Micro assembled LED displays and lighting elements

Patent metadata

Field	Value
Publication number	US-9520537-B2
Application number	US-201514743981-A
Country	US
Kind code	B2
Filing date	Jun 18, 2015
Priority date	Jun 18, 2014
Publication date	Dec 13, 2016
Grant date	Dec 13, 2016

Abstract

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

First claim

What is claimed is:

1. A display comprising:
a display substrate;
a first patterned metal layer on and in direct contact with a surface of the display substrate;
a dielectric layer on and in direct contact with the display substrate and the first patterned metal layer;
a polymer layer on and in direct contact with the dielectric layer, the polymer layer comprising a material different from the dielectric layer;
a plurality of light emitters on and in direct contact with a surface of the polymer layer, each light emitter of the plurality of light emitters having a first electrical connection and a second electrical connection on a same side of the respective light emitter, wherein the display substrate is non-native to the plurality of light emitters;
a plurality of vias formed through the polymer layer and dielectric layer, each via associated with a corresponding light emitter of the plurality of light emitters; and
a second patterned metal layer, the second patterned metal layer comprising a plurality of first interconnections and a plurality of second interconnections in a single layer, each first interconnection electrically connecting a first electrical connection of a corresponding light emitter of the plurality of light emitters to the first patterned metal layer through a corresponding via of the plurality of vias and each second interconnection electrically contacting the second electrical connection of the corresponding light emitter.

2. The display of claim 1 , wherein the anode and cathode of a respective light emitter are horizontally separated by a horizontal distance, wherein the horizontal distance is from 100 nm to 500 nm, 500 nm to 1 micron, 1 micron to 20 microns, 20 microns to 50 microns, or 50 microns to 100 microns.

3. The display of claim 1 , wherein the plurality of light emitters comprise a plurality of inorganic light emitting diodes.

4. The display of claim 1 , wherein the display substrate has a thickness from 5 to 10 microns, 10 to 50 microns, 50 to 100 microns, 100 to 200 microns, 200 to 500 microns, 500 microns to 0.5 mm, 0.5 to 1 mm, 1 mm to 5 mm, 5 mm to 10 mm, or 10 mm to 20 mm.

5. The display of claim 1 , wherein each of the plurality of light emitters has a width from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm.

6. The display of claim 1 , wherein each of the plurality of light emitters has a length from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, or 20 to 50 μm.

7. The display of claim 1 , wherein each of the plurality of light emitters has with a height from 2 to 5 μm, 4 to 10 μm, 10 to 20 μm, or 20 to 50 μm.

8. The display of claim 1 , wherein display substrate has a transparency greater than or equal to 50%, 80%, 90%, or 95% for visible light.

9. The display of claim 1 , wherein the display substrate has a contiguous display substrate area, the plurality of light emitters each have a light-emissive area, and the combined light-emissive areas of the plurality of light emitters is less than or equal to one-quarter of the contiguous display substrate area.

10. The display of claim 9 , wherein the combined light-emissive areas of the plurality of light emitters is less than or equal to one eighth, one tenth, one twentieth, one fiftieth, one hundredth, one five-hundredth, one thousandth, one two-thousandth, or one ten-thousandth of the contiguous display substrate area.

11. The display of claim 1 , wherein display substrate has a transparency greater than or equal to 50%, 80%, 90%, or 95% for visible light.

12. The display of claim 1 , wherein the display substrate is a member selected from the group consisting of polymer, plastic, resin, polyimide, PEN, PET, metal, metal foil, glass, a semiconductor, and sapphire.

13. The display of claim 1 , wherein the first patterned metal layer comprises a metal stack.

14. The display of claim 13 , wherein the metal stack comprises Aluminum and Titanium.

15. The display of claim 14 , wherein the Titanium is on the Aluminum.

16. The display of claim 1 , wherein the polymer layer is a photosensitive negative-acting semiconductor-grade epoxy.

17. The display of claim 1 , the plurality of light emitters having been micro-transfer printed on the surface of the polymer layer using a print tool.

18. The display of claim 17 , wherein the print tool is a viscoelastic elastomer stamp.

19. The display of claim 1 , wherein the second patterned metal layer comprises a metal stack.

20. The display of claim 1 , wherein the plurality of light emitters comprises a plurality of red light emitters that emit red light, a plurality of green light emitters that emit green light, and a plurality of blue light emitters that emit blue light.

Assignees

• X Celeprint Ltd

Inventors

• Bower Christopher
• Meitl Matthew
• Gomez David
• Bonafede Salvatore
• Kneeburg David
• Fecioru Alin
• Prevatte Carl

Classifications

• H10W72/874

  On different surfaces · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title