Laminated body

US2016116641A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016116641-A1
Application numberUS-201514920919-A
CountryUS
Kind codeA1
Filing dateOct 23, 2015
Priority dateOct 24, 2014
Publication dateApr 28, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

The present invention relates to a laminated body containing at least (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, in which the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer and the substrate by sputtering using a reactive sputtering gas, and the second metal layer is constituted by an oxide or nitride of a Cu alloy containing at least Zn.

First claim

Opening claim text (preview).

What is claimed is: 1 . A laminated body comprising at least: (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, wherein the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer and the substrate by sputtering using a reactive sputtering gas, wherein the second metal layer is constituted by an oxide or nitride of a Cu alloy comprising at least Zn. 2 . The laminated body according to claim 1 , wherein the second metal layer is overlaid both on the surface of the first metal layer opposite to the substrate and between the first metal layer and the substrate so as to sandwich the first metal layer without interposing the substrate. 3 . The laminated body according to claim 1 , wherein the first metal layer is constituted by a Cu alloy, and the Cu alloy has a composition comprising Zn and at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr, with the balance being Cu and inevitable impurities. 4 . The laminated body according to claim 3 , wherein the Cu alloy constituting the first metal layer has a composition comprising Zn in a content of from 0.1 at % to 10 at % and comprising the at least one element selected from the group consisting of B, Mg, Al, Ca, Ti, and Cr in a total content of from 0.1 at % to 6 at %, with the balance being Cu and inevitable impurities. 5 . The laminated body according to claim 1 , wherein the first metal layer has an electric resistivity of 8.0 μΩ·cm or less. 6 . The laminated body according to claim 1 , wherein the first metal layer is in close contact with the transparent substrate or/and the second metal layer, and a degree of adhesion therebetween is classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999. 7 . The laminated body according to claim 1 , wherein the second metal layer is formed by sputtering using a target material, and the target material is composed of a Cu alloy having a composition comprising Zn with the balance being Cu and inevitable impurities, or a Cu alloy having a composition comprising Zn and at least one element selected from the group consisting of Al, Ti, Sn, and Ni, with the balance being Cu and inevitable impurities. 8 . The laminated body according to claim 1 , wherein the second metal layer has a composition comprising Zn in a content of from 0.1 at % to less than 25 at %, with the balance being Cu, and O or N, and inevitable impurities. 9 . The laminated body according to claim 1 , wherein the second metal layer has a composition comprising Zn in a content of from 0.1 at % to less than 25 at % and at least one element selected from the group consisting of Al, Ti, Sn, and Ni in a total content of from 0.1 at % to less than 15 at %, with the balance being Cu, and O or N, and inevitable impurities. 10 . The laminated body according to claim 7 , wherein the second metal layer is in close contact with the transparent substrate or/and the first metal layer, and a degree of adhesion therebetween is classified as a classification 0 to 3 as defined in JIS K5600-5-6:1999.

Assignees

Inventors

Classifications

  • Oxides (C23C14/10 takes precedence) · CPC title

  • G02B1/116Primary

    including electrically conducting layers · CPC title

  • with at least one oxide layer · CPC title

  • by cathodic sputtering · CPC title

  • Reactive sputtering · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016116641A1 cover?
The present invention relates to a laminated body containing at least (a) a transparent substrate, (b) a first metal layer that is overlaid on the substrate and forms an electrode, and (c) a second metal layer having a light reflectance of 20% or less, in which the second metal layer is overlaid on the surface of the first metal layer opposite to the substrate or between the first metal layer a…
Who is the assignee on this patent?
Daido Steel Co Ltd
What technology area does this patent fall under?
Primary CPC classification G02B1/116. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Apr 28 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).