Plasma Processing Device

Patent metadata

Field	Value
Publication number	US-2016104604-A1
Application number	US-201514699443-A
Country	US
Kind code	A1
Filing date	Apr 29, 2015
Priority date	Oct 13, 2014
Publication date	Apr 14, 2016
Grant date	—

Abstract

A plasma processing device is provided. The plasma processing device includes a plate formed between a window covering a top portion of a chamber where plasma processing is performed and an antenna generating a magnetic field, and a fluid supply unit supplying a fluid for controlling temperatures of the window and the antenna, wherein the plate includes first and second regions supplied with the fluid, and the fluid supply unit independently controls the first and second regions.

First claim

What is claimed is:

1 . A plasma processing device comprising:
a plate formed between a window covering a top portion of a chamber where plasma processing is performed and an antenna generating a magnetic field; and a fluid supply unit configured to supply a fluid that controls a temperature of the window and the antenna, wherein the plate comprises first and second regions configured to receive the fluid, and wherein the fluid supply unit is configured to independently control flow of the fluid in the first and second regions.

2 . The plasma processing device of claim 1 , wherein the first region includes an inlet port through which the fluid flows in and an outlet port through which the fluid flows out.

3 . The plasma processing device of claim 2 , wherein the first region comprises a fluid conduit having one end connected to the inlet port and an opposite end connected to the outlet port.

4 . The plasma processing device of claim 2 , further comprising:
an inlet pipe connecting the inlet port and the fluid supply unit; and an outlet pipe connecting the outlet port and the fluid supply unit.

5 . The plasma processing device of claim 1 , further comprising a clamp connecting the plate and the window.

6 . The plasma processing device of claim 1 , wherein the fluid supply unit is configured to supply a first fluid that lowers temperatures of the window and the antenna and a second fluid that raises the temperature of the window.

7 . The plasma processing device of claim 6 , further comprising a temperature sensor unit configured to sense the temperature of the window, wherein the fluid supply unit receives the temperature of the window from the temperature sensor unit.

8 . The plasma processing device of claim 7 , wherein the fluid supply unit supplies one of the first and second fluids to the plate according to the temperature of the window.

9 . The plasma processing device of claim 1 , further comprising a gas feed configured to supply a processing gas to an inside of the chamber.

10 . The plasma processing device of claim 9 , wherein the gas feed and the plate include the same material.

11 . The plasma processing device of claim 9 , wherein the plate comprises a coupling groove exposing a portion of a top portion of the window, and wherein the gas feed is engaged with the coupling groove.

12 . A plasma processing device comprising:
a plate formed between a window covering a top portion of a chamber where plasma processing is performed and an antenna generating a magnetic field; a temperature sensor unit sensing a temperature of the window; and a fluid supply unit configured to supply a first fluid that lowers a temperature of the window and the antenna and a second fluid that raises the temperature of the window and configured to receive the temperature of the window from the temperature sensor unit, wherein the fluid supply unit supplies one of the first and second fluids to the plate according to the temperature of the window.

13 . The plasma processing device of claim 12 , further comprising:
a clamp connecting the plate and the window and mounted at a lower portion of an edge of the plate; and inlet and outlet pipes connecting the plate and the fluid supply unit.

14 . The plasma processing device of claim 13 , wherein the window includes a slide groove, the clamp includes a slide protrusion engaged with the slide groove, and one end of each of the inlet and outlet pipes is fixed to a top surface of the plate.

15 . The plasma processing device of claim 14 , wherein clamp and the inlet and outlet pipes fix the plate on the window.

16 . A plasma processing device, comprising:
a chamber where plasma processing is performed; a window covering a top portion of the chamber; an antenna configured to generate a magnetic field within the chamber via the window; and a fluid supply unit configured to supply a fluid that controls a temperature of the window and the antenna, wherein the window comprises first and second regions configured to receive the fluid, and wherein the fluid supply unit is configured to independently control flow of the fluid in the first and second regions.

17 . The plasma processing device of claim 16 , wherein each of the first and second regions comprises an inlet port and an outlet port connected by a conduit, wherein an inlet pipe connects the inlet port and the fluid supply unit, and an outlet pipe connects the outlet port and the fluid supply unit, and wherein the fluid flows in from the fluid supply unit through the inlet port and out through the outlet port back to the fluid supply unit.

18 . The plasma processing device of claim 16 , wherein the fluid supply unit is configured to supply a first fluid that lowers respective temperatures of the window and the antenna and a second fluid that raises the temperature of the window, and wherein the fluid supply unit supplies one of the first and second fluids to the window according to the temperature of the window.

19 . The plasma processing device of claim 18 , further comprising a temperature sensor unit configured to sense the temperature of the window, wherein the fluid supply unit receives the temperature of the window from the temperature sensor unit.

20 . The plasma processing device of claim 16 , further comprising a gas feed configured to supply a processing gas to an inside of the chamber.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Hak-Young
• Lee Ji-Myoung
• Kim Ji-Hee
• Sung Doug-Yong
• Jeong Kyeong-Seok
• Choi Seong-Chul

Classifications

• H01J37/32669 Primary

  Particular magnets or magnet arrangements for controlling the discharge · CPC title

• H01J37/32082

  Radio frequency generated discharge (H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence) · CPC title

• H01J37/3244

  Gas supply means · CPC title

• H01Q1/366

  using an ionized gas · CPC title

• H01J37/3299

  Feedback systems · CPC title