Molded sensor package with an integrated magnet and method of manufacturing molded sensor packages with an integrated magnet

Patent metadata

Field	Value
Publication number	US-2016018476-A1
Application number	US-201414336305-A
Country	US
Kind code	A1
Filing date	Jul 21, 2014
Priority date	Jul 21, 2014
Publication date	Jan 21, 2016
Grant date	—

Abstract

A molded sensor package includes a leadframe having a sensor die attached to the leadframe, a magnet aligned with the sensor die and a single molding compound encasing the sensor die and attaching the magnet to the leadframe. A method of manufacturing the molded sensor package includes loading the magnet and the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool, molding the magnet and the sensor die with the same molding compound while loaded in the molding tool and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

First claim

What is claimed is:

1 . A method of manufacturing a molded sensor package, the method comprising:
loading a magnet and a leadframe having a sensor die attached to the leadframe into a molding tool so that the magnet is aligned with the sensor die in the molding tool; molding the magnet and the sensor die with the same molding compound while loaded in the molding tool; and curing the molding compound so that the magnet is attached to the leadframe by the same molding compound that encases the sensor die.

2 . The method of claim 1 , wherein loading the magnet and the leadframe into the molding tool comprises:
placing the magnet in a cavity of a mold of the molding tool, the magnet having a surface with an indentation that faces outward from the cavity; and placing the leadframe in the mold above the magnet so that the surface of the magnet with the indentation faces the leadframe and the indentation provides a gap between at least part of the magnet and the leadframe.

3 . The method of claim 2 , wherein the molding compound fills the gap between the magnet and the leadframe during the molding so that the magnet is attached to the leadframe after the curing of the molding compound by the part of the molding compound that fills the gap.

4 . The method of claim 1 , wherein molding the magnet and the sensor die with the same molding compound while loaded in the molding tool comprises:
molding the magnet and the sensor die with an aromatic molding compound having a glass transition temperature below 180° C.

5 . The method of claim 1 , wherein molding the magnet and the sensor die with the same molding compound while loaded in the molding tool comprises:
molding the magnet and the sensor die with a multi-functional molding compound having a glass transition temperature above 180° C.

6 . A method of manufacturing molded sensor packages, the method comprising:
loading a plurality of magnets and a plurality of leadframes each having a sensor die attached to the leadframe into a molding tool so that each magnet is aligned with one of the sensor dies in the molding tool; molding the magnets and the sensor dies with the same molding compound while loaded in the molding tool; and curing the molding compound so that each magnet is attached to one of the leadframes by the same molding compound that encases the sensor die of that leadframe.

7 . The method of claim 6 , wherein loading the plurality of magnets and the plurality of leadframes into the molding tool comprises:
placing each magnet in a cavity of a mold of the molding tool, each magnet having a surface with an indentation that faces outward from the cavity; and placing each leadframe in the mold above one of the magnets so that the surface of the magnet with the indentation faces that leadframe and the indentation provides a gap between at least part of the magnet and the leadframe.

8 . The method of claim 7 , wherein the molding compound fills the gap between each magnet and leadframe during the molding so that each magnet is attached to one of the leadframes after the curing of the molding compound by the part of the molding compound that fills the gap.

9 . The method of claim 6 , wherein molding the magnets and the sensor dies with the same molding compound while loaded in the molding tool comprises:
molding the magnets and the sensor dies with an aromatic molding compound having a glass transition temperature below 180° C.

10 . The method of claim 6 , wherein molding the magnets and the sensor dies with the same molding compound while loaded in the molding tool comprises:
molding the magnets and the sensor dies with a multi-functional molding compound having a glass transition temperature above 180° C.

11 . The method of claim 6 , wherein loading the plurality of magnets and the plurality of leadframes into the molding tool comprises:
placing an array of interconnected magnets into a mold of the molding tool; and aligning each leadframe with one of the magnets in the mold.

12 . The method of claim 11 , further comprising:
severing the interconnections between the magnets after the magnets and the sensor dies are molded with the same molding compound and the molding compound is cured.

13 . The method of claim 6 , wherein loading the plurality of magnets and the plurality of leadframes into the molding tool comprises:
placing pre-separated magnets into a jig; loading the pre-separated magnets into a mold of the molding tool via the jig; and aligning each leadframe with one of the pre-separated magnets in the mold.

14 . A molded sensor package, comprising:
a leadframe having a sensor die attached to the leadframe; a magnet aligned with the sensor die; and a single molding compound encasing the sensor die and attaching the magnet to the leadframe.

15 . The molded sensor package of claim 14 , wherein the sensor die is bonded to a first side of the leadframe and the magnet is attached by the single molding compound to a second side of the leadframe opposite the first side.

16 . The molded sensor package of claim 14 , wherein the magnet has a surface with an indentation that faces the second side of the leadframe, the indentation providing a gap between at least part of the magnet and the leadframe, and wherein the gap is filled by the single molding compound to form an interlocked connection between the magnet and the leadframe.

17 . The molded sensor package of claim 16 , wherein the indentation is a U-shaped or V-shaped notch.

18 . The molded sensor package of claim 16 , wherein the indentation has a wider part adjacent the leadframe and a narrower part in open communication with the wider part and spaced apart from the leadframe by the wider part.

19 . The molded sensor package of claim 14 , wherein the single molding compound is an aromatic molding compound having a glass transition temperature below 180° C.

20 . The molded sensor package of claim 14 , wherein the single molding compound is a multi-functional molding compound having a glass transition temperature above 180° C.

Assignees

• Infineon Technologies Ag

Inventors

• Ooi Choo Tian
• Tai Chew Theng
• Elian Klaus
• Mohd Tahir Mohd Hirzarul Hafiz

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• G01R33/0052

  Manufacturing aspects; Manufacturing of single devices, i.e. of semiconductor magnetic sensor chips (devices based on galvano-magnetic effect or the like H10N50/85) · CPC title

• G01R33/0047 Primary

  Housings or packaging of magnetic sensors (packaging of semiconductor devices H10W99/00); Holders · CPC title

• H10N52/01 Primary

  Manufacture or treatment · CPC title

• H10N52/80

  Constructional details · CPC title