Electronic device having maximum mounting space on circuit board

Patent metadata

Field	Value
Publication number	US-2016112781-A1
Application number	US-201514882647-A
Country	US
Kind code	A1
Filing date	Oct 14, 2015
Priority date	Oct 15, 2014
Publication date	Apr 21, 2016
Grant date	—

Abstract

An electronic device having a speaker may include: a first housing; a circuit board disposed inside the first housing; and a second housing attached to a top surface of the circuit board, wherein the circuit board includes a first shape sealing line and a second shape sealing line that form a sealing region.

First claim

What is claimed is:

1 . An electronic device having a speaker, comprising:
a first housing; a circuit board disposed inside the first housing, the circuit board having a top surface and a bottom surface; and a second housing coupled to the top surface of the circuit board, wherein the circuit board includes a first shape sealing line that defines a first sealing region configured to receive a speaker module and a second shape sealing line that defines a second sealing region that forms a resonance space.

2 . The electronic device of claim 1 , wherein the first shape sealing line and the second shape sealing line are formed on the top and bottom surfaces of the circuit board, respectively.

3 . The electronic device of claim 2 , wherein the first shape sealing line is formed in a shape that corresponds to that of a speaker module so as to directly mount the speaker module in the first housing and to form the resonance space on the bottom surface of the circuit board.

4 . The electronic device of claim 3 , wherein the first shape sealing line is formed in a shape that includes various shape portions formed by straight lines or curved lines.

5 . The electronic device of claim 1 , wherein the second shape sealing line is formed in a shape that corresponds to that of the second housing in order to form the resonance space on the top surface of the circuit board.

6 . The electronic device of claim 5 , wherein the second shape sealing line includes various shape portions formed by at least one of straight lines and curved lines.

7 . The electronic device of claim 4 , wherein a bottom surface sealing member is formed along a peripheral edge of the first shape sealing line.

8 . The electronic device of claim 6 , wherein a top surface sealing member is formed along a peripheral edge of the second shape sealing line.

9 . The electronic device of claim 1 , further comprising a speaker board, wherein a Z-axis position of the speaker board overlaps a Z-axis position of the speaker.

10 . The electronic device of claim 3 , wherein the speaker module is a half-module speaker.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Minsung
• Choung Taedoo

Classifications

• H04R2201/029

  Manufacturing aspects of enclosures transducers · CPC title

• H04R1/2803 Primary

  for loudspeaker transducers · CPC title

• H04R2499/11

  Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title

• H04R1/021 Primary

  incorporating only one transducer · CPC title

• H05K7/14 Primary

  Mounting supporting structure in casing or on frame or rack · CPC title