Chip tray for self-assembly, and method for supplying semiconductor light emitting elements

Patent metadata

Field	Value
Publication number	US-12598944-B2
Application number	US-202017799080-A
Country	US
Kind code	B2
Filing date	Feb 19, 2020
Priority date	Feb 11, 2020
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

The present invention relates to a method of manufacturing a display device, and more particularly, to a chip tray for supplying a micro-LED. The present invention provides a chip tray for transporting semiconductor light emitting devices in a fluid contained in an assembly chamber. Specifically, the present invention includes a tray for accommodating a plurality of semiconductor light emitting devices, a chip supply unit configured to supply a plurality of semiconductor light emitting devices to the tray unit and a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit. And the nozzle unit includes holes formed at predetermined intervals on the tray unit to supply the semiconductor light emitting devices at predetermined intervals.

First claim

The invention claimed is:

1 . A chip tray for transferring semiconductor light emitting devices in a fluid accommodated in an assembly chamber, the chip tray comprising:
a tray unit accommodating the semiconductor light emitting devices; a chip supply unit configured to supply the semiconductor light emitting devices to the tray unit; a nozzle unit disposed on the tray unit and configured to supply the semiconductor light emitting devices accommodated in the chip supply unit onto the tray unit; and a transfer unit configured to horizontally and vertically transfer the tray unit and the nozzle unit with respect to a bottom surface of the assembly chamber, wherein the nozzle unit comprises holes disposed at predetermined intervals to supply the semiconductor light emitting devices at predetermined intervals on the tray unit.

2 . The chip tray according to claim 1 , wherein the tray unit comprises a plurality of electromagnets disposed on the tray unit at predetermined intervals and configured to vary a strength of a magnetic field.

3 . The chip tray according to claim 2 , wherein the holes are disposed on an area where the plurality of electromagnets are disposed.

4 . The chip tray according to claim 3 ,
wherein the transfer unit brings the tray unit closer to an assembly substrate within a predetermined distance so that some of the semiconductor light emitting devices accommodated in the tray unit are aligned on a surface of the assembly substrate submerged in the fluid.

5 . The chip tray according to claim 4 , wherein the nozzle unit is fixed on the tray unit, and is transported together with the tray unit.

6 . The chip tray according to claim 4 , wherein the transfer unit comprises an x-axis transfer unit and a z-axis transfer unit, wherein the x-axis transfer unit is fixed to the bottom surface or a side wall of the assembly chamber, and the z-axis transfer unit is fixed on the x-axis transfer unit.

7 . The chip tray according to claim 1 , wherein the tray unit comprises a plurality of recess portions, and a plurality of electromagnets provided in the tray unit are disposed to overlap the plurality of recess portions.

8 . The chip tray according to claim 7 , wherein the holes are disposed on the plurality of recess portions.

9 . The chip tray according to claim 1 , further comprising a chip alignment unit disposed below the tray unit, wherein the chip alignment unit comprises a plurality of electromagnets disposed on the chip alignment unit at predetermined intervals and configured to vary a strength of a magnetic field.

10 . The chip tray according to claim 9 , wherein the plurality of electromagnets form the magnetic field while the tray unit is adjacent to the chip alignment unit within a predetermined distance.

11 . The chip tray according to claim 1 , wherein an inner wall surface of the nozzle unit comprises a screw thread, or a horizontal, vertical, or grid pattern.

12 . A method of supplying semiconductor light emitting devices to an assembly substrate in a fluid contained in an assembly chamber, the method comprising:
supplying the semiconductor light emitting devices on a tray unit; and transferring the tray unit upward with respect to a bottom surface of the assembly chamber so that the tray unit approaches the assembly substrate within a predetermined distance, wherein the supplying the semiconductor light emitting devices on the tray unit supplies the semiconductor light emitting devices at predetermined intervals through a plurality of holes formed on a region where a plurality of electromagnets are disposed in a nozzle unit fixed on the tray unit, and wherein a magnetic field is generated by the plurality of electromagnets provided in the tray unit when a fluid in which the semiconductor light emitting devices are dispersed is supplied on the tray unit from the plurality of holes.

13 . The method according to claim 12 , wherein after the tray unit is brought close to the assembly substrate within the predetermined distance, the method further comprises aggregating the semiconductor light emitting devices accommodated in the tray unit around the chip alignment unit disposed below the tray unit.

14 . The method according to claim 13 , wherein the chip alignment unit comprises the plurality of electromagnets disposed on the chip aligning unit at predetermined intervals and configured to vary the strength of the magnetic field.

15 . The method according to claim 14 , wherein the plurality of electromagnets generate the magnetic field while the tray unit is adjacent to the chip alignment unit within a predetermined distance.

16 . The method according to claim 13 , wherein a transfer unit transfers the tray unit and the nozzle unit, and
wherein the transfer unit comprises an x-axis transfer unit and a z-axis transfer unit, wherein the x-axis transfer unit is fixed to the bottom surface or a side wall of the assembly chamber, and the z-axis transfer unit is fixed on the x-axis transfer unit.

17 . The method according to claim 16 , wherein the x-axis transfer unit transfers the z-axis transfer unit until the tray unit overlaps with a partial region of the assembly substrate to which the semiconductor light emitting devices are not supplied.

18 . The method according to claim 13 , further comprising making the tray unit overlap with a partial region of the assembly substrate to which the semiconductor light emitting devices are not supplied after the tray unit is brought close to the assembly substrate within the predetermined distance.

19 . The method according to claim 13 , wherein an inner wall surface of the nozzle unit includes a thread, or a horizontal, vertical, or grid pattern.

Assignees

• Lg Electronics Inc

Inventors

• Kim Dohee
• Yang Dohwan
• Shin Yongil

Classifications

• H10P72/50

  for positioning, orientation or alignment · CPC title

• H10P72/3212

  the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/00

  Package configurations · CPC title

• H10P72/0446

  Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates · CPC title