Overlap Joint Flex Circuit Board Interconnection
US-2024049392-A1 · Feb 8, 2024 · US
Substrate structure and manufacturing method thereof
US2015114698A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114698-A1 |
| Application number | US-201314105195-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 13, 2013 |
| Priority date | Oct 30, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
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A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side surfaces of the insulation layer. The first blind via extends from the upper surface toward the second copper foil layer and exposes a portion of the second copper foil layer. The second blind via extends from the lower surface toward the first copper foil layer and exposes a portion of the first copper foil layer. The filling material is filled inside of the first blind via and the second blind via and covers the upper surface and the lower surface of the substrate.
First claim
Opening claim text (preview).
What is claimed is: 1 . A substrate structure, comprising: a substrate, having an upper surface and a lower surface opposite to each other, at least one first blind via and at least one second blind via, the substrate comprising an insulation layer, a first copper foil layer and a second copper foil layer, wherein the first copper foil layer and the second copper foil layer are located on two opposite side surfaces of the insulation layer, the first copper foil layer and the sec…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2015114698A1 cover?
- A substrate structure includes a substrate and a filling material. The substrate has an upper surface, a lower surface, at least one first blind via and at least one second blind via. The substrate includes an insulation layer, a first copper foil layer and a second copper foil layer. The first copper foil layer and the second copper foil layer are respectively disposed on two opposite side sur…
- Who is the assignee on this patent?
- Huang Tzu-Wei, Wang Chin-Sheng, Subtron Technology Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K1/115. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).