Heat-resistant adhesive sheet for semiconductor testing

Patent metadata

Field	Value
Publication number	US-2016130481-A1
Application number	US-201414895546-A
Country	US
Kind code	A1
Filing date	Jun 10, 2014
Priority date	Jun 14, 2013
Publication date	May 12, 2016
Grant date	—

Abstract

A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated includes: a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0×10 −5 at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator. The adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer. The adhesive layer is free of tackifying resin.

First claim

1 . A heat-resistant adhesive sheet for semiconductor testing, used in a performance test while semiconductor chips are heated, the heat resistant adhesive sheet comprising:
a base material; and an adhesive layer provided on the base material, the base material having a thermal shrinkage of lower than 1% when being heated at 150 degrees Celsius for 30 minutes and a linear expansion coefficient of equal to or lower than 5.0×10 −5 at 60 to 150 degrees Celsius, and the adhesive layer containing a (meth)acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent, and photoinitiator, wherein: the adhesive layer contains 5 to 200 parts by mass of the photopolymerizable compound, 0.5 to 20 parts by mass of the polyfunctional isocyanate curing agent, and 0.1 to 20 parts by mass of the photoinitiator, with respect to 100 parts by mass of the(meth)acrylic acid ester copolymer; and the adhesive layer is free of tackifying resin.

2 . The heat-resistant adhesive sheet according to claim 1 , wherein the adhesive layer contains a silicone-based graft copolymer.

3 . The heat-resistant adhesive sheet according to claim 1 , wherein the polyfunctional isocyanate curing agent contains three or more isocyanate groups.

4 . The heat-resistant adhesive sheet according to claim 1 , wherein when a temperature of the photoinitiator is increased from 23 degrees Celsius at a rate of 10 degrees Celsius/min, a temperature at which a mass reduction rate of the photoinitiator is 10% is equal to or higher than 250 degree Celsius.

5 . The heat-resistant adhesive sheet according to claim 1 , which is used in a method of manufacturing a semiconductor, the method comprising:
(a) a bonding step of bonding the adhesive sheet to the semiconductor chips; (b) a sticking fast step of sticking the semiconductor chips to which the adhesive sheet is bonded fast to a stage having a temperature of 60 to 150 degrees Celsius while the adhesive sheet contacts the stage; (c) a test step of testing performance of the semiconductor chips while the stage is heated at 60 to 150 degrees Celsius; and (d) a UV irradiation step of irradiating the adhesive sheet with ultraviolet light; and (e) a pick-up step of picking up the semiconductor chips from the adhesive sheet.

6 . The heat-resistant adhesive sheet for semiconductor testing according to claim 1 , which is used for a method of manufacturing a semiconductor, the method comprising:
(a) a bonding step of bonding the adhesive sheet to a semiconductor wafer or a substrate; (b) a dicing step of dicing the semiconductor wafer or the substrate into semiconductor chips; (c) a sticking fast step of sticking the semiconductor chips to which the adhesive sheet is bonded fast to a stage having a temperature of 60 to 150 degrees Celsius while the adhesive sheet contacts the stage; (d) a test step of testing performance of the semiconductor chips while the stage is heated at 60 to 150 degrees Celsius; (e) a UV irradiation step of irradiating the adhesive sheet with ultraviolet light; and (f) a pick-up step of picking up the semiconductor chips from the adhesive sheet.

Assignees

• Denka Company Ltd

Inventors

• Nakajima Gosuke
• TSUKUI Tomoya

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• C09J133/06

  of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical · CPC title

• C09J7/35

  Heat-activated · CPC title

• C09J133/14

  of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen · CPC title