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US-2024351222-A1 · Oct 24, 2024 · US
Insulating Substrates Including Through Holes
US2016007461A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016007461-A1 |
| Application number | US-201514855798-A |
| Country | US |
| Kind code | A1 |
| Filing date | Sep 16, 2015 |
| Priority date | Feb 26, 2014 |
| Publication date | Jan 7, 2016 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alumina sintered body is 99.5 percent or higher. The alumina sintered body has a purity of 99.9 percent or higher, and has an average grain size of 3 to 6 μm in said main body part. Alumina grains are plate-shaped in the exposed region and the plate-shaped alumina grains have an average length of 8 to 25 μm.
First claim
Opening claim text (preview).
1 . An insulating substrate including through holes for conductors, said through holes being arranged in said insulating substrate: wherein a thickness of said insulating substrate is 25 to 100 μm; wherein a diameter of said through hole is 20 to 100 μm; wherein said insulating substrate comprises a main body part and exposed regions exposed to said through holes, respectively; wherein said insulating substrate comprises an alumina sintered body; wherein a relative density of said alumina sintered body is 99.5 percent or higher; wherein said alumina sintered body has a purity of 99.9 percent or higher; wherein said alumina sintered body has an average grain size of 3 to 6 μm in said main body part; wherein alumina grains of said alumina sintered body are plate-shaped in said exposed region; and wherein said plate-shaped alumina grain has an average length of 8 to 25 μm. 2 . The insulating substrate of claim 1 , wherein said through hole is formed by laser processing. 3 . The insulating substrate of claim 1 , wherein said through holes are formed in molding said alumina sintered body. 4 . The insulating substrate of claim 1 , wherein 200 to 800 mass ppm of zirconia, 150 to 300 mass ppm of magnesia and 10 to 30 mass ppm of yttria are added to said alumina sintered body as sintering aids. 5 . The insulating substrate of claim 1 , wherein said alumina sintered body has a breakdown voltage of 50 kV/mm or higher.
Assignees
Inventors
Classifications
- C04B35/111Primary
Fine ceramics · CPC title
Substrate related · CPC title
Insulating bodies · CPC title
ceramics · CPC title
- H05K1/115Primary
Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title
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- What does patent US2016007461A1 cover?
- It is provided an insulating substrate including through holes for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 100 μm, and a diameter of the through hole is 20 to 100 μm. The insulating substrate includes a main body part and exposed regions exposed to the through holes and is composed an alumina sintered body. A relative density of the alum…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification C04B35/111. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Jan 07 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).