Embedded packaging structure and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-12599019-B2
Application number	US-202217811879-A
Country	US
Kind code	B2
Filing date	Jul 12, 2022
Priority date	Oct 27, 2021
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

An embedded packaging structure and a manufacturing method thereof are disclosed. The method includes: providing a bearing plate with a first metal seed layer; processing on the first metal seed layer to obtain a substrate; removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first and a second cavities penetrating therethrough; assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, processing on a second side of the substrate to obtain a second insulating layer; processing on a first side of the substrate to obtain a second circuit layer, assembling a second component on the second circuit layer; bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side, and packaging the first side by using a packaging material to obtain a packaging layer.

First claim

The invention claimed is:

1 . A manufacturing method of an embedded packaging structure, comprising:
providing a bearing plate, wherein a first metal seed layer is arranged on the bearing plate; processing on the first metal seed layer to obtain a substrate, wherein the substrate comprises a first circuit layer, a first metal column and a first insulating layer, the first circuit layer and the first metal column are both located in the first insulating layer, and the first metal column is further located on the first circuit layer; removing the bearing plate to obtain the substrate, and processing on the substrate to obtain a first cavity and a second cavity which penetrate through the substrate; assembling a first component in the first cavity, assembling a connecting flexible board in the second cavity, and processing on a second side of the substrate by using a photosensitive insulating material to obtain a second insulating layer covering the first component making local areas of the first circuit layer and the connecting flexible board exposed, so as to fix the first component and the connecting flexible board; processing on a first side of the substrate to obtain a second circuit layer, and assembling a second component on the second circuit layer, so that the first metal column and the first component are electrically connected with the second component through the second circuit layer respectively; and bending the substrate through the connecting flexible board to form an included angle less than 180 degrees on the first side of the substrate, and packaging the first side of the substrate by using a packaging material to obtain a packaging layer.

2 . The manufacturing method of an embedded packaging structure according to claim 1 , wherein the processing on the first metal seed layer to obtain the substrate comprises:
processing on the first metal seed layer to obtain the first circuit layer, wherein the first circuit layer comprises a first conductive circuit, a first sacrificial circuit and a second sacrificial circuit; processing on the first circuit layer to obtain the first metal column, wherein the first metal column comprises a first conductive metal column located on the first conductive circuit, a first sacrificial metal column located on the first sacrificial circuit and a second sacrificial metal column located on the second sacrificial circuit; and processing between gaps of the first circuit layer and gaps of the first metal column by using the insulating material to obtain the first insulating layer, thereby obtaining the substrate.

3 . The manufacturing method of an embedded packaging structure according to claim 2 , wherein the processing between gaps of the first circuit layer and gaps of the first metal column by using the insulating material to obtain the first insulating layer, thereby obtaining the substrate, comprises:
applying the insulating material on the first metal seed layer, so that the insulating material covers the first metal column and the first circuit layer to obtain an insulating base layer; and processing the insulating base layer, to expose an end portion of the first metal column from the insulating base layer to obtain the first insulating layer, thereby obtaining the substrate.

4 . The manufacturing method of an embedded packaging structure according to claim 2 , wherein the processing on the substrate to obtain a first cavity and a second cavity which penetrate through the substrate comprises:
removing the first sacrificial circuit and the first sacrificial metal column to form the first cavity penetrating through the substrate; and removing the second sacrificial circuit and the second sacrificial metal column to form the second cavity penetrating through the substrate.

5 . The manufacturing method of an embedded packaging structure according to claim 1 , wherein a first metal layer, a second metal layer and an etching barrier layer are sequentially arranged on the bearing plate, the first metal seed layer is located on the etching barrier layer, and the removing the bearing plate to obtain the substrate comprises:
splitting the first metal layer from the second metal layer, and sequentially removing the second metal layer, the etching barrier layer and the first metal seed layer by etching, so as to remove the bearing plate and obtain the substrate.

6 . The manufacturing method of an embedded packaging structure according to claim 1 , wherein the assembling a first component in the first cavity and assembling a connecting flexible board in the second cavity, comprises:
mounting a temporary bearing layer on the first side of the substrate, wherein the first side of the substrate is opposite to the second side of the substrate, and the first circuit layer is located on the second side of the substrate; and pre-mounting the first component and the connecting flexible board on the temporary bearing layer, wherein the first component is located in the first cavity, and the connecting flexible board is located in the second cavity.

7 . The manufacturing method of an embedded packaging structure according to claim 6 , wherein the processing on a second side of the substrate by using a photosensitive insulating material to obtain a second insulating layer further comprises:
removing the temporary bearing layer.

8 . The manufacturing method of an embedded packaging structure according to claim 1 , wherein the processing on a first side of the substrate to obtain a second circuit layer comprises:
processing on the first side of the substrate to obtain a second metal seed layer; and processing on the second metal seed layer to obtain the second circuit layer.

Assignees

• Zhuhai Access Semiconductor Co Ltd

Inventors

• Chen Xianming
• Hong Yejie
• Huang Benxia
• Huang Gao

Classifications

• H10W70/095

  of vias therein · CPC title

• H10W70/68

  Shapes or dispositions thereof · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W70/688 Primary

  Flexible insulating substrates · CPC title

• H10W70/635

  Through-vias · CPC title