Organic electronic devices with multiple solution-processed layers

Patent metadata

Field	Value
Publication number	US-2016006002-A1
Application number	US-201514817979-A
Country	US
Kind code	A1
Filing date	Aug 4, 2015
Priority date	Aug 29, 2013
Publication date	Jan 7, 2016
Grant date	—

Abstract

A method for fabricating an organic light emitting device stack involves depositing a first conductive electrode layer over a substrate; depositing a first set of one or more organic layers, wherein at least one of the first set of organic layers is a first emissive layer and one of the first set of organic layers is deposited by a solution-based process that utilizes a first solvent; depositing a first conductive interlayer by a dry deposition process; and depositing a second set of one or more organic layers, wherein at least one of the second set of organic layers is a second emissive layer and one of the second set of organic layers is deposited by a solution-based process that utilizes a second solvent, wherein all layers that precede the layer deposited using the second solvent are insoluble in the second solvent.

First claim

What is claimed is:

1 . A method for fabricating an organic light emitting device stack, the method comprising:
(a) depositing a first conductive electrode layer over a substrate; (b) depositing a first set of one or more organic layers, wherein at least one of the first set of organic layers is a first emissive layer and one of the first set of organic layers is deposited by a solution-based process that utilizes a first solvent; (c) depositing a first conductive interlayer by a dry deposition process; and (d) depositing a second set of one or more organic layers, wherein at least one of the second set of organic layers is a second emissive layer and one of the second set of organic layers is deposited by a solution-based process that utilizes a second solvent, wherein all layers that precede the layer deposited using the second solvent are insoluble in the second solvent.

2 . The method of claim 1 , further comprising depositing a second conductive electrode layer or second conductive interlayer by a dry deposition process.

3 . The method of claim 1 , wherein the first set of one or more organic layers is a first emissive layer.

4 . The method of claim 3 , further comprising depositing one or more functional layers by a dry deposition process before depositing the first emissive layer.

5 . The method of claim 3 , further comprising depositing one or more functional layers by a dry deposition process after depositing the first emissive layer but before step (c).

6 . The method of claim 1 , wherein the first set of one or more organic layers is a functional layer and the method further comprises depositing a first emissive layer by a dry deposition process after step (b) but before step (c).

7 . The method of claim 4 , wherein the one or more functional layers comprises: a hole injection layer, a hole transport layer, and an electron blocking layer.

8 . The method of claim 5 , wherein the one or more functional layers comprises: a hole blocking layer, an electron transport layer, and an electron injection layer.

9 . The method of claim 1 , wherein the second set of one or more organic layers is a second emissive layer.

10 . The method of claim 9 , further comprising depositing one or more functional layers by a dry deposition process before depositing the second emissive layer.

11 . The method of claim 10 , further comprising depositing one or more functional layers by a dry deposition process after depositing the second emissive layer.

12 . The method of claim 1 , wherein the second set of one or more organic layers is a functional layer and the method further comprises depositing a second emissive layer by a dry deposition process after step (d).

13 . The method of claim 10 , wherein the one or more functional layers comprises: a hole injection layer, a hole transport layer, and an electron blocking layer.

14 . The method of claim 11 , wherein the one or more functional layers comprise: a hole blocking layer, an electron transport layer, and an electron injection layer.

15 . The method of claim 1 , further comprising an annealing step after step (b) but before step (c).

16 . The method of claim 15 , wherein the annealing step is solvent vapor annealing or thermal annealing.

17 . The method of claim 15 , further comprising a second annealing step after step (d).

18 . The method of claim 17 , wherein the annealing steps are solvent vapor annealing or thermal annealing.

19 . A method for fabricating an organic light emitting device stack, the method comprising:
(a) depositing a first conductive electrode layer over a substrate; (b) optionally depositing a first set of one or more functional layers by a dry deposition process; (c) depositing a first emissive layer by solution-based process of an emissive material dissolved in a first solvent; (d) optionally depositing a second set of one or more functional layers by a dry deposition process; (e) depositing a first conductive interlayer by a dry deposition process; (f) optionally depositing a third set of one or more functional layers by a dry deposition process; (g) depositing a second emissive layer by solution-based process of the emissive material dissolved in a second solvent, wherein the second set of one more functional layers, the conductive interlayer, and the third set of one or more functional layers are insoluble in the second solvent; (h) optionally depositing a fourth set of one or more functional layers by a dry deposition process; and (i) depositing a second conductive electrode layer or second conductive interlayer by a dry deposition process.

20 . The method of claim 1 , wherein the first set of one or more functional layers comprises:
a hole injection layer, a hole transport layer, and an electron blocking layer.

21 . The method of claim 1 , wherein the second set of one or more functional layers comprises: a hole blocking layer, an electron transport layer, and an electron injection layer.

22 . The method of claim 1 , wherein the third set of one or more functional layers comprises:
a hole injection layer, a hole transport layer, and an electron blocking layer.

23 . The method of claim 1 , wherein the fourth set of one or more functional layers comprise:
a hole blocking layer, an electron transport layer, and an electron injection layer.

24 . The method of claim 1 , further comprising an annealing step after step (c) but before step (d).

25 . The method of claim 24 , wherein the annealing step is solvent vapor annealing or thermal annealing.

26 . The method of claim 24 , further comprising a second annealing step after step (g) but before step (h).

27 . The method of claim 26 , wherein the annealing steps are solvent vapor annealing or thermal annealing.

Assignees

• Univ Michigan

Inventors

• Forrest Stephen R
• Lassiter Brian E
• Zimmerman Jeramy D

Classifications

• H10K30/50

  Photovoltaic [PV] devices · CPC title

• H10K71/00

  Manufacture or treatment specially adapted for the organic devices covered by this subclass · CPC title

• H10K71/15 Primary

  characterised by the solvent used · CPC title

• H01L51/5096

  Electricity · mapped topic

• H01L51/0026

  Electricity · mapped topic