Coil component and method of manufacturing coil component
US-2015380152-A1 · Dec 31, 2015 · US
Inductor manufacturing method
US2016141101A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016141101-A1 |
| Application number | US-201514834635-A |
| Country | US |
| Kind code | A1 |
| Filing date | Aug 25, 2015 |
| Priority date | Nov 13, 2014 |
| Publication date | May 19, 2016 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
A method of manufacturing an inductor, includes: forming a coil pattern on a substrate by forming a conductive pattern on the substrate then growing the conductive pattern by plating; removing, if a plating residue is adhering to the coil pattern, the plating residue from the coil pattern; and outputting a cleaning request alarm that requests a plating bath to be cleaned if a number of times the plating residue has been removed or an amount of plating residue that has been removed exceeds a first threshold.
First claim
Opening claim text (preview).
What is claimed is: 1 . A method of manufacturing an inductor, comprising: forming a coil pattern on a substrate by forming a conductive pattern on the substrate then growing the conductive pattern by plating; removing, if a plating residue is adhering to the coil pattern, the plating residue from the coil pattern; and outputting a cleaning request alarm that requests a plating bath to be cleaned if a number of times the plating residue has been removed or an amount of plating residue that has been removed exceeds a first threshold. 2 . The method according to claim 1 , further comprising cleaning the plating bath if the cleaning request alarm is output in the outputting. 3 . The method according to claim 1 , further comprising issuing an inspection request alarm that requests the plating bath to be inspected if a frequency at which the cleaning request alarm is output in the outputting exceeds a second threshold. 4 . The method according to claim 1 , further comprising providing a through-hole between adjacent conductors of coil patterns, the through-hole passing through the substrate in a thickness direction of the substrate, wherein in the removing, the plating residue adhering to the coil pattern is dropped into the through-hole. 5 . The method according to claim 1 , wherein in the providing, the through-hole is formed along the coil pattern.
Assignees
Inventors
Classifications
- H01F41/041Primary
Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title
Electroplating characterised by the process; Pretreatment or after-treatment of workpieces · CPC title
by thin film techniques · CPC title
Process control or regulation (controlling or regulating in general G05) · CPC title
by electroless plating (adhesives therefor H05K3/387) · CPC title
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- What does patent US2016141101A1 cover?
- A method of manufacturing an inductor, includes: forming a coil pattern on a substrate by forming a conductive pattern on the substrate then growing the conductive pattern by plating; removing, if a plating residue is adhering to the coil pattern, the plating residue from the coil pattern; and outputting a cleaning request alarm that requests a plating bath to be cleaned if a number of times th…
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01F41/041. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu May 19 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).