to move between the open position and the close portion through the rotational movement.

4 . The film deposition device according to claim 3 , wherein the rotational axes are set at respective positions on the side opposite to the opening-closing members across the first and second cathodes.

5 . The film deposition device according to claim 1 , wherein a set of the first cathode, the second cathode and the shutter is provided at each of opposite positions opposite to each other across the substrate, in the film deposition chamber.

6 . The film deposition device according to claim 1 , further comprising, in addition to the first and second cathodes, a film deposition unit disposed in the film deposition chamber to execute film deposition different from sputtering performed by the first and second cathodes.

7 . The film deposition device according to claim 6 , wherein a set of the first cathode, the second cathode and the shutter is provided at each of opposite positions opposite to each other across the substrate, in the film deposition chamber, and wherein the film deposition unit is disposed at a different position different from the opposite positions, the different position surrounding the substrate together with the first and second cathodes.

Assignees

• Kobe Steel Ltd

Inventors

• Hirota Satoshi

Classifications

• H01J37/3405

  Magnetron sputtering · CPC title

• H01J37/345

  Magnet arrangements in particular for cathodic sputtering apparatus (material of magnets or magnets in general H01F1/00, H01F7/00) · CPC title

• H01J37/3447

  Collimators, shutters, apertures · CPC title

• C23C14/352 Primary

  using more than one target (C23C14/56 takes precedence) · CPC title

• C23C14/35 Primary

  by application of a magnetic field, e.g. magnetron sputtering {(C23C14/3457 takes precedence)} · CPC title