Method of and apparatus for protecting a switch, such as a MEMS switch, and to a MEMS switch including such a protection apparatus
US-10855073-B2 · Dec 1, 2020 · US
Electronic module
US12580144B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12580144-B2 |
| Application number | US-202118003534-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 19, 2021 |
| Priority date | Jun 29, 2020 |
| Publication date | Mar 17, 2026 |
| Grant date | Mar 17, 2026 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.
First claim
Opening claim text (preview).
The invention claimed is: 1 . An electronic module comprising: a microelectromechanical system (MEMS) switch configured to open when voltages of matching polarity are applied to a first control contact and a second control contact; a substrate; and a semiconductor component including a diode configured to provide overvoltage protection; wherein the semiconductor component is formed with the substrate and connected to the MEMS switch; and wherein the substrate comprises a silicon-on-insulator-wafer and/or silicon-on-insulator substrate. 2 . The electronic module as claimed in claim 1 , wherein the semiconductor component is formed by doping the substrate. 3 . The electronic module as claimed in claim 1 , wherein the diode comprises a pn-diode, a Schottky diode, and/or a PIN diode. 4 . The electronic module as claimed in claim 1 , wherein the semiconductor component includes an arrangement of diodes in series. 5 . The electronic module as claimed in claim 1 , wherein the semiconductor component includes an arrangement of diodes in parallel. 6 . The electronic module as claimed in claim 1 , wherein the semiconductor component connects a source terminal and a drain terminal of the MEMS switch. 7 . The electronic module as claimed in claim 1 , wherein the semiconductor component connects gate terminals of the MEMS switch to each other. 8 . The electronic module as claimed in claim 1 , wherein the semiconductor component is part of a supply line to a source terminal and/or a drain terminal and/or a gate terminal of the MEMS switch. 9 . The electronic module as claimed in claim 1 , wherein the MEMS switch includes a flexure. 10 . The electronic module as claimed in claim 9 , in which the flexure comprises a flexure beam.
Assignees
Inventors
Classifications
Protective switches or relays using micromechanics · CPC title
Details of the protective switches or relays covered by groups H01H73/00 - H01H83/00 · CPC title
Switches making use of microelectromechanical systems [MEMS] (for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009) · CPC title
having a cantilever fixed on one side connected to one or more dimples · CPC title
with perpendicular movement of the movable contact relative to the substrate · CPC title
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Frequently asked questions
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- What does patent US12580144B2 cover?
- Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-in…
- Who is the assignee on this patent?
- Siemens Ag, Bosch Gmbh Robert
- What technology area does this patent fall under?
- Primary CPC classification H01H59/0009. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Mar 17 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).