Highly reflective flip chip led die

Patent metadata

Field	Value
Publication number	US-2016155901-A1
Application number	US-201414905959-A
Country	US
Kind code	A1
Filing date	Jul 2, 2014
Priority date	Jul 18, 2013
Publication date	Jun 2, 2016
Grant date	—

Abstract

An LED die ( 40 ) includes an N-type layer ( 18 ), a P-type layer ( 22 ), and an active layer ( 20 ) epitaxially grown over a first surface of a transparent growth substrate ( 46 ). Light is emitted through a second surface of the substrate opposite the first surface and is wavelength converted by a phosphor layer ( 30 ). Openings ( 42, 44 ) are etched in the central areas ( 42 ) and along the edge ( 44 ) of the die to expose the first surface of the substrate ( 46 ). A highly reflective metal ( 50 ), such as silver, is deposited in the openings and insulated from the metal P-contact. The reflective metal may conduct current for the N-type layer by being electrically connected to an exposed side of the N-type layer along the inside edge of each opening. The reflective metal reflects downward light emitted by the phosphor layer to improve efficiency. The reflective areas provided by the reflective metal may form 10 %- 50 % of the die area.

First claim

What is claimed is:

1 . A light emitting diode (LED) die structure comprising:
LED semiconductor layers including an N-type layer, a P-type layer, and an active layer that emits light; a growth substrate having a first surface and a second surface opposing the first surface; the N-type layer, the P-type layer, and the active layer being grown on the first surface; the N-type layer, the P-type layer, and the active layer being arranged so that at least a portion of the light generated by the active layer enters the first surface of the substrate and exits through the second surface of the substrate; a wavelength conversion layer overlying the second surface of the substrate; the LED semiconductor layers having one or more openings distributed around the central portion of the die and at least one of the openings exposing the first surface of the substrate; and a reflective material deposited in the one or more openings and covering at least a portion of the first surface of the substrate so as to reflect light from the wavelength conversion layer.

2 . The structure of claim 1 wherein the reflective material is a metal directly contacting the substrate.

3 . The structure of claim 2 wherein the reflective material conducts current for the N-type layer.

4 . The structure of claim 2 wherein the reflective material is electrically insulated from the N-type layer.

5 . The structure of claim 1 further comprising one or more openings along an edge of the LED die.

6 . (canceled)

7 . The structure of claim 1 wherein the opening along the central portion of the LED die forms a cross shape.

8 . The structure of claim 1 wherein the one or more openings comprise openings distributed across the LED die.

9 . The structure of claim 7 wherein the one or more openings further comprises an opening along an edge of the LED die.

10 . The structure of claim 1 wherein the one or more openings comprise openings distributed across the LED die, the structure further comprising an N-contact metal ring along an edge of each of the openings distributed across the LED die, but not in a central area of the openings, for electrically connecting the reflective material to the N-type layer.

11 . The structure of claim 1 wherein the one or more openings comprise openings distributed across the LED die, the structure further comprising electrical contact areas between the N-type layer and the reflective material along an edge of each of the openings distributed across the LED die, but not in a central area of the openings, for electrically connecting the reflective material to the N-type layer.

12 . The structure of claim 1 wherein the one or more openings comprise an opening in a central portion of the LED die, the structure further comprising a continuous electrical contact area between the N-type layer and the reflective material along an edge of the opening, but not in a central area of the opening, for electrically connecting the reflective material to the N-type layer.

13 . The structure of claim 1 wherein the one or more openings comprise an opening along an edge of the LED die, the structure further comprising a continuous electrical contact area between the N-type layer and the reflective material along an inner edge of the opening, but not in a central area of the opening, for electrically connecting the reflective material to the N-type layer.

14 . The structure of claim 1 wherein the reflective material comprises Ag.

15 . The structure of claim 1 wherein the reflective material is a first metal layer electrically contacting the N-type layer, the structure further comprising a second metal layer electrically contacting the P-type layer, wherein the first metal layer and second metal layer terminate in anode and cathode electrodes on a bottom surface of the LED die.

16 . The structure of claim 1 wherein the wavelength conversion layer is a phosphor layer also formed over side walls of the substrate.

17 . The structure of claim 1 further comprising a reflector formed over side walls of the substrate.

18 . The structure of claim 1 wherein the reflective material comprises a dielectric stack forming a distributed Bragg reflector.

19 . The structure of claim 1 further comprising a dielectric layer between the substrate and the reflective material.

20 . A light emitting diode (LED) die structure comprising:
LED semiconductor layers including an N-type layer, a P-type layer, and an active layer that emits light; a growth substrate having a first surface and a second surface opposing the first surface; the N-type layer, the P-type layer, and the active layer being grown on the first surface; the N-type layer, the P-type layer, and the active layer being arranged so that at least a portion of the light generated by the active layer enters the first surface of the substrate and exits through the second surface of the substrate; a wavelength conversion layer overlying the second surface of the substrate; the LED semiconductor layers having one or more openings distributed around the central portion of the die and at least one of the openings exposing the N-type layer; a dielectric layer formed over the exposed N-type layer; and a reflective material deposited in the one or more openings over the dielectric layer so as to reflect light from the wavelength conversion layer.

Assignees

• Koninkl Philips Nv

Inventors

• Lopez Toni
• Choy Kwong-Hin Henry

Classifications

• H10H20/8312

  extending at least partially through the bodies · CPC title

• H10H20/833

  Transparent materials · CPC title

• H10H20/034

  of coatings · CPC title

• H10H20/8512

  Wavelength conversion materials · CPC title

• H10H20/841

  Reflective coatings, e.g. dielectric Bragg reflectors · CPC title