High speed powder coating line for heat sensitive substrates

US12569877B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12569877-B2
Application numberUS-202218709095-A
CountryUS
Kind codeB2
Filing dateNov 4, 2022
Priority dateNov 11, 2021
Publication dateMar 10, 2026
Grant dateMar 10, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A system for applying a powder coating to a heat-sensitive substrate that may include at least one radiative oven, at least one convective oven, and a powder application system. The powder application system may include a plurality of powder application devices configured to apply powder to at least a top surface of the heat sensitive substrate while the heat sensitive substrate is oriented in a horizontal orientation.

First claim

Opening claim text (preview).

The invention claimed is: 1 . A system for applying a powder coating to a heat-sensitive substrate, the system comprising: at least one radiative oven; at least one convective oven; a powder application system including a plurality of powder application devices configured to apply powder to at least a top surface of the heat sensitive substrate while the heat sensitive substrate is oriented in a horizontal orientation; and a conveyance system that allows for conveyance speeds of more than 50 feet per minute, and wherein the at least one radiative oven preheats the heat sensitive substrate for no more than 30 seconds. 2 . The system of claim 1 , wherein the at least one radiative oven is positioned prior to the powder application device and is configured to preheat the heat sensitive substrate prior to the application of the powder. 3 . The system of claim 1 , wherein the at least one radiative oven preheats the heat-sensitive substrate with infrared radiation. 4 . The system of claim 1 , wherein the at least one radiative oven comprises a first radiative oven and a second radiative oven, the first radiative oven positioned prior to the powder application system and the second radiative oven positioned after the powder application system. 5 . The system of claim 4 , wherein the first radiative oven is configured to preheat the heat-sensitive substrate prior to the application of the powder, and the second radiative oven is configured to heat the heat-sensitive substrate to a curing temperature after the application of the powder. 6 . The system of claim 1 , wherein the at least one convective oven is positioned prior to the powder application device, and is configured to heat the heat sensitive substrate prior to the application of the powder. 7 . The system of claim 1 , wherein the at least one convective oven comprises a first convective oven and a second convective oven, the first convective oven positioned prior to the powder application system and the second convective oven positioned after the powder application system. 8 . The system of claim 7 , wherein the first convective oven is configured to heat the heat-sensitive substrate to a powder coating temperature prior to the application of the powder, and the second convective oven is configured to heat the heat-sensitive substrate to a curing temperature after the application of the powder.

Assignees

Inventors

Classifications

  • with IR heaters · CPC title

  • Applying particulate materials (B05D1/06, B05D1/10 take precedence) · CPC title

  • the objects or other work to be sprayed lying on, or being held above the conveying means, i.e. not hanging from the conveying means · CPC title

  • electrically heated · CPC title

  • the objects or batches of materials being carried by endless belts · CPC title

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What does patent US12569877B2 cover?
A system for applying a powder coating to a heat-sensitive substrate that may include at least one radiative oven, at least one convective oven, and a powder application system. The powder application system may include a plurality of powder application devices configured to apply powder to at least a top surface of the heat sensitive substrate while the heat sensitive substrate is oriented in …
Who is the assignee on this patent?
Ppg Ind Ohio Inc
What technology area does this patent fall under?
Primary CPC classification B05D3/0227. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 10 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).