Resin containing oxetane and epoxy groups and resin composition including the same

Patent metadata

Field	Value
Publication number	US-2016145387-A1
Application number	US-201514602889-A
Country	US
Kind code	A1
Filing date	Jan 22, 2015
Priority date	Nov 24, 2014
Publication date	May 26, 2016
Grant date	—

Abstract

A resin containing oxetane and epoxy groups is provided, being formed by reacting (a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound. The mono-oxetane with a hydroxyl group has a structure:

wherein R 1 is H, C 1-6 alkyl group, C 1-6 fluoroalkyl group, alkenyl group, or phenyl group, and R 2 is C 1-6 alkylene group or vinyl ether group.

First claim

What is claimed is:

1 . A resin containing oxetane and epoxy groups, being formed by reacting:
(a) a product of reacting 1 part by mole of a mono-oxetane with a hydroxyl group and 1.1 to 2.5 parts by mole of anhydride, and (b) 2.1 to 4.2 parts by mole of a diepoxy compound.

2 . The resin as claimed in claim 1 , wherein the mono-oxetane with a hydroxyl group has a structure:

wherein R 1 is H, C 1-6 alkyl group, C 1-6 fluoroalkyl group, alkenyl group, or phenyl group, and
R 2 is C 1-6 alkylene group or vinyl ether group.

3 . The resin as claimed in claim 1 , wherein the mono-oxetane with a hydroxyl group has a structure:

4 . The resin as claimed in claim 1 , wherein the anhydride has a structure:

wherein R 3 is

or a combination thereof,
each R 4 is independently of H, C 1-16 alkyl group, or C 1-16 alkyl group where a —CH 2 group is substituted by oxygen, ethylene group, carbonyl group, carboxyl group, cyclohexyl group, or phenyl group;
wherein

5 . The resin as claimed in claim 1 , wherein the anhydride has a structure:

6 . The resin as claimed in claim 1 , wherein the diepoxy compound is

or a combination thereof;
wherein R 5 is

wherein z1 is an integer of 0 to 3;
R 6 is

wherein z2 is a positive integer of 1 to 4.

7 . The resin as claimed in claim 1 , wherein the diepoxy compound is

8 . The resin as claimed in claim 1 , being:

or a combination thereof,
wherein R 1 is H, C 1-6 alkyl group, C 1-6 fluoroalkyl group, alkenyl group, or phenyl group;
R 2 is C 1-6 alkylene group or vinyl ether group;
R 3 is

or a combination thereof,
each R 4 is independently of H, C 1-16 alkyl group, or C 1-16 alkyl group where a —CH 2 group is substituted by oxygen, ethylene group, carbonyl group, carboxyl group, cyclohexyl group, or phenyl group;

R 5 is

R 6 is

wherein z1 is an integer of 0 to 3, z2 is a positive integer of 1 to 4, m1 is a positive integer greater than 1, n1 is a positive integer greater than 1, m2 is a positive integer greater than 1, and n2 is a positive integer greater than 1.

9 . The resin as claimed in claim 1 , having a viscosity of 50 Pa·s to 1,100 Pa·s at room temperature.

10 . A resin composition, comprising:
100 parts by weight of the resin as claimed in claim 1 ; and 1 to 10 parts by weight of a curing agent.

11 . The resin composition as claimed in claim 10 , wherein the curing agent comprises UV cationic initiator, thermal cationic initiator, or thermal anionic initiator.

12 . The resin composition as claimed in claim 10 , further comprising 0.1 to 30 parts by weight of an additive.

13 . The resin composition as claimed in claim 12 , wherein the additive comprises filler, defoamer, leveling agent, or a combination thereof.

14 . The resin composition as claimed in claim 10 , wherein the mono-oxetane with a hydroxyl group has a structure:

wherein R 1 is H, C 1-6 alkyl group, C 1-6 fluoroalkyl group, alkenyl group, or phenyl group, and
R 2 is C1-6 alkylene group or vinyl ether group.

15 . The resin composition as claimed in claim 10 , wherein the mono-oxetane with a hydroxyl group has a structure:

16 . The resin composition as claimed in claim 10 , wherein the anhydride has a structure:

R 3 is

or a combination thereof,
each R 4 is independently of H, C 1-16 alkyl group, or C 1-16 alkyl group where a —CH 2 group is substituted by oxygen, ethylene group, carbonyl group, carboxyl group, cyclohexyl group, or phenyl group;
wherein

17 . The resin composition as claimed in claim 10 , wherein the anhydride has a structure:

18 . The resin composition as claimed in claim 10 , wherein the diepoxy compound is

19 . The resin composition as claimed in claim 10 , being:

or a combination thereof,
wherein R 1 is H, C 1-6 alkyl group, C 1-6 fluoroalkyl group, alkenyl group, or phenyl group;
R 2 is C 1-6 alkylene group or vinyl ether group;
R 3 is

or a combination thereof,
each R 4 is independently of H, C 1-16 alkyl group, or C 1-16 alkyl group where a —CH 2 group is substituted by oxygen, ethylene group, carbonyl group, carboxyl group, cyclohexyl group, or phenyl group;

R 5 is

R 6 is

wherein z1 is an integer of 0 to 3, z2 is a positive integer of 1 to 4, m1 is a positive integer greater than 1, n1 is a positive integer greater than 1, m2 is a positive integer greater than 1, and n2 is a positive integer greater than 1.

20 . The resin composition as claimed in claim

Assignees

• Ind Tech Res Inst

Inventors

• Shieh Tien-Shou

Classifications

• C08G65/18

  Oxetanes · CPC title

• C08G65/22

  Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring · CPC title

• C08G59/1438 Primary

  containing oxygen · CPC title

• C08G67/04 Primary

  Polyanhydrides · CPC title

• H01L51/0035

  Electricity · mapped topic