Wavelength conversion member, method for manufacturing the same, and light emitting device

Patent metadata

Field	Value
Publication number	US-2016149097-A1
Application number	US-201514947006-A
Country	US
Kind code	A1
Filing date	Nov 20, 2015
Priority date	Nov 21, 2014
Publication date	May 26, 2016
Grant date	—

Abstract

A method for manufacturing a wavelength conversion member includes: forming a phosphor layer on a base body including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and forming a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and having a same oxide material as the oxide particles. A wavelength conversion member includes: a base body, a phosphor layer disposed on the base body and including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and including a same oxide material as the oxide particles.

First claim

What is claimed is:

1 . A method for manufacturing a wavelength conversion member comprising:
forming a phosphor layer on a base body, the phosphor layer including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and forming a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and having a same oxide material as the oxide particles.

2 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the forming of the phosphor layer includes forming the phosphor layer by preparing a paste in which the phosphor particles and the oxide particles are mixed with in an organic solvent and a resin, and applying the past by printing over the base body.

3 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the oxide particles have a smaller particle size than the phosphor particles.

4 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the phosphor particles have an average size of 0.1 to 50 μm, and the cover layer has an average thickness of 1 nm to 50 μm.

5 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the cover layer is made from at least one of Al 2 O 3 , SiO 2 , ZrO 2 , HfO 2 , TiO 2 , ZnO, Ta 2 O 5 , Nb 2 O 5 , In 2 O 3 and SnO 2 .

6 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the forming of the cover layer includes forming the cover layer by ALD.

7 . The method for manufacturing the wavelength conversion member according to claim 1 , wherein
the forming of the cover layer includes forming the cover layer by sol-gel method.

8 . A wavelength conversion member comprising:
a base body: a phosphor layer disposed on the base body and including phosphor particles and oxide particles affixed to surfaces of the phosphor particles; and a cover layer covering the surfaces of the phosphor particles and surfaces of the oxide particles continuously, and including a same oxide material as the oxide particles.

9 . The wavelength conversion member according to claim 8 , wherein
the phosphor particles are in contact via the oxide particles.

10 . The wavelength conversion member according to claim 8 , wherein
the oxide particles have a smaller particle size than the phosphor particles.

11 . The wavelength conversion member according to claim 8 , wherein
the phosphor particles have an average size of 0.1 to 50 μm, and the cover layer has an average thickness of 1 nm to 50 μm.

12 . The wavelength conversion member according to claim 8 , wherein
the cover layer is made from at least one of Al 2 O 3 ,SiO 2 , ZrO 2 , HfO 2 , TiO 2 , ZnO, Ta 2 O 5 , Nb 2 O 5 , In 2 O 3 and SnO 2 .

13 . The wavelength conversion member according to claim 8 , wherein
the cover layer has an uneven surface attributable to at least the phosphor layer.

14 . The wavelength conversion member according to claim 8 , further comprising a second cover layer with a higher thermal conductivity than the cover layer.

15 . The wavelength conversion member according to claim 8 , wherein
the second cover layer is formed of nitride.

16 . A light emitting device comprising:
a light emitting element; and the wavelength conversion member according to claim 8 disposed so as to cover a light emission face of the light emitting element.

Assignees

• Nichia Corp

Inventors

• Saka Naoki
• Kawamata Jun
• Niki Isamu

Classifications

• H10H20/0361

  of wavelength conversion means · CPC title

• C23C16/45525

  Atomic layer deposition [ALD] · CPC title

• C23C16/4417

  Methods specially adapted for coating powder · CPC title

• C23C16/403

  of aluminium, magnesium or beryllium · CPC title

• H10H20/8511 Primary

  characterised by their material, e.g. binder · CPC title