Semiconductor package and method for forming the same
US-2026083029-A1 · Mar 19, 2026 · US
Lee Minsung is listed as an inventor on 84 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Minsung |
| Total patents | 84 |
| First publication | Apr 21, 2016 |
| Latest publication | Mar 19, 2026 |
Publications ranked by popularity score, then publication date.
US-2026083029-A1 · Mar 19, 2026 · US
US-2026076244-A1 · Mar 12, 2026 · US
US-12535863-B2 · Jan 27, 2026 · US
US-2026005190-A1 · Jan 1, 2026 · US
US-2026005191-A1 · Jan 1, 2026 · US
US-2025391719-A1 · Dec 25, 2025 · US
US-12500967-B2 · Dec 16, 2025 · US
US-12477673-B2 · Nov 18, 2025 · US
US-12369264-B2 · Jul 22, 2025 · US
US-12273474-B2 · Apr 8, 2025 · US
Latest publications not already listed above.
US-2025093918-A1 · Mar 20, 2025 · US
US-12242309-B2 · Mar 4, 2025 · US
US-12072744-B2 · Aug 27, 2024 · US
US-2024195895-A1 · Jun 13, 2024 · US
US-11997807-B2 · May 28, 2024 · US
US-11966259-B2 · Apr 23, 2024 · US
US-11930127-B2 · Mar 12, 2024 · US
US-11848563-B2 · Dec 19, 2023 · US
US-2023359252-A1 · Nov 9, 2023 · US
US-2023276585-A1 · Aug 31, 2023 · US
US-11726530-B2 · Aug 15, 2023 · US
US-2023251692-A1 · Aug 10, 2023 · US
US-2023209750-A1 · Jun 29, 2023 · US
US-11662781-B2 · May 30, 2023 · US
US-11611141-B2 · Mar 21, 2023 · US
US-2023071540-A1 · Mar 9, 2023 · US
US-2023044990-A1 · Feb 9, 2023 · US
US-2023044949-A1 · Feb 9, 2023 · US
US-2023038719-A1 · Feb 9, 2023 · US
US-11528349-B2 · Dec 13, 2022 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 79 |
| Jcet Stats Chippac Korea Ltd | 5 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F1/1652 | 45 |
| H04M1/0268 | 35 |
| G06F1/1681 | 35 |
| G06F1/1616 | 30 |
| H04M1/022 | 23 |