Indexed gas jet injector for substrate processing system
US-2015376793-A1 · Dec 31, 2015 · US
US2015114282A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114282-A1 |
| Application number | US-201414582675-A |
| Country | US |
| Kind code | A1 |
| Filing date | Dec 24, 2014 |
| Priority date | Dec 21, 2001 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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A method for growing an epitaxial film on a surface of a semiconductor wafer by mounting the wafer within a susceptor pocket and supplying source gas and carrier gas to the upper surface side of the susceptor and supplying carrier gas to the lower surface side of the susceptor. The susceptor includes a substantially circular bottom wall and a sidewall encompassing the bottom wall to form a pocket for mounting the wafer, wherein a plurality of circular through-holes are formed in the bottom wall in an outer peripheral region a distance of up to about ½ the radius toward the center of the bottom wall. The total opening surface area of the through-holes is 0.05 to 55% of the surface area of the bottom wall, the opening surface area of each through-hole is 0.2 to 3.2 mm 2 and the density of the through-holes is 0.25 to 25 per cm 2 .
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What is claimed is: 1 . An epitaxial growth method for growing an epitaxial film on a surface of a semiconductor wafer by mounting the semiconductor wafer within a susceptor pocket and supplying source gas and carrier gas to the upper surface side of the susceptor and supplying carrier gas to the lower surface side of the susceptor, wherein the susceptor comprises a substantially circular bottom wall and a sidewall encompassing the bottom wall to form a pocket for mounting the se…
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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