Method for manufacturing a microelectromechanical structure and microelectromechanical structure
US-11975964-B2 · May 7, 2024 · US
Method of manufacturing inertial sensor
US9212909B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9212909-B2 |
| Application number | US-201213541279-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 3, 2012 |
| Priority date | Nov 11, 2011 |
| Publication date | Dec 15, 2015 |
| Grant date | Dec 15, 2015 |
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Abstract
Official abstract text for this publication.
Disclosed herein is a method of manufacturing an inertial sensor. The method includes: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate; (C) forming a mass body in the first concave part by filling a metal or a combination of a metal and a polymer (or a polymer matrix composite) therein; and (D) forming a depressed second concave part in one surface of the base substrate at an outer side of the mass body and forming a flexible part on an upper portion of the second concave part in the base substrate. The mass body formed of the metal or the combination of the metal and the polymer (or the polymer matrix composite) has high density, thereby making it possible to improve sensitivity of the inertial sensor.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of manufacturing an inertial sensor, the method comprising: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate and a depressed third concave part in one surface of an edge of the base substrate; (C) forming a mass body and a post in the first concave part and the third concave part, respectively, by filling a metal or a combination of a metal and a polymer or a polymer matrix composit…
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Classifications
Electricity · mapped topic
- G01C19/5769Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
- G01C19/56Primary
Physics · mapped topic
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Frequently asked questions
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- What does patent US9212909B2 cover?
- Disclosed herein is a method of manufacturing an inertial sensor. The method includes: (A) preparing a base substrate; (B) forming a depressed first concave part in one surface of the base substrate; (C) forming a mass body in the first concave part by filling a metal or a combination of a metal and a polymer (or a polymer matrix composite) therein; and (D) forming a depressed second concave pa…
- Who is the assignee on this patent?
- Kim Jong Woon, Lee Jung Won, Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification G01C19/5769. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Dec 15 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).