Method of producing an optoelectronic component

Patent metadata

Field	Value
Publication number	US-2016133808-A1
Application number	US-201414900699-A
Country	US
Kind code	A1
Filing date	Jun 25, 2014
Priority date	Jun 27, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

A method of manufacturing an optoelectronic component includes providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.

First claim

1 - 15 . (canceled)

16 . A method of manufacturing an optoelectronic component comprising:
providing a leadframe; embedding the leadframe into a plastic material by a molding process to form a casing body; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe.

17 . The method as claimed in claim 16 , wherein the reshaping is effected after the molding process before the plastic material is completely set.

18 . The method as claimed in claim 16 , wherein the reshaping is effected after the casing body is deflashed.

19 . The method as claimed in claim 16 , wherein the reshaping is effected by exerting a mechanical force on the plastic material.

20 . The method as claimed in claim 19 , wherein the force is exerted on the plastic material by a plunger.

21 . The method as claimed in claim 20 , wherein the leadframe is embedded into the plastic material in a mold tool, and the plunger forms part of the mold tool.

22 . The method as claimed in claim 16 , wherein the molding process is a transfer molding or injection molding process.

23 . The method as claimed in claim 16 ,
wherein the leadframe has a first leadframe section and a second leadframe section, the first leadframe section and the second leadframe section are physically separate from one another, and the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval.

24 . The method as claimed in claim 23 , wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.

25 . The method as claimed in claim 19 ,
wherein the first leadframe section has a first solder contact pad and the second leadframe section has a second solder contact pad, the first leadframe section and the second leadframe section are embedded into the plastic material such that the first solder contact pad and the second solder contact pad remain at least partially uncovered by the plastic material, and the plastic material is reshaped by exerting a mechanical force on a region of the plastic material arranged between the first solder contact pad and the second solder contact pad.

26 . The method as claimed in claim 25 ,
wherein the first leadframe section has a chip holding area, and the first leadframe section is embedded into the plastic material such that the chip holding area remains at least partially uncovered by the plastic material.

27 . The method as claimed in claim 26 , further comprising arranging an optoelectronic semiconductor chip on the chip holding area.

28 . The method as claimed in claim 26 , further comprising arranging a sealing material in the cavity, wherein the casing body is produced with a cavity adjoining the chip holding area.

29 . The method as claimed in claim 25 ,
wherein the second leadframe section has a bonding pad, and the second leadframe section is embedded into the plastic material such that the bonding pad remains at least partially uncovered by the plastic material.

30 . The method as claimed in claim 27 , further comprising arranging a bonding wire between the optoelectronic semiconductor chip and the bonding pad.

31 . A method of manufacturing an optoelectronic component comprising:
providing a leadframe, wherein the leadframe has a first leadframe section and a second leadframe section, and the first leadframe section and the second leadframe section are physically separate from one another; embedding the leadframe into a plastic material by a molding process to form a casing body, wherein the first leadframe section and the second leadframe section are embedded into the plastic material at a physical interval; and reshaping of the plastic material to at least partially close a gap between the plastic material and the leadframe, wherein the plastic material is reshaped in a region arranged between the first leadframe section and the second leadframe section.

32 . The method as claimed in claim 29 , further comprising arranging a bonding wire between the optoelectronic semiconductor chip and the bonding pad.

33 . The method as claimed in claim 24 ,
wherein the first leadframe section has a first solder contact pad and the second leadframe section has a second solder contact pad, the first leadframe section and the second leadframe section are embedded into the plastic material such that the first solder contact pad and the second solder contact pad remain at least partially uncovered by the plastic material, and the plastic material is reshaped by exerting a mechanical force on a region of the plastic material arranged between the first solder contact pad and the second solder contact pad.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Brandl Martin
• Gebuhr Tobias

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• B29C45/14655 Primary

  connected to or mounted on a carrier, e.g. lead frame · CPC title