Confinement or movement of an object using focused ultrasound waves to generate anultrasound intensity well
US-2017249932-A1 · Aug 31, 2017 · US
Remoldable contour sensor holder
US2015114143A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2015114143-A1 |
| Application number | US-201314062532-A |
| Country | US |
| Kind code | A1 |
| Filing date | Oct 24, 2013 |
| Priority date | Oct 24, 2013 |
| Publication date | Apr 30, 2015 |
| Grant date | — |
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Abstract
Official abstract text for this publication.
A sensor assembly for inspecting a part, the sensor assembly comprising a sensor for sensing a defect of the part and a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part. The housing is formed of a moldable material and may be molded into a shape that conforms to a contour of the part when a stimulus is applied to the housing and may harden into the shape when the stimulus is removed from the housing.
First claim
Opening claim text (preview).
Having thus described various embodiments of the invention, what is claimed as new and desired to be protected by Letters Patent includes the following: 1 . A sensor assembly for inspecting a part, the sensor assembly comprising: a sensor for sensing a defect of the part; and a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part, the remoldable housing being formed of a moldable material that may be molded into a shape that conf…
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Physics · mapped topic
- G10K11/24Primary
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
Physics · mapped topic
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- What does patent US2015114143A1 cover?
- A sensor assembly for inspecting a part, the sensor assembly comprising a sensor for sensing a defect of the part and a remoldable housing for retaining and positioning the sensor in alignment with the defect of the part. The housing is formed of a moldable material and may be molded into a shape that conforms to a contour of the part when a stimulus is applied to the housing and may harden int…
- Who is the assignee on this patent?
- Spirit Aerosys Inc
- What technology area does this patent fall under?
- Primary CPC classification G10K11/24. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Thu Apr 30 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).