Optoelectronic component and method of producing same

Patent metadata

Field	Value
Publication number	US-2016240756-A1
Application number	US-201415022573-A
Country	US
Kind code	A1
Filing date	Sep 18, 2014
Priority date	Sep 23, 2013
Publication date	Aug 18, 2016
Grant date	—

Abstract

An optoelectronic component includes a housing including a plastic material and a first lead frame section at least partly embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chips is arranged in the second recess.

First claim

1 - 13 . (canceled)

14 . An optoelectronic component comprising a housing comprising:
a plastic material and a first lead frame section at least partially embedded in the plastic material, a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, and no optoelectronic semiconductor chip is arranged in the second recess.

15 . The optoelectronic component as claimed in claim 14 ,
wherein a first lower section of a lower side of the first lead frame section is not covered by the plastic material, and the first lower section overlaps the first upper section in a projection perpendicular to the first lead frame section.

16 . The optoelectronic component as claimed in claim 14 ,
wherein a second lower section of a lower side of the first lead frame section is not covered by the plastic material, and the second lower section overlaps the second upper section in a projection perpendicular to the first lead frame section.

17 . The optoelectronic component as claimed in claim 14 , further comprising a second lead frame section at least partially embedded in the plastic material,
wherein a third upper section of an upper side of the second lead frame section is not covered by the plastic material in the first recess.

18 . The optoelectronic component as claimed in claim 17 , wherein the third upper section electrically conductively connects to the optoelectronic semiconductor chip by a bond wire.

19 . The optoelectronic component as claimed in claim 14 , wherein the second upper section of the first lead frame section has a marking.

20 . The optoelectronic component as claimed in claim 14 ,
wherein the optoelectronic component has an optical lens or a cover, and the optical lens or the cover is anchored on the second recess.

21 . An optoelectronic component comprising a housing comprising a plastic material and a first lead frame section at least partially embedded in the plastic material, and
a first recess and a second recess, wherein a first upper section of an upper side of the first lead frame section is not covered by the plastic material in the first recess, a second upper section of the upper side of the first lead frame section is not covered by the plastic material in the second recess, the first recess and the second recess are separated from one another by a section of the plastic material, an optoelectronic semiconductor chip is arranged in the first recess, no optoelectronic semiconductor chip is arranged in the second recess, and the second upper section of the first lead frame section has a marking.

22 . A method of producing an optoelectronic component comprising:
arranging a lead frame in a molding tool, a first part of the molding tool bearing on a first upper section of an upper side of the lead frame; a second part, separated from the first part, of the molding tool bearing on a second upper section of the upper side of the lead frame; embedding the lead frame in a plastic material; and arranging an optoelectronic semiconductor chip only on the first upper section of the upper side of the lead frame, but not on the second upper section.

23 . The method as claimed in claim 22 , further comprising:
applying a marking in the second upper section of the lead frame.

24 . The method as claimed in claim 23 , wherein the marking is applied by etching, embossing, stamping or a laser.

25 . The method as claimed in claim 22 , further comprising checking a functional capacity of the optoelectronic component, the lead frame being electrically contacted in the second upper section during the checking.

26 . The method as claimed in claim 22 , further comprising dividing the plastic material and the lead frame to obtain a multiplicity of optoelectronic components.

27 . The method as claimed in claim 26 , wherein the plastic material and the lead frame are divided along a sawing path extending through the second upper section.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Zitzlsperger Michael
• Ziereis Christian
• Gebuhr Tobias

Classifications

• H10P74/207

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/5434

  the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title