Laminated Ceramic Capacitor
US-2015380165-A1 · Dec 31, 2015 · US
US2016159696A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016159696-A1 |
| Application number | US-201414560620-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 4, 2014 |
| Priority date | Dec 4, 2014 |
| Publication date | Jun 9, 2016 |
| Grant date | — |
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A method of manufacturing a ceramic assembly by assembling a plurality of green ceramic components, includes: subsequently mounting each of the plurality of green ceramic components on a heat resistant substrate made of a heat resistant material; bonding the plurality of green ceramic components mounted on the substrate with each other; and introducing a ceramic assembly formed by the plurality of green ceramic components bonded with each other into a sintering furnace while being mounted on the heat resistant substrate.
Opening claim text (preview).
What is claimed is: 1 . A method of manufacturing a ceramic assembly by assembling a plurality of green ceramic components, comprising: subsequently mounting each of the plurality of green ceramic components on a heat resistant substrate made of a heat resistant material; bonding the plurality of green ceramic components mounted on the substrate with each other; and introducing a ceramic assembly formed by the plurality of green ceramic components bonded with each other into a sintering furnace while being mounted on the heat resistant substrate. 2 . The method of manufacturing the ceramic assembly according to claim 1 , wherein the heat resistant material is carbon. 3 . The method of manufacturing the ceramic assembly according to claim 1 , further comprising: impregnating silicon or aluminium on a surface of the ceramic assembly after being sintered in the sintering furnace. 4 . The method of manufacturing the ceramic assembly according to claim 1 , wherein the heat resistant substrate is provided with a positioning portion that determines a mounting position of at least one of the green ceramic components. 5 . The method of manufacturing the ceramic assembly according to claim 1 , wherein the heat resistant substrate is provided with a holding member that holds at least one of the green ceramic components. 6 . The method of manufacturing the ceramic assembly according to claim 5 , wherein the holding member is made of carbon that is fixed on the heat resistant substrate. 7 . The method of manufacturing the ceramic assembly according to claim 5 , wherein the holding member or the heat resistant substrate is provided with a pocket so that, when bonding two of the green ceramic components that are mounted on the heat resistant substrate by binder solution, a bonding portion of the two of the green ceramic components does not contact the respective holding member or the heat resistant substrate. 8 . The method of manufacturing the ceramic assembly according to claim 5 , wherein the holding member includes a fitting portion that fits an outer concave portion of the green ceramic component. 9 . The method of manufacturing the ceramic assembly according to claim 8 , wherein the outer concave portion is provided with a mounting surface by which a position of a component to be mounted is set. 10 . The method of manufacturing the ceramic assembly according to claim 9 , wherein the component to be mounted is a camera. 11 . The method of manufacturing the ceramic assembly according to claim 9 , wherein the mounting surface has a predetermined inclined angle with respect to a base plane of the green ceramic component. 12 . The method of manufacturing the ceramic assembly according to claim 1 , wherein the heat resistant substrate is mounted on a base made of metal that is provided with a holding member made of metal and fixed to the base, the holding member further being provided with an arm member that is fixed to the holding member and supports at least one of the green ceramic components by contacting inside and outside of the respective green ceramic component. 13 . The method of manufacturing the ceramic assembly according to claim 12 , wherein the heat resistant substrate is a carbon substrate.
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