Hybrid filter, preparation method thereof, and filtering apparatus

US12574010B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12574010-B2
Application numberUS-202218290818-A
CountryUS
Kind codeB2
Filing dateAug 24, 2022
Priority dateAug 24, 2022
Publication dateMar 10, 2026
Grant dateMar 10, 2026

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a hybrid filter, a preparation method thereof, and a filtering apparatus. The hybrid filter includes a first substrate ( 100 ) and a second substrate ( 200 ) disposed oppositely, a first space ( 300 ) is disposed between the first substrate ( 100 ) and the second substrate ( 200 ), at least one of the first substrate ( 100 ) and the second substrate ( 200 ) is provided with a film bulk acoustic resonator ( 30 ), at least one of the first substrate ( 100 ) and the second substrate ( 200 ) is provided with at least one passive filter ( 40 ), the film bulk acoustic resonator ( 30 ) is disposed in the first space ( 300 ) and is connected with the passive filter ( 40 ), the passive filter ( 40 ) includes a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A hybrid filter, comprising a first substrate and a second substrate disposed oppositely, wherein a first space is disposed between the first substrate and the second substrate, at least one of the first substrate and the second substrate is provided with a film bulk acoustic resonator, at least one of the first substrate and the second substrate is provided with at least one passive filter, the film bulk acoustic resonator is disposed in the first space and connected with the at least one passive filter, the at least one passive filter comprises a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure, wherein n conductive pillars penetrating through a first base substrate of the first substrate in a thickness direction are disposed on the first base substrate, (n−1)/2 first connection lines are disposed on a side of the first base substrate away from the second substrate, (n−1)/2 second connection lines are disposed on a side of the first base substrate close to the second substrate, the first connection lines are respectively connected with an i-th conductive pillar and an (i+1)-th conductive pillar among the n conductive pillars, the second connection lines are respectively connected with the (i+1)-th conductive pillar and an (i+2)-th conductive pillar among the n conductive pillars, a first conductive pillar among the n conductive pillars is connected with a second electrode of the film bulk acoustic resonator, an n-th conductive pillar among the n conductive pillars is connected with the filtering capacitor, the n conductive pillars, the (n−1)/2 first connection lines, and the (n−1)/2 second connection lines constitute the filtering inductor with the three-dimensional spiral inductor structure, wherein n is an odd number greater than 1 and i is a positive integer greater than or equal to 1 and less than or equal to n−2. 2 . The hybrid filter according to claim 1 , wherein the first substrate at least comprises the first base substrate and a first connection block disposed on a side of the first base substrate close to the second substrate, the second substrate at least comprises a second base substrate and a second connection block disposed on a side of the second base substrate close to the first substrate, the first connection block and the second connection block are connected by means of bonding, the first space accommodating the film bulk acoustic resonator is formed between the first base substrate and the second base substrate, and materials of the first base substrate and the second base substrate comprise glass. 3 . The hybrid filter according to claim 2 , wherein the first connection block and the second connection block connected by means of bonding form a ring-shaped sealing structure on a plane parallel to the hybrid filter, and the first space is a gas-sealed and/or acoustic-sealed sealed space enclosed by the first base substrate, the second base substrate, and the ring-shaped sealing structure. 4 . The hybrid filter according to claim 1 , wherein the film bulk acoustic resonator at least comprises a cavity, a first electrode disposed on the first base substrate, a piezoelectric layer disposed on a side of the first electrode away from the first base substrate, and a second electrode disposed on a side of the piezoelectric layer away from the first base substrate; the cavity is a groove disposed on a side of the first base substrate close to the second substrate, or the cavity is a through slot disposed on the first base substrate, or the cavity is a space enclosed by a surface of the first base substrate on a side close to the second substrate, the first electrode, and the piezoelectric layer. 5 . The hybrid filter according to claim 1 , wherein the filtering capacitor comprises a first electrode plate, a second electrode plate, and a dielectric layer disposed between the first electrode plate and the second electrode plate, wherein the first electrode plate is disposed on a side of the first base substrate away from the second substrate and connected with the n-th conductive pillar among the n conductive pillars, the dielectric layer is disposed on a side of the first electrode plate away from the first base substrate, the second electrode plate is disposed on a side of the dielectric layer away from the first base substrate, and an orthographic projection of the first electrode plate on the first base substrate is at least partially overlapped with an orthographic projection of the second electrode plate on the first base substrate. 6 . The hybrid filter according to claim 5 , wherein the hybrid filter further comprises a first terminal and a second terminal, the first terminal is disposed on a side of the first base substrate away from the second substrate and connected with a first electrode of the film bulk acoustic resonator, and the second terminal is disposed on a side of the dielectric layer away from the first base substrate and connected with the second electrode plate. 7 . The hybrid filter according to claim 6 , wherein an electrode conductive pillar penetrating through the first base substrate in a thickness direction is disposed on the first base substrate, and the first electrode of the film bulk acoustic resonator is connected with the first terminal through the electrode conductive pillar. 8 . The hybrid filter according to claim 1 , wherein a first passive filter of the at least one passive filter is disposed on the second substrate, or a first passive filter and a second passive filter of the at least one passive filter are disposed on the second substrate, the first passive filter and the second passive filter are disposed on both sides of the film bulk acoustic resonator, the first passive filter comprises a first filtering inductor and a first filtering capacitor connected with each other, and the second passive filter comprises a second filtering inductor and a second filtering capacitor connected with each other. 9 . A hybrid filter, comprising a first substrate and a second substrate disposed oppositely, wherein a first space is disposed between the first substrate and the second substrate, at least one of the first substrate and the second substrate is provided with a film bulk acoustic resonator, at least one of the first substrate and the second substrate is provided with at least one passive filter, the film bulk acoustic resonator is disposed in the first space and connected with the at least one passive filter, the at least one passive filter comprises a filtering inductor and a filtering capacitor, and the filtering inductor has a three-dimensional spiral inductor structure, wherein a first passive filter of the at least one passive filter is disposed on the second substrate, or a first passive filter and a second passive filter of the at least one passive filter are disposed on the second substrate, the first passive filter and the second passive filter are disposed on both sides of the film bulk acoustic resonator, the first passive filter comprises a first filtering inductor and a first filtering capacitor connected with each other, and the second passive filter comprises a second filtering inductor and a second filtering capacitor connected with each other, wherein n conductive pillars penetrating through a second base substrate of the second substrate in a thickness direction are disposed on the second base substrate, (n−1)/2 first connection lines are disposed on a side of the second base substrate away from the first substrate, (n−1)/2 second connection lines are disposed on a side of the second base substrate close to the first substrate, the first connection lines are respectively connect

Assignees

Inventors

Classifications

  • having a single resonator (crystal tuning forks H03H9/21) · CPC title

  • for electromechanical delay lines or filters · CPC title

  • H03H3/02Primary

    for the manufacture of piezoelectric or electrostrictive resonators or networks (H03H3/08 takes precedence) · CPC title

  • the resonators or networks being of the air-gap type · CPC title

  • the enclosure being defined by a cover cap mounted on an element forming part of the BAW device · CPC title

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What does patent US12574010B2 cover?
The present disclosure provides a hybrid filter, a preparation method thereof, and a filtering apparatus. The hybrid filter includes a first substrate ( 100 ) and a second substrate ( 200 ) disposed oppositely, a first space ( 300 ) is disposed between the first substrate ( 100 ) and the second substrate ( 200 ), at least one of the first substrate ( 100 ) and the second substrate ( 200 ) is pr…
Who is the assignee on this patent?
Beijing Boe Optoelectronics Tech Co Ltd, Boe Technology Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification H03H3/02. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).