Transfer Mold Type Sensor Device

Patent metadata

Field	Value
Publication number	US-2016131678-A1
Application number	US-201414901358-A
Country	US
Kind code	A1
Filing date	Feb 5, 2014
Priority date	Jun 28, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

To provide a high-reliable transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed, the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

First claim

1 . A transfer mold type sensor device in which a combined sensor including a plurality of sensors having a function of detecting physical amounts, a substrate processing a signal from the combined sensor and controlling a signal input/output with an external device, a chip pad mounted with the combined sensor and the substrate, and a lead frame are sealed with a mold resin and a package is formed,
wherein the combined sensor is configured to be thicker than the substrate and the chip pad, a principal surface side of the combined sensor is covered with the mold resin and a back surface side thereof contacts the substrate by a joint material, and the combined sensor is arranged on a package neutral surface in a cross-section of a thickness direction of the package including the combined sensor, the substrate, and the chip pad.

2 . The transfer mold type sensor device according to claim 1 , wherein the combined sensor, the substrate, and the chip pad are laminated in the thickness direction of the package, such that volumes of the mold resin on and below the package neutral surface are almost equalized.

3 . The transfer mold type sensor device according to claim 1 , wherein the lead frame includes an inner lead portion inside the package and an outer lead portion outside the package and the chip pad mounted with the combined sensor and the substrate and a boundary portion of the inner lead portion and the outer lead portion are positioned at different heights in the thickness direction of the package.

4 . The transfer mold type sensor device according to claim 1 , wherein the substrate is composed of a semiconductor chip.

5 . The transfer mold type sensor device according to claim 1 , wherein the substrate is composed of a printed wiring board provided with a semiconductor chip and a wiring pattern and the semiconductor chip is laminated on the printed wiring board by the joint material.

6 . The transfer mold type sensor device according to claim 1 , wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged on the package neutral surface in the cross-section of the thickness direction of the package including at least the combined sensor, the substrate, and the chip pad.

7 . The transfer mold type sensor device according to claim 1 , wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged in a region where a change rate of package warpage deformation caused by a thermal load applied to the package is small.

8 . The transfer mold type sensor device according to claim 1 , wherein a linear expansion coefficient of the mold resin is set in a range of 7 to 11×10-6/° C.

9 . The transfer mold type sensor device according to claim 1 , wherein a glass transition temperature of the mold resin is equal to or higher than a temperature of the upper limit of a thermal load range applied to the package.

10 . The transfer mold type sensor device according to claim 8 , wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged on the package neutral surface in the cross-section of the thickness direction of the package including at least the combined sensor, the substrate, and the chip pad.

11 . The transfer mold type sensor device according to claim 8 , wherein a sensor having high sensitivity to deformation of the package among a plurality of sensors configuring the combined sensor is arranged in a region where a change rate of package warpage deformation caused by a thermal load applied to the package is small.

12 . The transfer mold type sensor device according to claim 1 , wherein the combined sensor includes a plurality of acceleration sensors and an angular velocity sensor.

Assignees

• Hitachi Automotive Systems Ltd

Inventors

• Yaguchi Akihiro
• Hayashi Masahide
• Ohta Kazunori
• Okamoto Akihiro

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/752

  between stacked chips · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/732

  between stacked chips · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title