Processing apparatus and processing method

Patent metadata

Field	Value
Publication number	US-2016008920-A1
Application number	US-201314770015-A
Country	US
Kind code	A1
Filing date	Nov 22, 2013
Priority date	Feb 27, 2013
Publication date	Jan 14, 2016
Grant date	—

Abstract

A processing apparatus and a processing method which perform processing more accurately with a simple structure are provided. The processing apparatus includes an irradiation head 16 and a control device. The irradiation head 16 includes a laser turning unit 35 and a condensing optical system 37. The laser turning unit 35 includes a first prism 51, a second prism 52, a first rotating mechanism 53, and a second rotating mechanism 54. The control device adjusts the differences between rotation speeds and phase angles of the first prism 51 and the second prism 52 based on a relation between at least a heat affected layer of a workpiece and a turning speed of laser.

First claim

1 . A processing apparatus which performs processing by irradiating a workpiece with laser, comprising:
an irradiation head configured to irradiate the workpiece with the laser and including a laser turning unit which turns the laser relative to the workpiece and a condensing optical system which collects the laser turned by the laser turning unit; and a control device configured to control an operation of the irradiation head, wherein the laser turning unit includes a first prism which refracts the laser, a second prism which is arranged at a position opposite to the first prism and refracts the laser output from the first prism, a first rotating mechanism which rotates the first prism, and a second rotating mechanism which rotates the second prism, and the control device controls the first and second rotating mechanisms based on a relation between at least an allowable thickness of a heat affected layer of the workpiece and a turning speed of the laser emitted to the workpiece, and adjusts differences between rotation speeds and phase angles of the first and second prisms.

2 . The processing apparatus according to claim 1 , wherein
the first rotating mechanism includes a first spindle which holds the first prism and of which a part of the light path of the laser is hollow, and a first hollow motor to which the first spindle is rotatably inserted and which rotationally drives the first spindle, and the second rotating mechanism includes a second spindle which holds the second prism and of which a part of the light path of the laser is hollow, and a second hollow motor to which the second spindle is rotatably inserted and which rotationally drives the second spindle.

3 . The processing apparatus according to claim 1 , wherein
an error of a difference between phase angles of the first and second hollow motors is equal to or less than 0.1°.

4 . The processing apparatus according to claim 1 , wherein
the processing includes at least one of cutting processing, boring processing, welding, cladding, surface reforming processing, surface finishing, and laser lamination molding.

5 . The processing apparatus according to claim 1 , wherein
the control device controls the allowable thickness of the heat affected layer by controlling the rotation speeds of the first and second prisms.

6 . The processing apparatus according to claim 1 , wherein
the heat affected layer includes at least one of a remelted layer, an oxide layer, a crack, and a dross.

7 . The processing apparatus according to claim 1 , wherein
the workpiece is formed of any one of materials, such as Inconel (registered trademark), HASTELLOY (registered trademark), stainless, ceramic, steel, carbon steel, heat resistant steel, ceramics, silicon, titanium, tungsten, resin, plastics, fiber reinforced plastics, a composite material, and Ni based heat resistant alloy.

8 . The processing apparatus according to claim 1 , wherein
the control device controls the first and second rotating mechanisms based on a relation between at least the allowable thickness of the heat affected layer of the workpiece, the turning speed of the laser emitted to the workpiece, and a turning radius of the laser to adjust the differences of the rotation speeds and the phase angles between the first and second prisms.

9 . A processing method for performing processing by irradiating a workpiece with laser, comprising:
outputting the laser; determining differences between rotation speeds and phase angles of a first and second prisms based on a relation between at least an allowable thickness of a heat affected layer of the workpiece and a turning speed of the laser irradiated to the workpiece; rotating a first and second rotating mechanisms by the determined differences between the rotation speeds and the phase angles; and irradiating the workpiece with the laser while turning the laser.

10 . The processing method according to claim 9 , wherein
the processing includes at least one of cutting processing, boring processing, welding, cladding, surface reforming processing, surface finishing, and laser lamination molding.

11 . The processing method according to claim 9 , wherein
the heat affected layer includes at least one of a remelted layer, an oxide layer, a crack, and a dross.

12 . The processing method according to claim 9 , wherein
the determination step determines the differences of the rotation speeds and the phase angles between the first and second prisms based on the relation between at least the allowable thickness of the heat affected layer of the workpiece, the turning speed of the laser emitted to the workpiece, and a turning radius of the laser.

Assignees

• Mitsubishi Heavy Ind Ltd

Inventors

• Goya Saneyuki
• Kinouchi Masato
• Danno Minoru
• Watanabe Toshiya
• Ishide Takashi
• Yamashita Tsugumaru
• Fujita Yoshihito
• Yamasaki Makoto
• Suzuki Ryu
• Kanaoka Kohei

Classifications

• B23K26/352

  for surface treatment · CPC title

• B23K26/0652 Primary

  comprising prisms · CPC title

• B23K26/34

  Laser welding for purposes other than joining · CPC title

• B23K2203/52

  Operations & Transport · mapped topic

• B23K26/0622

  by shaping pulses · CPC title