Noise Suppression Circuit Board Design For An Inductive Heater

Patent metadata

Field	Value
Publication number	US-2015271912-A1
Application number	US-201414223668-A
Country	US
Kind code	A1
Filing date	Mar 24, 2014
Priority date	Mar 24, 2014
Publication date	Sep 24, 2015
Grant date	—

Abstract

A noise suppression circuit board design to provide a power supply to an inductive heating element is disclosed. The noise suppression circuit provides a configuration for a multi-layer circuit board that has radiation noise emissions below the CISPR 11 (limits and methods of measurements of radio disturbance characteristics of industrial, scientific and medical (ISM) radio-frequency equipment) thresholds in the 30 MHz to 1 GHz frequency range.

First claim

1 . A circuit board design for an inductive heater assembly, comprising:
a multilayer circuit board for mounting a plurality of circuit components, the multilayer circuit board including:
a top layer consisting of an etched copper foil on a core coated with an insulation layer, said top layer having a plurality of circuit trace lines and a plurality of vias, said top layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones for mounting respective circuit components;
at least one middle layer on a core including a plurality of vias matching the plurality of vias of said top layer; and
a bottom layer consisting of an etched copper foil on a core coated with an insulation layer, said bottom layer having a plurality of circuit trace lines and a plurality of vias, said plurality of vias matching the plurality of vias of said top layer, said bottom layer further including a plurality of ground cut lines etched through said copper foil to segregate the ground portions of the copper foil into zones.

2 . The circuit board design of claim 1 , wherein at least one of said top layer and said bottom layer further comprises at least one circuit trace line bounded by at least one of said ground cut lines for a substantial portion of its length.

3 . The circuit board design of claim 1 , wherein at least one of said top layer and said bottom layer further comprises at least one circuit trace line bounded between at least two of said ground cut lines for a substantial portion of its length.

4 . The circuit board design of claim 3 , wherein said at least one circuit trace line bounded between at least two of said ground cut lines conducts the high frequency AC signals from a zone of the circuit board allowing mounting of oscillator circuitry to another zone of the circuit board allowing mounting of driver circuitry of said inductive heater assembly.

5 . The circuit board design of claim 1 , wherein at least one of said ground cut lines on said top layer and at least one of said ground cut lines on said bottom layer are positioned at the same respective location on the multilayer circuit board.

6 . The circuit board design of claim 1 , wherein said ground cut lines on said top layer and said bottom layer segregate the top layer into a plurality of primary zones for cluster mounting the circuit components that provide various functions of the induction heater assembly.

7 . The circuit board design of claim 1 , wherein said zones for mounting respective circuit components on said top layer further comprise: a first primary zone for mounting power supply components; a second primary zone for mounting oscillator circuits; a third primary zone for mounting at least one transistor of a driver or amplifier circuit; and a fourth primary zone for mounting filter circuits including coil-capacitor circuit components.

8 . The circuit board design of claim 1 , wherein said ground cut lines on said top layer and said bottom layer segregate at least one of said primary zones into sub-zones of said circuit board, said sub zones configured to allow the mounting of discrete portions of the circuitry of the inductive heater assembly such that said discrete portions are segregated from one another by at least one of said ground cut lines.

9 . The circuit board design of claim 1 , wherein said at least one middle layer includes a plurality of ground cut lines etched through a copper ground foil to segregate the ground portions of said copper foil into zones.

10 . The circuit board design of claim 1 , further comprising vias for mounting posts of a transistor and posts of a heat sink associated with said transistor, said heat sink separated from said transistor by a thermal interface having a thickness sufficient to reduce capacitive coupling between said transistor and aid heat sink.

11 . The circuit board design of claim 10 , wherein said thermal interface has a thickness in the range of about 0.7 mm to 10. mm.

12 . The circuit board design of claim 6 , wherein said ground cut lines on said top layer and said bottom layer segregate at least one of said primary zones into sub-zones of said circuit board configured for the mounting of at least two coil-capacitor circuits to be mounted on said top layer, said ground cut lines configured to isolate the ground pattern of the coil-capacitors mounted on the top layer from one another.

13 . A multilayer circuit board design for an inductive heater assembly, comprising:
a top layer having a ground foil pattern segregated by a plurality of ground cut lines defining a plurality of circuit mounting zones on said top layer of said multilayer circuit board; a middle core having at least one middle layer; a bottom layer having a ground foil pattern segregated by a plurality of ground cut lines defining a plurality of zones and providing conductive paths between said plurality of circuit mounting zones of said top layer; at least one circuit trace line bounded between at least two of said ground cut lines, said at least one circuit trace line configured to conduct high frequency AC signals from one of said circuit mounting zones allowing mounting of oscillator circuitry to another of said circuit mounting zones allowing mounting of driver circuitry of said inductive heater assembly.

14 . The circuit board design of claim 13 further comprising vias for mounting posts of a transistor and posts of a heat sink associated with said transistor, said heat sink separated from said transistor by a thermal interface having a thickness sufficient to reduce capacitive coupling between said transistor and aid heat sink.

15 . The circuit board design of claim 14 , wherein said thermal interface has a thickness in the range of about 0.7 mm to 10. mm.

16 . The circuit board design of claim 14 wherein said thermal interface is made from a high hardness silicon rubber material suitable for acting as a thermal interface.

17 . An inductive heater assembly having a multilayer circuit board for mounting the power control circuitry of the inductive heater, the multilayer circuit board comprising:
a top layer having a ground foil pattern segregated by a plurality of ground cut lines defining a plurality of circuit mounting zones on said top layer of said multilayer circuit board; a middle core layer; a bottom layer having a ground foil pattern segregated by a plurality of ground cut lines defining a plurality of zones and providing conductive paths between said plurality of circuit mounting zones of said top layer; at least one circuit trace line bounded between at least two of said ground cut lines, said at least one circuit trace line configured to conduct high frequency AC signals from one of said circuit mounting zones allowing mounting of oscillator circuitry to another of said circuit mounting zones allowing mounting of driver circuitry of said inductive heater assembly.

18 . The inductive heater assembly of claim 17 , wherein the circuit board further comprising vias for mounting posts of a transistor and posts of a heat sink associated with said transistor, said heat sink separated from said transistor by a thermal interface having a thickness sufficient to reduce capacitive coupling between said transistor and aid heat sink.

19 . The inductive heater assembly of claim 18 , wherein the configuration of the multilayer circuit board results in the radio frequency interference (RFI) emissions of the inductive solder station are less than 30 dBμV/

Assignees

• Tetsuo Yokoyama
• Masashi Sanamoto
• Hakko Corp

Inventors

• Tetsuo Yokoyama
• Masashi Sanamoto

Classifications

• H05K7/20 Primary

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• H05K1/182

  associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

• H05K2201/10166

  Transistor · CPC title

• H05K1/0225 Primary

  Single or multiple openings in a shielding, ground or power plane (H05K1/0227 takes precedence) · CPC title

• H05K1/0298

  Multilayer circuits · CPC title