Electronic module and method for manufacturing electronic module
US-2019371703-A1 · Dec 5, 2019 · US
Semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor
US12581983B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12581983-B2 |
| Application number | US-202017608770-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 30, 2020 |
| Priority date | May 8, 2019 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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- Title
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Abstract
Official abstract text for this publication.
Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fastening a bent or folded shaped metal body of a constant thickness to the semiconductor by means of a first fastening method and then fastening the electrical conductor to the shaped metal body by means of a second fastening method.
First claim
Opening claim text (preview).
What is claimed is: 1 . A semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor for forming an electrically conducting contact surface for an electrical conductor, wherein the electrical conductor is stacked on top of the semiconductor, wherein the shaped metal body is bent or folded, wherein the bend or fold of the shaped metal body is located between a first surface of the semiconductor and an opposing surface of the electrical conductor, wherein the shaped metal body is connected to the first surface of the semiconductor by sintering, soldering, adhesive bonding or nanowires, and wherein the shaped metal body is connected to the opposing surface of the electrical conductor by ultrasonic welding, laser welding or thermosonic bonding. 2 . The semiconductor module according to claim 1 , wherein the shaped metal body is bent multiple times or folded multiple times. 3 . The semiconductor module according to claim 1 , wherein the shaped metal body is corrugated. 4 . The semiconductor module according to claim 1 , wherein the shaped metal body consists of aluminum (Al) or copper (Cu). 5 . The semiconductor module according to claim 1 , wherein the electrical conductor is a lead frame or a ribbon. 6 . The semiconductor module according to claim 1 , wherein the semiconductor is produced from silicon carbide (SiC), at least in part. 7 . The semiconductor module according to claim 1 , wherein the shaped metal body is electrically connected to the semiconductor over the entire surface of the shaped metal body facing the semiconductor. 8 . The semiconductor module according to claim 1 , wherein recesses formed in the shaped metal body and facing the semiconductor are filled with sintering, soldering, adhesive bonding material or nanowires. 9 . A method for establishing electrical contacting between an electrical conductor and a semiconductor, said method comprising the steps of: first, fastening a bent or folded shaped metal body to the semiconductor by a first fastening method, and second, fastening the electrical conductor to the shaped metal body by a second fastening method, wherein the bend or fold of the shaped metal body is located between a first surface of the semiconductor and an opposing surface of the electrical conductor, and wherein the second fastening method includes ultrasonic welding, laser welding or thermosonic bonding. 10 . The method according to claim 9 , wherein the electrical conductor is a lead frame or a ribbon. 11 . The method according to claim 9 , wherein the semiconductor is produced from silicon carbide (SiC), at least in part. 12 . The method according to claim 9 , wherein the first fastening method includes sintering, soldering or adhesive bonding. 13 . The method according to claim 9 , wherein the first fastening method includes growing nanowires. 14 . The method according to claim 9 , wherein the shaped metal body is electrically connected to the semiconductor over the entire surface of the shaped metal body facing the semiconductor. 15 . The method according to claim 9 , wherein recesses formed in the shaped metal body and facing the semiconductor are filled with sintering, soldering, adhesive bonding material or nanowires. 16 . A semiconductor module comprising a semiconductor and comprising a shaped metal body that is electrically contacted by the semiconductor for forming an electrically conducting contact surface for an electrical conductor, wherein the electrical conductor is stacked on top of the semiconductor, wherein the shaped metal body is bent or folded, wherein the bend or fold of the shaped metal body is located between a first surface of the semiconductor and an opposing surface of the electrical conductor, wherein the shaped metal body is connected to the semiconductor by nanowires, and wherein the shaped metal body is connected to the electrical conductor by nanowires. 17 . The method according to claim 16 , wherein the electrical conductor is a lead frame or a ribbon. 18 . The semiconductor module according to claim 16 , wherein the shaped metal body consists of aluminum (Al) or copper (Cu). 19 . The semiconductor module according to claim 16 , wherein the shaped metal body is electrically connected to the semiconductor over the entire surface of the shaped metal body facing the semiconductor. 20 . The semiconductor module according to claim 16 , wherein the nanowires are grown from one or more of the surfaces to be connected and then the surfaces are brought together.
Assignees
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Classifications
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title
changes in shapes · CPC title
changes in structures or sizes · CPC title
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Frequently asked questions
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- What does patent US12581983B2 cover?
- Semiconductor module including a semiconductor and including a shaped metal body that is electrically contacted by the semiconductor, for forming a contact surface for an electrical conductor, wherein the shaped metal body is bent or folded. A method is also described for establishing electrical contacting of an electrical conductor on a semiconductor, said method including the steps of: fasten…
- Who is the assignee on this patent?
- Danfoss Silicon Power Gmbh
- What technology area does this patent fall under?
- Primary CPC classification H10W72/076. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).