Miniaturized Component and Method for the Production Thereof

Patent metadata

Field	Value
Publication number	US-2016016790-A1
Application number	US-201414773270-A
Country	US
Kind code	A1
Filing date	Feb 5, 2014
Priority date	Mar 6, 2013
Publication date	Jan 21, 2016
Grant date	—

Abstract

An encapsulated component and a method for producing an encapsulated component are specified. The component includes a carrier substrate, a functional structure, a thin-film cover and a reinforcement layer comprising glass. The carrier substrate, the thin-film cover and the reinforcement layer together enclose a cavity around at least parts of the functional structure.

First claim

1 - 10 . (canceled)

11 . An encapsulated component, comprising:
a carrier substrate; a functional structure over the carrier substrate; a thin-film cover above the functional structure; and a reinforcement layer comprising glass above the thin-film cover, wherein the carrier substrate, the thin-film cover and the reinforcement layer together enclose a cavity, at least one part of the functional structure being arranged in the cavity.

12 . The component according to claim 11 , wherein the functional structure comprises a MEMS structure.

13 . The component according to claim 11 , wherein the functional structure comprises a micro acoustic structure.

14 . The component according to claim 11 , wherein an opening is structured in the thin-film cover, the opening being closed by the reinforcement layer.

15 . The component according to claim 11 , wherein the thin-film cover comprises a material selected from the group consisting of SiO 2 , Si x N y , Al 2 O 3 , and wherein the carrier substrate comprises glass or Si.

16 . The component according to claim 11 , wherein:
the cavity has a width of at least 10 μm and a height of less than 100 μm; the thin-film cover has a thickness of less than 5 μm; and the reinforcement layer has a thickness of less than 50 μm.

17 . The component according to claim 11 , wherein the functional structure is interconnected with a connection pad via a line, the connection pad being covered by neither the thin-film cover nor the reinforcement layer.

18 . A method for producing an encapsulated component, the method comprising:
structuring a functional structure on a carrier substrate; applying a sacrificial layer above the carrier substrate; applying a thin-film cover above the sacrificial layer, the thin-film cover having an opening; removing the sacrificial layer through the opening in the thin-film cover; and applying a reinforcement layer above the thin-film cover.

19 . The method according to claim 18 , wherein the sacrificial layer comprises an organic material and wherein removing the sacrificial layer comprises removing the sacrificial layer by oxidation through heating in an oxygen containing atmosphere.

20 . The method according to claim 19 , wherein applying the reinforcement layer comprises:
applying a glass paste; closing the opening in the thin-film cover; and firing the glass paste.

21 . The method according to claim 20 , wherein:
the glass paste comprises glass frit composed of a suspension of fine glass particles in a binder matrix; the glass paste is applied to the thin-film cover by blade coating; and the binder completely decomposes during the firing of the glass paste.

22 . The method according to claim 18 , wherein the sacrificial layer is applied above the functional structure.

23 . The method according to claim 18 , wherein the thin-film cover is applied directly on the sacrificial layer.

24 . The method according to claim 18 , wherein the reinforcement layer hermetically seals the opening in the thin-film cover.

25 . An encapsulated component, comprising:
a carrier substrate; a functional structure over the carrier substrate; a thin-film cover above the functional structure; a reinforcement layer comprising glass above the thin-film cover; a solder ball located next to the reinforcement layer and electrically connected to the functional structure via a lead; wherein the carrier substrate, the thin-film cover and the reinforcement layer together enclose a cavity; wherein at least one part of the functional structure is arranged in the cavity; and wherein the reinforcement layer touches the substrate such that a mechanical connection between the thin film cover and the substrate is reinforced.

26 . The component according to claim 25 , further comprising a lead extending from the functional structure to the solder ball.

27 . The component according to claim 26 , wherein the lead extends along a surface of the carrier.

Assignees

• Epcos Ag

Inventors

• Marksteiner Stephan

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• B81C2203/0136

  Growing or depositing of a covering layer · CPC title

• B81C1/00293 Primary

  maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title

• B81B2207/07

  Interconnects · CPC title

• B81B7/0041 Primary

  maintaining a controlled atmosphere with techniques not provided for in B81B7/0038 · CPC title