Fan-out electronic component package

Patent metadata

Field	Value
Publication number	US-2018337136-A1
Application number	US-201815980970-A
Country	US
Kind code	A1
Filing date	May 16, 2018
Priority date	May 16, 2017
Publication date	Nov 22, 2018
Grant date	—

Abstract

A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.

First claim

What is claimed is:

1 . A fan-out electronic component package, comprising:
a core member comprising a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other; a first electronic component disposed in the through-hole, and comprising filters configured to filter different frequency bands; a first encapsulant disposed to cover portions of the core member and the first electronic component, and fill portions of the through-hole; a connection member disposed on the core member and the first electronic component, and comprising a redistribution layer electrically connected to the wiring layers and the first electronic component; a second electronic component disposed on the connection member and electrically connected to the redistribution layer; and a second encapsulant disposed to cover the second electronic component.

2 . The fan-out electronic component package of claim 1 , wherein the connection member comprises an insulating layer, the redistribution layer disposed on the insulating layer, and vias configured to electrically connect the redistribution layer and the first electronic component to each other.

3 . The fan-out electronic component package of claim 1 , wherein 1-1-th connection pads electrically connected to the connection member and 1-2-th connection pads electrically connected to a mainboard of an electronic device are formed on the first electronic component.

4 . The fan-out electronic component package of claim 1 , wherein the first electronic component comprises:
first and second substrates coupled to each other to form an internal space; a first filter formed on the first substrate to be disposed in the internal space, and comprising a bulk acoustic resonator; and a second filter formed on the second substrate.

5 . The fan-out electronic component package of claim 4 , wherein 1-1-th connection pads electrically connected to the redistribution layer are formed on the second substrate, and
1-2-th connection pads electrically connected to a mainboard of an electronic device are formed on the first substrate.

6 . The fan-out electronic component package of claim 5 , further comprising:
a backside wiring layer disposed on a surface of the first encapsulant opposing another surface of the first encapsulant on which the connection member is disposed; backside vias configured to penetrate through the first encapsulant and connect the backside wiring layer to the 1-2-th connection pads; and underbump metal layers connected to the backside wiring layer.

7 . The fan-out electronic component package of claim 4 , wherein the second filter is formed on an outer surface of the second substrate.

8 . The fan-out electronic component package of claim 4 , wherein the first substrate and the second substrate are high resistivity silicon (HRS) substrates.

9 . A fan-out electronic component package, comprising:
a first structure comprising:
a first electronic component having a 1-1-th active surface and a 1-2-th active surface, wherein 1-1-th connection pads are disposed on the 1-1-th active surface, 1-2-th connection pads are disposed on the 1-2-th active surface, and the 1-2-th active surface opposes the 1-1-th active surface;
a first encapsulant encapsulating portions of the first electronic component; and
a first connection member disposed on the 1-1-th active surface and comprising a first redistribution layer electrically connected to the 1-1-th connection pads; and
a second structure comprising:
a second electronic component having a second active surface, wherein second connection pads are disposed on the second active surface;
a second encapsulant encapsulating portions of the second electronic component; and
a second connection member disposed on the second active surface and comprising a second redistribution layer electrically connected to the second connection pads,
wherein the first electronic component comprises filters configured to filter different frequency bands.

10 . The fan-out electronic component package of claim 9 , further comprising:
a backside wiring layer disposed on a surface of the first encapsulant opposing another surface of the first encapsulant on which the first connection member is disposed; backside vias configured to penetrate through the first encapsulant and connect the backside wiring layer to the 1-2-th connection pads; and underbump metal layers connected to the backside wiring layer.

11 . The fan-out electronic component package of claim 9 , wherein the first electronic component comprises:
first and second substrates coupled to each other to form an internal space; a first filter formed on the first substrate to be disposed in the internal space, connected to the 1-2-th connection pads, and comprising a bulk acoustic resonator; and a second filter formed on the second substrate to be disposed outside the internal space and connected to the 1-1-th connection pads.

12 . The fan-out electronic component package of claim 9 , wherein the first structure further comprises a first core member having a first through-hole, and
the first electronic component is disposed in the first through-hole.

13 . The fan-out electronic component package of claim 9 , wherein the first structure further comprises a first core member having a first through-hole and a second through-hole spaced apart from the first through-hole, and
the first electronic component is disposed in the first through-hole, and a semiconductor chip is disposed in the second through-hole.

Assignees

• Samsung Electro Mech

Inventors

• Han Myeong Woo
• Jeong Chan Yong

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W70/6528

  of the portions that connect to chips, wafers or package parts · CPC title

• H10W44/248

  for antennas · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W90/00

  Package configurations · CPC title