Electric power converter

Patent metadata

Field	Value
Publication number	US-2016086873-A1
Application number	US-201514847357-A
Country	US
Kind code	A1
Filing date	Sep 8, 2015
Priority date	Sep 18, 2014
Publication date	Mar 24, 2016
Grant date	—

Abstract

An electric power converter includes a semiconductor module, a cooling pipe, a pressing member and a supporting member. A pair of supporting wall portions is disposed so as to sandwich the semiconductor module, the cooling pipe, and the pressing member in an overlapping direction. A semiconductor element includes a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction. Within the semiconductor module, the large-sized semiconductor element is disposed closer to a connecting end portion side where a connecting portion of the pair of supporting wall portions are disposed than the small-sized semiconductor elements is.

First claim

What is claimed is:

1 . An electric power converter comprising:
a semiconductor module that incorporates two or more semiconductor elements therein; a cooling pipe disposed so as to overlap with the semiconductor module; a pressing member that presses the semiconductor module and the cooling pipe in an overlapping direction; and a supporting member that includes a pair of supporting wall portions that sandwich the semiconductor module, the cooling pipe, and the pressing member in the overlapping direction, and a connecting portion that connects ends of the supporting wall portions; wherein, there are provided a small-sized semiconductor element, and a large-sized semiconductor element of which an outer shape is larger than that of the small-sized semiconductor element when projected onto a plane parallel to the overlapping direction as the semiconductor elements; and the large-sized semiconductor element is disposed on a side closer to the connecting portion than the small-sized semiconductor element is.

2 . The electric power converter according to claim 1 , wherein,
a transverse dimension of the small-sized semiconductor element in a transverse direction that is orthogonal to both the overlapping direction and an aligning direction of the large-sized semiconductor element and the small-sized semiconductor elements is configured larger relative to a height dimension of the small-sized semiconductor element in the aligning direction.

3 . The electric power converter according to claim 1 , wherein,
there are provided a plurality of semiconductor modules and a plurality of cooling pipes, and the plurality of semiconductor modules and the plurality of cooling pipes form a laminated semiconductor unit by being laminated alternately.

4 . The electric power converter according to claim 3 , wherein,
there are provided an intermediate semiconductor module that incorporates an intermediate large element as the large-sized semiconductor element and an intermediate small element as the small-sized semiconductor element therein, and a plurality of outer semiconductor modules that incorporate an outer large element as the large-sized semiconductor element and an outer small elements as the small-sized semiconductor element as the semiconductor modules; an intermediate element area that is a sum of a projected area of the intermediate large element and projected area of the intermediate small element is configured smaller relative to an outer element area that is a sum of a projected area of the outer large element and a projected area of the outer small element; and the intermediate semiconductor module is disposed so as to be sandwiched between the outer semiconductor modules in the overlapping direction.

5 . The electric power converter according to claim 1 , wherein,
the supporting member is formed by a case that accommodates the semiconductor module, the cooling pipe, and the pressing member.

6 . The electric power converter according to claim 1 , wherein,
the semiconductor module incorporates four or more semiconductor elements therein.

7 . The electric power converter according to claim 1 , wherein,
the pressing member includes an elastic member that generates pressing force by elastic deformation.

Assignees

• Denso Corp

Inventors

• Sano Tomohisa
• Yamahira Yuu

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W76/45

  Liquid fillings · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• H10W40/774

  Pistons, e.g. spring-loaded members · CPC title

• H10W40/613

  for stacked arrangements of a plurality of semiconductor devices · CPC title