Power module

Patent metadata

Field	Value
Publication number	US-12590995-B2
Application number	US-202318373427-A
Country	US
Kind code	B2
Filing date	Sep 27, 2023
Priority date	Apr 20, 2023
Publication date	Mar 31, 2026
Grant date	Mar 31, 2026

Abstract

A power module includes a first substrate and a second substrate; a semiconductor chip; a resistor electrically connecting the first substrate and the second substrate while being spaced from the semiconductor chip in the horizontal direction, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.

First claim

What is claimed is:

1 . A power module comprising:
a first substrate and a second substrate each including an insulating layer and a metal layer, the first substrate and the second substrate being spaced apart in a vertical direction so that the metal layers of the first substrate and the second substrate face each other; a semiconductor chip disposed between the first substrate and the second substrate; a resistor disposed between the first substrate and the second substrate to electrically connect the first substrate and the second substrate while being spaced from the semiconductor chip, the resistor including a resistance value greater than a resistance value of the metal layer; a first sensing lead connected to a first end portion of the resistor; and a second sensing lead connected to a second end portion of the resistor.

2 . The power module of claim 1 ,
wherein a current is applied to the second substrate from the outside thereof, and wherein the applied current successively flows through the second substrate, the semiconductor chip, and the first substrate, flows into through the first end portion of the resistor, flows out through the second end portion of the resistor, and is transferred to the second substrate.

3 . The power module of claim 2 , wherein the first sensing lead and the second sensing lead are connected to the first substrate and the second substrate, respectively.

4 . The power module of claim 3 , wherein the first sensing lead and the second sensing lead are disposed between the first substrate and the second substrate in a horizontal direction.

5 . The power module of claim 2 , wherein the first sensing lead and the second sensing lead are connected to the second substrate.

6 . The power module of claim 5 , further including a connector configured so that the current in a state prior to passing through the resistor is transferred to the second substrate to which the first sensing lead is connected.

7 . The power module of claim 6 ,
wherein the connector extends in the vertical direction between the first substrate and the second substrate while being spaced from the resistor in a horizontal direction, wherein the first substrate includes a first sensing pattern formed on a portion connected to the first end portion of the resistor so that the current flows to the connector, and wherein the second substrate includes a second sensing pattern formed to make electric conductance between the connector and the first sensing lead.

8 . The power module of claim 6 , wherein the connector extends between the first substrate and the second substrate in the vertical direction to be coupled to the resistor with an insulator interposed between the resistor and the connector so that the connector is electrically disconnected from the resistor.

9 . The power module of claim 6 , wherein at least one of the first end portion and the second end portion of the resistor is electrically separated from the connector.

10 . The power module of claim 6 , wherein the connector extends in the horizontal direction from the first end portion of the resistor toward the outside of the resistor to be bent toward the second substrate and connected to the second substrate.

11 . The power module of claim 10 , wherein the connector makes no contact with the first substrate.

12 . The power module of claim 10 , wherein the connector further extends in the horizontal direction toward the inside of the first end portion of the resistor to overlap the resistor.

13 . The power module of claim 10 , wherein the connector includes:
a first connector extending in a horizontal direction from the first end portion of the resistor toward the outside of the resistor to be bent toward the second substrate and connected to the second substrate; and a second connector extending in the horizontal direction from the second end portion of the resistor toward the outside of the resistor to be connected to the second substrate.

14 . The power module of claim 13 , wherein the first connector further extends in the horizontal direction toward the inside of the first end portion of the resistor to overlap the resistor.

15 . The power module of claim 14 , wherein the second connector further extends in the horizontal direction from the second end portion of the resistor toward the inside of the second end portion of the resistor to overlap the resistor.

16 . The power module of claim 13 , wherein the second connector further extends in the horizontal direction from the second end portion of the resistor toward the inside of the second end portion of the resistor to overlap the resistor.

17 . The power module of claim 2 , wherein the resistor is inserted into at least one of the first substrate and the second substrate.

18 . The power module of claim 17 , wherein the resistor is inserted into the metal layer of the at least one of the first substrate and the second substrate.

19 . The power module of claim 1 , wherein the resistor is made of a material including a temperature coefficient of resistance (TCR), an absolute value of which is equal to or less than a predetermined value.

Assignees

• Hyundai Motor Co Ltd
• Kia Corp

Inventors

• Kim Tae Hwa
• Yang Jin Myeong
• Lee Je Hwan

Classifications

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W90/00 Primary

  Package configurations · CPC title

• H01C1/14

  Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors · CPC title

• H02M7/003

  Constructional details, e.g. physical layout, assembly, wiring or busbar connections · CPC title

• H01C1/08

  Cooling, heating or ventilating arrangements · CPC title