Micro-device substrate structures with posts and indentations

Patent metadata

Field	Value
Publication number	US-12588471-B2
Application number	US-202318098066-A
Country	US
Kind code	B2
Filing date	Jan 17, 2023
Priority date	Jan 17, 2023
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

A micro-device substrate structure includes a support substrate having a support-substrate surface, spatially separated indentations extending into the support substrate, and a micro-device comprising a micro-device body and micro-device posts. The micro-device posts extend from the micro-device body into the support substrate and each of the posts is disposed at least partly in a different indentation. A release layer can be disposed between the micro-device posts and the support substrate. When the release layer is etched, the micro-device can be completely disconnected from the source substrate, removed from the indentations and source substrate, and micro-transfer printed to a target substrate.

First claim

What is claimed:

1 . A micro-device substrate structure, comprising:
a support substrate having a support-substrate surface; spatially separated indentations extending into the support substrate; and a micro-device comprising a micro-device body and micro-device posts, wherein the micro-device posts extend from the micro-device body into the support substrate and each of the micro-device posts is disposed at least partly in a different one of the spatially separated indentations.

2 . The micro-device substrate structure of claim 1 , wherein the support substrate comprises a cavity extending into the support substrate from the support-substrate surface to a cavity bottom, and wherein the spatially separated indentations are disposed in the cavity bottom and extend into the support substrate from the cavity bottom.

3 . The micro-device substrate structure of claim 2 , wherein the micro-device is disposed at least partially in the cavity.

4 . The micro-device substrate structure of claim 2 , wherein the cavity bottom has a bottom planar area over the support substrate that is planar, the spatially separated indentations together have an indentation area over the support substrate, and the indentation area is less than the bottom planar area.

5 . The micro-device substrate structure of claim 1 , wherein the micro-device posts are not attached to the spatially separated indentations or to the support substrate.

6 . The micro-device substrate structure of claim 1 , wherein the micro-device posts have a shape geometrically similar to the spatially separated indentations.

7 . The micro-device substrate structure of claim 1 , wherein the micro-device posts have a shape that is not geometrically similar to the spatially separated indentations.

8 . The micro-device substrate structure of claim 1 , wherein (i) the micro-device posts extend from the micro-device body a distance greater than a depth of each of the spatially separated indentations, (ii) the micro-device body is spaced apart from the support substrate by a gap, or (iii) both (i) and (ii).

9 . The micro-device substrate structure of claim 1 , wherein the micro-device posts have a distal end having a distal area smaller than an area of a proximal end, the micro-device posts are sharp, or both.

10 . The micro-device substrate structure of claim 1 , wherein the micro-device comprises a micro-device circuit, the micro-device posts are electrically conductive, and the micro-device posts are electrically connected to the micro-device circuit.

11 . The micro-device substrate structure of claim 1 , comprising a release layer disposed between the support substrate and the micro-device.

12 . The micro-device substrate structure of claim 11 , wherein the release layer is differentially etchable from the micro-device.

13 . The micro-device substrate structure of claim 11 , wherein the micro-device has one or more sides that are adjacent to the support substrate and the release layer is disposed between all of the one or more sides of the micro-device and the support substrate.

14 . The micro-device substrate structure of claim 11 , wherein the release layer further surrounds a perimeter of the micro-device.

15 . The micro-device substrate structure of claim 11 , wherein no portion of the micro-device is in direct contact with the support substrate.

16 . The micro-device substrate structure of claim 11 , wherein at least a portion of the release layer is exposed to a local environment.

17 . The micro-device substrate structure of claim 1 , wherein the micro-device comprises three or more posts, the spatially separated indentations comprise three or more indentations, the micro-device posts are arranged in two dimensions, and the spatially separated indentations are arranged in two dimensions.

18 . The micro-device substrate structure of claim 1 , comprising a carrier substrate and a bonding layer that bonds the micro-device to the carrier substrate, and wherein the support substrate is the bonding layer on the carrier substrate.

19 . The micro-device substrate structure of claim 1 , wherein the support substrate is a semiconductor wafer.

20 . The micro-device substrate structure of claim 1 , wherein the micro-device is non-native to the support substrate.

21 . The micro-device substrate structure of claim 1 , wherein the micro-device is native to the support substrate.

22 . The micro-device substrate structure of claim 1 , wherein a surface of the micro-device opposite the support substrate is exposed to a local environment.

Assignees

• X Display Company Tech Ltd

Inventors

• Cok Ronald S
• Bower Christopher Andrew
• Meitl Matthew Alexander

Classifications

• H10P72/7434

  used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10W90/00

  Package configurations · CPC title

• G03F7/0002

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title

• H10P72/7416

  used during dicing or grinding · CPC title