Heatsink for a memory and routing module

Patent metadata

Field	Value
Publication number	US-12588501-B2
Application number	US-202318174997-A
Country	US
Kind code	B2
Filing date	Feb 27, 2023
Priority date	Mar 1, 2022
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

A heatsink is provided for a memory and routing module with a lower and upper side, both sides having multiple semiconductor chips attached. The lower side of the module has a connection component attached for connection to a motherboard. The heatsink includes a module receiving region configured to receive a lower side of the module, including a first thermally conductive portion arranged to face the semiconductor chips, an aperture through the lower heatsink component and a thermally conductive peripheral region disposed around the module receiving region. The heatsink includes an upper heatsink component which is configured to connect to the lower heatsink component at the peripheral region to retain the module. The upper heatsink component includes a lower side. The lower side includes a second thermally conductive portion arranged to face the semiconductor chips disposed on an upper side of the module and multiple second heat dissipating elements.

First claim

The invention claimed is:

1 . A heatsink for a memory and routing module, the memory and routing module having a lower side and an upper side, the lower side having a first plurality of semiconductor chips attached thereto and the upper side having a second plurality of semiconductor chips attached thereto, the lower side further having a first connection component disposed thereon, the memory and routing module configured for electrical connection to a motherboard, the heatsink comprising:
a lower heatsink component comprising:
a module receiving region configured to receive the lower side of the memory and routing module and comprising:
a first thermally conductive portion arranged to face the first plurality of semiconductor chips;
a first aperture through the lower heatsink component configured to permit the first connection component disposed on the lower side of the memory and routing module to connect to a corresponding second connection component disposed on the motherboard;

a thermally conductive peripheral region disposed around the module receiving region, the peripheral region connected to the first thermally conductive portion and comprising a plurality of first heat dissipating elements configured to dissipate heat conducted from the first plurality of semiconductor chips;
an upper heatsink component, the upper heatsink component configured to connect to the lower heatsink component at the peripheral region so as to retain the memory and routing module between the upper heatsink component and the lower heatsink component, the upper heatsink component comprising:
a first side comprising a second thermally conductive portion arranged to face the second plurality of semiconductor chips;
a plurality of second heat dissipating elements connected to the second thermally conductive portion and configured to dissipate heat conducted from the first plurality of semiconductor chips.

2 . The heatsink of claim 1 , wherein:
the lower heatsink component comprises a second aperture in addition to the first aperture, wherein the first aperture and the second aperture are configured to permit the first connection component and a third connection component to connect to the corresponding second connection component and a corresponding fourth connection component on the motherboard; and the first thermally conductive portion is arranged between the first aperture and the second aperture to face the first plurality of semiconductor chips.

3 . The heatsink of claim 1 , wherein the first thermally conductive portion comprises thermal interface material configured to provide conformant thermal conduction across the first plurality of semiconductor chips.

4 . The heatsink of claim 1 , wherein the second thermally conductive portion comprises thermal interface material configured to provide conformant thermal conduction across the second plurality of semiconductor chips.

5 . The heatsink of claim 1 , wherein the module receiving region comprises a recess corresponding in size to a substrate of the memory and routing module.

6 . The heatsink of claim 1 , wherein the first heat dissipating elements and the second heat dissipating elements comprise fins.

7 . The heatsink of claim 1 , wherein the upper heatsink component and the lower heatsink component are configured to clamp the memory and routing module.

8 . The heatsink of claim 1 , further comprising:
a plurality of lugs extending from the upper heatsink component; a plurality of bores formed in the peripheral region of the lower heatsink component; and a plurality of connecting fasteners configured to extend through the lugs and into the bores to connect the upper heatsink component to the lower heatsink component, wherein the lugs are configured to deform towards the lower heatsink component during connection.

9 . The heatsink of claim 1 , wherein the lower heatsink component and the upper heatsink component are formed of aluminum.

10 . The heatsink of claim 1 , wherein the heatsink is a passive heatsink comprising a plurality of heat dissipating fins.

11 . The heatsink of claim 1 , further comprising:
a fastener receivable in a fastener receiving section of the motherboard; wherein the fastener is configured for:
a first phase of attachment in which the fastener is extended into the fastener receiving section without drawing the heatsink towards the motherboard; and
a second phase of attachment in which the fastener draws the heatsink towards the motherboard.

12 . The heatsink of claim 11 , wherein:
the fastener comprises an unthreaded body portion retained in a channel formed in the heatsink, the unthreaded body portion being longer than the channel, and a threaded portion configured to be received in a threaded bore of the fastener receiving section; wherein the unthreaded body portion is configured to travel through the channel in the first phase of attachment.

13 . The heatsink of claim 1 , further comprising a first fastener disposed at one side of the heatsink and a second fastener disposed at an opposing side of the heatsink.

14 . The heatsink of claim 13 , wherein:
the first fastener and the second fastener are disposed in a middle of their respective sides of the heatsink, and the respective sides are substantially parallel with a long edge of a respective connection component.

15 . A method of assembling a memory and routing module and a heatsink, the method comprising:
placing the memory and routing module in a module receiving region of a lower heatsink component, so that a thermally conductive portion of the lower heatsink component faces a plurality of semiconductor chips disposed on a lower side of the memory and routing module; and connecting an upper heatsink component to the lower heatsink component to retain the memory and routing module between the upper heatsink component and the lower heatsink component, wherein the lower heatsink component comprises an aperture and the memory and routing module comprises a first connection component disposed on the lower side of the memory and routing module, and wherein connecting the upper heatsink component to the lower heatsink component comprises disposing the first connection component so that it is permitted to connect to a corresponding second connection component disposed on a motherboard via the aperture.

16 . A mounting component comprising:
a module receiving region configured to receive a memory and routing module, an aperture through the mounting component configured to permit a first connection component disposed on the memory and routing module to connect to a second connection component disposed on a motherboard; and a first fastener receivable in a fastener receiving section of the motherboard, wherein the first fastener is configured for:
a first phase of attachment in which the first fastener is extended into the fastener receiving section without drawing the mounting component towards the motherboard; and
a second phase of attachment in which the first fastener draws the mounting component towards the motherboard.

17 . The mounting component of claim 16 , wherein:
the first fastener comprises an unthreaded body portion retained in a channel formed in the mounting component, the unthreaded body portion being longer than the channel, and a threaded portion configured to be received in a threaded bore of the fastener receiving section; wherein the first fastener is configured to descend through the channel in the first phase of attachment.

18 . The moun

Assignees

• Graphcore Ltd

Inventors

• Bodiley Stephen
• Japp David
• Felix Stephen

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• G06F1/20 Primary

  Cooling means · CPC title

• H10W40/231

  characterised by their places of attachment or cooling paths · CPC title