Thermal interface layer

Patent metadata

Field	Value
Publication number	US-12581949-B2
Application number	US-202117792815-A
Country	US
Kind code	B2
Filing date	Jan 14, 2021
Priority date	Jan 22, 2020
Publication date	Mar 17, 2026
Grant date	Mar 17, 2026

Abstract

A thermal interface layer includes pluralities of first and second particles dispersed in a polymeric binder at a total loading V in a range of about 40 volume percent to about 70 volume percent. The first and second particles have different compositions. The first particles include one or more of iron or nickel. The second particles include one or more of aluminum, magnesium, silicon, copper, or zinc. The thermal interface layer has a thermal conductivity in a thickness direction of the thermal interface layer in units of W/mK of at least K=5.1−0.17 V+0.002 V 2 .

First claim

What is claimed is:

1 . A thermal interface layer having opposing first and second major surfaces and comprising a plurality of alternating substantially continuous layers of magnetically responsive first and thermally conductive second particles, the alternating layers generally extending along orthogonal first and second directions and arranged along a third direction, the first and second particles having different compositions, the second particles having a thermal conductivity of at least 10 W/mK, wherein the second particles are agglomerated into the substantially continuous layers of the second particles due to an agglomeration of the first particles into the substantially continuous layers of the first particles without the first particles being attached to the second particles,
wherein for at least one layer of the plurality of alternating substantially continuous layers, the layer has a thickness along the third direction that is smaller near the first major surface and larger near the second major surface, such that near the first major surface, but not near the second major surface, the particles of the layer are agglomerated within the layer so as to form alternating higher and lower density regions within the layer that are arranged along the third direction.

2 . The thermal interface layer of claim 1 , wherein the first and second particles have respective real parts of relative permeability m′ 1 and m′ 2 such that for at least one frequency less than about 1 GHZ, m′ 1 /m′ 2 ≥5.

3 . The thermal interface layer of claim 1 , wherein the opposing first and second major surfaces are spaced apart by a distance D along a thickness direction of the thermal interface layer, wherein each layer has a length L along the first direction from a first to an opposing second edge of the thermal interface layer, L/D≥100.

4 . The thermal interface layer of claim 3 , wherein the thickness direction is substantially parallel to the second direction.

5 . The thermal interface layer of claim 3 , wherein the first particles comprise a plurality of first flakes, each first flake extending generally along a plane of the first flake, each first flake in at least a majority of the first flakes being oriented such that the plane of the first flake makes an angle of less than 40 degrees with the thickness direction of the thermal interface layer, the first particles causing the second particles to at least partially align.

6 . The thermal interface layer of claim 1 , wherein the first and second particles are dispersed in a polymeric matrix, the polymeric matrix comprising at least 50 percent by volume of the thermal interface layer.

7 . The thermal interface layer of claim 1 , wherein a total volume loading of the first and second particles in the thermal interface layer is in a range of about 20 percent to about 55 percent.

8 . The thermal interface layer of claim 1 , wherein a total volume percent of the first and second particles is V, and wherein a thermal conductivity of the thermal interface layer in a thickness direction of the thermal interface layer in units of W/mK is at least K=5.1−0.17 V+0.002 V 2 , the second particles comprising one or more of aluminum, magnesium, silicon, copper, or zinc.

Assignees

• 3M Innovative Properties Company

Inventors

• Carpenter Samuel J
• Nienaber Aaron K
• Eckel Joseph B
• Jesme Ronald D
• Podkaminer Jacob P
• Ho Victor
• Goris Sebastian
• Johnson Matthew T
• Graff Michael S
• Kong Steven H

Classifications

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/251 Primary

  Organics · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title

• H10W40/257 Primary

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H01L23/42

  Electricity · mapped topic