Bottom purge for semiconductor processing system

Patent metadata

Field	Value
Publication number	US-12588451-B2
Application number	US-202016844121-A
Country	US
Kind code	B2
Filing date	Apr 9, 2020
Priority date	Apr 9, 2020
Publication date	Mar 24, 2026
Grant date	Mar 24, 2026

Abstract

Exemplary substrate processing systems may include a plurality of processing regions. The systems may include a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions. The systems may include a plurality of substrate supports, and each substrate support of the plurality of substrate supports may be vertically translatable between the transfer region and an associated processing region of the plurality of processing regions. The systems may include a transfer apparatus including a rotatable shaft extending through the transfer region housing. The transfer apparatus may include an end effector coupled with the rotatable shaft. The end effector may include a central hub defining a central aperture fluidly coupled with a purge source. The end effector may also include a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.

First claim

The invention claimed is:

1 . A substrate processing system comprising:
a plurality of processing regions; a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions; a plurality of substrate supports, each substrate support of the plurality of substrate supports vertically translatable between the transfer region and an associated processing region of the plurality of processing regions; and a transfer apparatus comprising:
a rotatable shaft extending through the transfer region housing, and
an end effector coupled with the rotatable shaft, wherein the end effector includes a central hub defining a central aperture fluidly coupled with a purge source, wherein the central aperture extends through a top surface of the central hub, and wherein the end effector further includes a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.

2 . The substrate processing system of claim 1 , further comprising:
a plurality of purge channels having a number of purge channels equal to the number of substrate supports of the plurality of substrate supports.

3 . The substrate processing system of claim 2 , wherein each purge channel of the plurality of purge channels extends through the transfer region housing proximate a separate substrate support of the plurality of substrate supports.

4 . The substrate processing system of claim 2 , wherein each processing region of the plurality of processing regions is at least partially defined from above by a separate lid stack, and wherein each lid stack comprises a pumping liner fluidly coupled with an exhaust of the substrate processing system.

5 . The substrate processing system of claim 4 , wherein each pumping liner at least partially defines an exhaust flow path from each processing region for a purge gas delivered through the plurality of purge channels.

6 . The substrate processing system of claim 1 , wherein the rotatable shaft defines one or more apertures fluidly coupled with the purge source, the one or more apertures configured to deliver purge gas to a central volume of the transfer region at least partially defined by the central hub of the end effector.

7 . The substrate processing system of claim 6 , wherein the purge source is configured to deliver greater than or about 75% of a purge gas through the one or more apertures relative to the central aperture defined through the central hub.

8 . The substrate processing system of claim 1 , wherein the plurality of substrate supports comprises at least three substrate supports distributed about the transfer region, and wherein the transfer apparatus is centrally located between the plurality of substrate supports.

9 . A substrate processing system comprising:
a plurality of processing regions; a transfer region housing defining a transfer region fluidly coupled with the plurality of processing regions; a plurality of substrate supports, each substrate support of the plurality of substrate supports vertically translatable between the transfer region and an associated processing region of the plurality of processing regions; a plurality of purge channels defined through the transfer region housing, a number of purge channels of the plurality of purge channels equal to a number of substrate supports of the plurality of substrate supports; and a transfer apparatus comprising:
a rotatable shaft extending through the transfer region housing, and
an end effector coupled with the rotatable shaft, wherein the end effector includes a central hub defining a central aperture fluidly coupled with a purge source, wherein the central aperture extends through a top surface of the central hub, and wherein the end effector further includes a plurality of arms having a number of arms equal to a number of substrate supports of the plurality of substrate supports.

10 . The substrate processing system of claim 9 , wherein each processing region of the plurality of processing regions is at least partially defined from above by a separate lid stack, and wherein each lid stack comprises a pumping liner fluidly coupled with an exhaust of the substrate processing system.

11 . The substrate processing system of claim 9 , wherein each pumping liner at least partially defines an exhaust flow path from each processing region for a purge gas delivered through the plurality of purge channels.

12 . The substrate processing system of claim 9 , wherein the rotatable shaft defines one or more apertures fluidly coupled with a purge source, the one or more apertures configured to deliver purge gas to a central volume of the transfer region at least partially defined by the central hub of the end effector.

Assignees

• Applied Materials Inc

Inventors

• Pathak Nitin
• Prabhakar Vinay
• Ramamurthi Badri N
• Kalsekar Viren
• Nguyen Tuan A
• Rocha-Alvarez Juan Carlos

Classifications

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3312

  Vertical transfer of a batch of workpieces · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title