Catalyst systems for olefin polymerization
US-9751998-B2 · Sep 5, 2017 · US
US12570841B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12570841-B2 |
| Application number | US-202017789424-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 21, 2020 |
| Priority date | Dec 31, 2019 |
| Publication date | Mar 10, 2026 |
| Grant date | Mar 10, 2026 |
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Embodiments of a polyethylene composition are provided, which may include a first polyethylene fraction comprising at least one peak in a temperature range of from 35° C. to 70° C. in an elution profile via improved comonomer composition distribution (iCCD) analysis method, where a first polyethylene area fraction is an area in the elution profile from 35° C. to 70° C., and where the first polyethylene fraction area comprises from 25% to 65% of the total area of the elution profile; and a second polyethylene fraction comprising at least one peak in a temperature range of from 85° C. to 120° C. in the elution profile, where a second polyethylene area fraction is an area in the elution profile from 85° C. to 120° C., and where the second polyethylene fraction area comprises at least 20% of the total area of the elution profile.
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The invention claimed is: 1 . A polyethylene composition comprising: (a) a first polyethylene fraction comprising at least one peak in a temperature range of from 35° C. to 70° C. in an elution profile via improved comonomer composition distribution (iCCD) analysis method, wherein a first polyethylene area fraction is an area in the elution profile from 35° C. to 70° C., and wherein the first polyethylene fraction area comprises from 25% to 65% of the total area of the elution profile; (b) a second polyethylene fraction comprising at least one peak in a temperature range of from 85° C. to 120° C. in the elution profile via iCCD analysis method, wherein a second polyethylene area fraction is an area in the elution profile from 85° C. to 120° C., and wherein the second polyethylene fraction area comprises at least 20% of the total area of the elution profile; and (c) a third polyethylene fraction in a temperature range of from 70° C. to 85° C. in the elution profile via iCCD analysis method, wherein the third polyethylene area fraction is an area in the elution profile from 70° C. to 85° C., and wherein the third polyethylene fraction area comprises less than 10% of the total area of the elution profile; and wherein the polyethylene composition has a density of 0.880 g/cm 3 to 0.910 g/cm 3 , a melt index (I 2 ) of 0.50 g/10 minutes to 6.0 g/10 minutes, and a zero shear viscosity ratio of the polyethylene composition less than 2.0. 2 . The polyethylene composition of claim 1 , further comprising a fourth polyethylene fraction comprising at least one peak in a temperature range of from 20° C. to 35° C. in an elution profile via improved comonomer composition distribution (iCCD) analysis method, wherein a fourth polyethylene area fraction is an area in the elution profile from 20° C. to 35° C., and wherein the fourth polyethylene fraction area comprises from 0% to 35% of the total area of the elution profile. 3 . The polyethylene composition of claim 1 , wherein the first polyethylene fraction area comprises from 30% to 55% of the total area of the elution profile. 4 . The polyethylene composition of claim 1 , wherein the second polyethylene fraction area comprises from 20% to 45% of the total area of the elution profile. 5 . The polyethylene composition of claim 1 , wherein the third polyethylene fraction area comprises from 4% to 10% of the total area of the elution profile. 6 . The polyethylene composition of claim 1 , wherein the polyethylene composition has a molecular weight distribution, expressed as the ratio of the weight average molecular weight to number average molecular weight (Mw/Mn) in the range of from 2.0 to 6.0. 7 . The polyethylene composition of claim 1 , wherein a ratio of the molecular weight of the first polyethylene fraction to the molecular weight of the total area of the elution profile is from 0.5 to 1.5. 8 . The polyethylene composition of claim 1 , wherein the polyethylene composition has a tan delta, measured at 0.1 radian/sec and 190° C., from 10 to 100. 9 . A multilayer film comprising, at least one layer comprising a polyethylene composition comprising: (a) a first polyethylene fraction comprising at least one peak in a temperature range of from 35° C. to 70° C. in an elution profile via improved comonomer composition distribution (iCCD) analysis method, wherein a first polyethylene area fraction is an area in the elution profile from 35° C. to 70° C., and wherein the first polyethylene fraction area comprises from 25% to 65% of the total area of the elution profile; (b) a second polyethylene fraction comprising at least one peak in a temperature range of from 85° C. to 120° C. in the elution profile via iCCD analysis method, wherein a second polyethylene area fraction is an area in the elution profile from 85° C. to 120° C., and wherein the second polyethylene fraction area comprises at least 20% of the total area of the elution profile; and (c) a third polyethylene fraction in a temperature range of from 70° C. to 85° C. in the elution profile via iCCD analysis method, wherein the third polyethylene area fraction is an area in the elution profile from 70° C. to 85° C., and wherein the third polyethylene fraction area comprises less than 10% of the total area of the elution profile; and wherein the polyethylene composition has a density of 0.880 g/cm 3 to 0.910 g/cm 3 , a melt index (I 2 ) of 0.50 g/10 minutes to 6.0 g/10 minutes, and a zero shear viscosity ratio of the polyethylene composition less than 2.0. 10 . The multilayer film of claim 9 , wherein the at least one layer comprising a polyethylene composition is a sealant layer. 11 . The multilayer film of claim 10 , further comprising a substrate layer. 12 . A method of producing an article comprising the steps of: applying the polyethylene composition of claim 1 to at least one surface of a substrate layer, thereby forming an article comprising a sealant layer associated with the at least one surface of the substrate layer.
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