Heat dissipation structure of wearable electronic device

Patent metadata

Field	Value
Publication number	US-2016135328-A1
Application number	US-201414571299-A
Country	US
Kind code	A1
Filing date	Dec 16, 2014
Priority date	Nov 10, 2014
Publication date	May 12, 2016
Grant date	—

Abstract

A heat dissipation structure of wearable electronic device includes a wearable main body and a wearable strap body connected with the wearable main body. The wearable main body includes a receiving space, a circuit board and multiple electronic components arranged on the circuit board. At least one of the electronic components is a heat source. The wearable strap body has a heat conduction section and a protection section enclosing the heat conduction section. A section of the heat conduction section is exposed to an interior of the receiving space without being enclosed by the protection section. The exposed section of the heat conduction section is in contact with the corresponding heat source on the circuit board so as to greatly enhance the heat dissipation performance of the wearable electronic device.

First claim

What is claimed is:

1 . A heat dissipation structure of wearable electronic device comprising:
a wearable main body including a receiving space, a circuit board and multiple electronic components, the electronic components being arranged on the circuit board, the circuit board with the electronic components being received in the receiving space, at least one of the electronic components being a heat source; and a wearable strap body connected with the wearable main body, the wearable strap body having a heat conduction section and a protection section, the protection section enclosing the heat conduction section, a section of the heat conduction section being exposed to an interior of the receiving space without being enclosed by the protection section, the exposed section of the heat conduction section being in contact with the corresponding heat source.

2 . The heat dissipation structure of wearable electronic device as claimed in claim 1 , wherein the heat conduction section has a first heat conduction layer, a second heat conduction layer and a third heat conduction layer, the second heat conduction layer being sandwiched between the first and third heat conduction layers, an outer face of the first heat conduction layer of the exposed section of the heat conduction section in the receiving space being attached to the heat source.

3 . The heat dissipation structure of wearable electronic device as claimed in claim 2 , wherein the first and third heat conduction layers are made of metal foils and the second heat conduction layer is made of graphite material, the protection section being made of flexible plastic material.

4 . The heat dissipation structure of wearable electronic device as claimed in claim 1 , wherein the heat conduction section is a heat pipe made of flexible metal material, the heat conduction section having a chamber and a capillary structure, a working fluid being filled in the chamber, the capillary structure being formed on inner wall face of the chamber, one face of the exposed section of the heat conduction section in the receiving space being attached to the heat source, the protection section being made of flexible plastic material or hard plastic material.

5 . The heat dissipation structure of wearable electronic device as claimed in claim 1 , wherein the heat conduction section is a heat pipe made of hard metal material, the heat conduction section having a chamber and a capillary structure, a working fluid being filled in the chamber, the capillary structure being formed on inner wall face of the chamber, one face of the exposed section of the heat conduction section in the receiving space being attached to the heat source, the protection section being made of hard plastic material.

6 . The heat dissipation structure of wearable electronic device as claimed in claim 1 , wherein the heat conduction section has a first heat conduction body and a second heat conduction body and the protection section has a first protection body and a second protection body, the first and second protection bodies respectively enclosing the first and second heat conduction bodies, a section of the first and second heat conduction bodies being exposed to an interior of the receiving space without being enclosed by the first and second protection bodies, the exposed sections of the first and second heat conduction bodies being opposite to each other, the battery in the receiving space being positioned under the exposed sections of the first and second heat conduction bodies.

7 . The heat dissipation structure of wearable electronic device as claimed in claim 6 , wherein the wearable main body further includes a conduction section received in the receiving space and positioned on upper sides of the first and second heat conduction bodies, two opposite sides of one face of the conduction section respectively contacting one face of the corresponding exposed sections of the first and second heat conduction bodies, the other face of the conduction section being attached to the heat source on the circuit board.

8 . The heat dissipation structure of wearable electronic device as claimed in claim 7 , wherein each of the first and second heat conduction bodies has a first heat conduction layer, a second heat conduction layer and a third heat conduction layer, the second heat conduction layer of the first heat conduction body being sandwiched between the first and third heat conduction layers of the first heat conduction body, the second heat conduction layer of the second heat conduction body being sandwiched between the first and third heat conduction layers of the second heat conduction body.

9 . The heat dissipation structure of wearable electronic device as claimed in claim 8 , wherein the first and third heat conduction layers of the first and second heat conduction bodies are made of metal foils and the second heat conduction layers of the first and second heat conduction bodies are made of graphite material, the first and second protection bodies being made of flexible plastic material.

10 . The heat dissipation structure of wearable electronic device as claimed in claim 7 , wherein the heat conduction section is a vapor chamber, the heat conduction section having a chamber, a capillary structure and multiple support columns, a working fluid being filled in the chamber, the capillary structure being formed on inner wall face of the chamber, the support columns being received in the chamber, top ends and bottom ends of the support columns respectively abutting against upper and lower walls of the chamber.

11 . The heat dissipation structure of wearable electronic device as claimed in claim 7 , wherein the first and second heat conduction bodies are heat pipes made of flexible metal material, each of the first and second heat conduction bodies having a chamber and a capillary structure, a working fluid being filled in the chamber of each of the first and second heat conduction bodies, the capillary structure being formed on inner wall face of the chamber of each of the first and second heat conduction bodies, the first and second protection bodies being made of flexible plastic material or hard plastic material.

12 . The heat dissipation structure of wearable electronic device as claimed in claim 7 , wherein the first and second heat conduction bodies are heat pipes made of hard metal material, each of the first and second heat conduction bodies having a chamber and a capillary structure, a working fluid being filled in the chamber of each of the first and second heat conduction bodies, the capillary structure being formed on inner wall face of the chamber of each of the first and second heat conduction bodies, the first and second protection bodies being made of hard plastic material.

13 . The heat dissipation structure of wearable electronic device as claimed in claim 2 , wherein the wearable main body includes a touch display module, a battery, an upper frame body and a lower frame body, the upper frame body being mated with the lower frame body to cover the lower frame body, the upper frame body receiving the touch display module therein, the touch display module having a touch display face and a bottom face, the bottom face facing the circuit board, the lower frame body being formed with the receiving space and multiple recesses, a central section of one face of the lower frame body being recessed to form the receiving space, the recesses being formed on two opposite sides of one face of the lower frame body in adjacency to and in communication with the receiving space, the exposed section of the heat conduction section being bridged over the receiv

Assignees

• Asia Vital Components Co Ltd

Inventors

• Wu Chun-Ming

Classifications

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• G06F1/1643 Primary

  the display being associated to a digitizer, e.g. laptops that can be used as penpads (details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615) · CPC title

• G06F1/163

  Wearable computers, e.g. on a belt · CPC title

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• G06F1/1635

  Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter · CPC title