Hermetically sealed glass package

Patent metadata

Field	Value
Publication number	US-12595169-B2
Application number	US-202217705714-A
Country	US
Kind code	B2
Filing date	Mar 28, 2022
Priority date	Sep 26, 2019
Publication date	Apr 7, 2026
Grant date	Apr 7, 2026

Abstract

A hermetically sealed package for thermal encapsulation of a functional area includes: a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one functional area hermetically sealed by the package, heat can be generated inside the at least one functional area of the package; and at least one laser bonding line hermetically joining the base substrate and the cover substrate to one another. The at least one laser bonding line has a height perpendicular to its bonding plane.

First claim

What is claimed is:

1 . A hermetically sealed package for thermal encapsulation of a functional area, comprising:
a base substrate; a cover substrate, the base substrate together with the cover substrate forming at least part of the package or forming the package, at least one of the base substrate or the cover substrate being in the form of a thermal insulator; at least one intermediate substrate disposed between the base substrate and the cover substrate; at least one functional area hermetically sealed by the package, wherein heat can be generated inside the at least one functional area of the package; at least one laser bonding line hermetically joining the base substrate and the at least one intermediate substrate and at least one laser bonding line hermetically joining the at least one intermediate substrate to the cover substrate, wherein each of the at least one laser bonding lines have a height (HL) perpendicular to the respective bonding plane; wherein at least the at least one intermediate substrate comprises a vitreous material, wherein the package comprises a plurality of cavities, wherein a plurality of accommodation items is disposed in the package, and wherein the accommodation items are distributed to different cavities, at least one of the accommodation items being a heat generating component; and the at least one intermediate substrate comprises through glass vias for electrically connecting the accommodation items disposed in different cavities, the at least one intermediate substrate having a first surface and a second surface opposite the first surface, the through glass vias being formed through the first surface and the second surface and the first surface and the second surface both being entirely encapsulated within the package.

2 . The hermetically sealed package of claim 1 , wherein at least one of the following is satisfied:
at least one of the base substrate, the at least one intermediate substrate, or the cover substrate is made of a material of low thermal conductivity; or the base substrate, the at least one intermediate substrate, and the cover substrate are in the form of a thermal insulator.

3 . The hermetically sealed package of claim 1 , further comprising at least one electrical connection layer on the at least one intermediate substrate.

4 . The hermetically sealed package of claim 1 , wherein at least one of the base substrate, the at least one intermediate substrate, or the cover substrate is provided in the form of a multilayer composite.

5 . The hermetically sealed package of claim 1 , wherein the at least one laser bonding line having the height HL extends into material of the at least one intermediate substrate and the cover substrate provided above the at least one laser bonding line, and wherein the base substrate, the at least one intermediate substrate, and the cover substrate are joined together by being fused to one another.

6 . The hermetically sealed package of claim 1 , wherein a marker is incorporated in at least one of the base substrate, the at least one intermediate substrate, or the cover substrate.

7 . The hermetically sealed package of claim 1 , wherein the at least one laser bonding line circumferentially surrounds the at least one functional area at a distance (DF) therefrom.

8 . The hermetically sealed package of claim 1 , wherein at least one of the following is satisfied:
the at least one accommodation item comprises at least one of a power semiconductor chip, a GaN light emitting diode, a SiC power transistor, a GaAs power transistor, or a GaN power transistor; or the at least one accommodation item forms part of the package.

9 . The hermetically sealed package of claim 1 , wherein the at least one functional area of the package is adapted for accommodating at least one accommodation item having a size of 10 mm×10 mm or less.

10 . The hermetically sealed package of claim 1 , further comprising at least one cavity and an insulating medium included in the at least one cavity to improve the insulating effect.

11 . The hermetically sealed package of claim 1 , wherein the package is transparent for a range of wavelengths at least one of at least partially or in sections thereof.

12 . The hermetically sealed package of claim 1 , wherein the at least one intermediate substrate is directly joined to the base substrate and/or the cover substrate.

13 . The hermetically sealed package of claim 12 , wherein the base substrate and the cover substrate are made from a vitreous material.

14 . A method for providing a hermetically sealed package according to claim 1 , the package enclosing a functional area in the form of multiple cavities, the method comprising:
providing a base substrate, at least one intermediate substrate, and a cover substrate, the cover substrate being transparent for at least one range of wavelengths at least partially or in sections thereof and therefore being a transparent cover substrate; arranging multiple accommodation items inside the functional area, wherein the accommodation items are distributed to different cavities, at least one of the accommodation items being a heat generating component; arranging the cover substrate on the base substrate above the at least one accommodation item thereby creating at least one contact area between the base substrate and the cover substrate, so that each package has at least one contact area; and hermetically sealing the functional area by forming at least one laser bonding line along the at least one contact area of each package; wherein at least one of the base substrate or the cover substrate is designed to be thermally insulating; wherein at least the at least one intermediate substrate comprises a vitreous material, and the at least one intermediate substrate comprises through glass vias for electrically connecting the accommodation items disposed in different cavities, the at least one intermediate substrate having a first surface and a second surface opposite the first surface, the through glass vias being formed through the first surface and the second surface and the first surface and the second surface both being entirely encapsulated within the package.

15 . The method of claim 14 , wherein a laser beam is directed around the functional area to form the laser bonding line so that the functional area is hermetically sealed circumferentially along the at least one contact area.

Assignees

• Schott Ag

Inventors

• Hettler Robert
• Thomas Jens Ulrich
• Määttänen Antti
• Herzberg Jochen
• Onezawa Yutaka
• Zetterer Thomas

Classifications

• B81C2203/037

  Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036 · CPC title

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81C2203/0109

  Bonding an individual cap on the substrate · CPC title

• B81B3/0081 Primary

  Thermal properties · CPC title

• B23K26/324

  involving non-metallic parts · CPC title