High power fiber laser effusion hole drilling apparatus and method of using same
US-2015367451-A1 · Dec 24, 2015 · US
Laser processing method
US2015231738A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015231738-A1 |
| Application number | US-201514624954-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 18, 2015 |
| Priority date | Feb 18, 2014 |
| Publication date | Aug 20, 2015 |
| Grant date | — |
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Abstract
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A laser processing method includes steps of providing a mask material of which thickness is equal to or greater than 10 μm onto an object, and forming a hole in the object or cutting the object in a state where the mask material is provided on the object, in a manner that an ultrashort-pulse laser light is irradiated from above the object and an opening portion is formed at the mask material to penetrate the mask material while ablation processing is performed to a portion of the object by the ultrashort-pulse laser light, the portion of the object being below the opening portion.
First claim
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1 . A laser processing method comprising steps of: providing a mask material of which thickness is equal to or greater than 10 μm onto an object; and forming a hole in the object or cutting the object in a state where the mask material is provided on the object, in a manner that an ultrashort-pulse laser light is irradiated from above the object and an opening portion is formed at the mask material to penetrate the mask material while ablation processing is performed to a portion of the object by the ultrashort-pulse laser light, the portion of the object being below the opening portion. 2 . The laser processing method according to claim 1 , wherein the mask material made of low-melting-point alloy is provided onto the object in the step of providing the mask material. 3 . The laser processing method according to claim 1 , wherein the mask material corresponding to resin sheet is provided onto the object to be in close contact with the object in the step of providing the mask material. 4 . The laser processing method according to claim 2 , wherein the low-melting-point alloy is melted at a temperature that is higher than a melting point of the low-melting-point alloy and the melted low-melting-point alloy is applied onto the object in the step of providing the mask material. 5 . The laser processing method according to claim 4 , comprising a step of: removing the mask material with the use of water heated to a temperature that is higher than the melting point of the mask material in a state where the mask material is provided on the object. 6 . The laser processing method according to claim 4 , wherein a resin sheet, opaque resin tape, or thermally foaming adhesive film configured to be removed when heated is used as the mask material. 7 . The laser processing method according to claim 4 , wherein irradiation power of the ultrashort-pulse laser light is higher than a processing threshold of the mask material and is higher than a processing threshold of the object. 8 . A laser processing apparatus used in a laser processing method, the laser processing method comprising steps of: providing a mask material of which thickness is equal to or greater than 10 μm onto an object; and forming a hole in the object or cutting the object in a state where the mask material is provided on the object, in a manner that an ultrashort-pulse laser light is irradiated from above the object and an opening portion is formed at the mask material to penetrate the mask material while ablation processing is performed to a portion of the object by the ultrashort-pulse laser light, the portion of the object being below the opening portion.
Assignees
Inventors
Classifications
- B23K26/381Primary
Operations & Transport · mapped topic
- B23K26/382Primary
by boring · CPC title
disposed on the workpiece · CPC title
by boring or cutting · CPC title
using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title
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- What does patent US2015231738A1 cover?
- A laser processing method includes steps of providing a mask material of which thickness is equal to or greater than 10 μm onto an object, and forming a hole in the object or cutting the object in a state where the mask material is provided on the object, in a manner that an ultrashort-pulse laser light is irradiated from above the object and an opening portion is formed at the mask material to…
- Who is the assignee on this patent?
- Aisin Seiki
- What technology area does this patent fall under?
- Primary CPC classification B23K26/381. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Aug 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).