Node and electronic device

Patent metadata

Field	Value
Publication number	US-12568604-B2
Application number	US-202318185861-A
Country	US
Kind code	B2
Filing date	Mar 17, 2023
Priority date	Sep 21, 2020
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

The present disclosure relates to heat dissipation apparatuses. In an example, a node includes a structural module, a circuit board, a liquid pipe, and a liquid leakage monitoring apparatus. The circuit board is securely mounted on the structural module, and an electronic component including a chip is disposed on the circuit board. The liquid pipe is disposed on the circuit board, and is configured to dissipate heat for the electronic component on the circuit board. The liquid leakage monitoring apparatus includes a drainage pipe sleeved outside the liquid pipe. There is a specific gap between the drainage pipe and the liquid pipe. In response to at least that leakage occurs in the liquid pipe, leaked coolant flows in the drainage pipe.

First claim

What is claimed is:

1 . A node, comprising:
a circuit board, disposed with an electronic component; a liquid pipe comprising coolant in the liquid pipe, wherein the coolant is used to dissipate heat for the electronic component; a liquid leakage monitoring apparatus, comprising a drainage pipe, a liquid receiving tray, and a first liquid leakage sensor, wherein the drainage pipe is sleeved outside the liquid pipe, the drainage pipe is connected to the liquid receiving tray and is configured to direct the coolant leaked from the liquid pipe into the liquid receiving tray, the first liquid leakage sensor is disposed in the liquid receiving tray, and in response to at least detecting the leaked coolant in the liquid receiving tray, the first liquid leakage sensor sends an alarm signal; and a liquid isolation area comprising an opening configured to allow the leaked coolant to flow into the liquid isolation area after the liquid receiving tray is filled.

2 . The node according to claim 1 , further comprising a liquid leakage protection area, wherein the liquid leakage monitoring apparatus comprises a power board, the power board is configured to supply power to the liquid leakage monitoring apparatus, and the power board is disposed in the liquid leakage protection area.

3 . The node according to claim 1 , further comprising a first controller, wherein the liquid pipe is connected to a switch valve, and the first controller is connected to the switch valve and the first liquid leakage sensor and is configured to control, based on the alarm signal, the switch valve to close.

4 . The node according to claim 1 , wherein the alarm signal comprises at least one of a buzzer, an indicator, a pop-up window in a display interface, or a blinking window in a display interface.

5 . The node according to claim 1 , further comprising: a liquid guide groove disposed between the liquid receiving tray and the liquid guide opening, wherein the leaked coolant in the liquid receiving tray is introduced into the liquid isolation area through the liquid guide groove after the liquid receiving tray is filled.

6 . The node according to claim 5 , wherein a detection area of the first liquid leakage sensor is arranged at a connection between the liquid receiving tray and the liquid guide groove.

7 . The node according to claim 1 , further comprising: a liquid guide pipe disposed between the liquid receiving tray and the liquid guide opening, wherein the leaked coolant in the liquid receiving tray is introduced into the liquid isolation area through the liquid guide pipe.

8 . The node according to claim 7 , further comprising: an upper cover at a top of the liquid receiving tray.

9 . The node according to claim 8 , wherein a detection area of the first liquid leakage sensor is arranged at a connection between the liquid receiving tray and the liquid guide pipe.

10 . The node according to claim 1 , wherein the liquid isolation area comprises a liquid outlet, and the leaked coolant in the liquid isolation area flows out through the liquid outlet.

11 . The node according to claim 1 , wherein a second liquid leakage sensor is disposed in the liquid isolation area, and in response to at least detecting that there is leaked coolant in the liquid isolation area, the second liquid leakage sensor sends an alarm signal.

12 . The node according to claim 1 , wherein the liquid receiving tray is either disposed at a corner of the drainage pipe, or disposed at a connection between two adjacent drainage pipes, or both.

13 . The node according to claim 1 , wherein the liquid leakage monitoring apparatus comprises a plurality of liquid receiving trays comprising two adjacent liquid receiving trays, and a drainage pipe of a specified length is connected between the two adjacent liquid receiving trays.

14 . An electronic device, comprising a cabinet body and a node, wherein the node is disposed in the cabinet body and comprises:
a circuit board, disposed with an electronic component; a liquid pipe comprising coolant in the liquid pipe, wherein the coolant is used to dissipate heat for the electronic component; a liquid leakage monitoring apparatus, comprising a drainage pipe, a liquid receiving tray, and a first liquid leakage sensor, wherein the drainage pipe is sleeved outside the liquid pipe, the drainage pipe is connected to the liquid receiving tray and is configured to direct the coolant leaked from the liquid pipe into the liquid receiving tray, the first liquid leakage sensor is disposed in the liquid receiving tray, and in response to at least detecting the leaked coolant in the liquid receiving tray, the first liquid leakage sensor sends an alarm signal; and a liquid isolation area comprising an opening configured to allow the leaked coolant to flow into the liquid isolation area after the liquid receiving tray is filled.

15 . The electronic device according to claim 14 , wherein the node further comprising a liquid leakage protection area, wherein the liquid leakage monitoring apparatus comprises a power board, the power board is configured to supply power to the liquid leakage monitoring apparatus, and the power board is disposed in the liquid leakage protection area.

16 . The electronic device according to claim 14 , wherein the node further comprising a first controller, wherein the liquid pipe is connected to a switch valve, and the first controller is connected to the switch valve and the first liquid leakage sensor and is configured to control, based on the alarm signal, the switch valve to close.

17 . The electronic device according to claim 14 , comprising a liquid discharge pipe, wherein the liquid isolation area is located at a side edge of the node and the liquid isolation area comprises a liquid outlet connected to the liquid discharge pipe.

18 . The electronic device according to claim 17 , wherein the liquid discharge pipe is connected to a liquid collection tray, a third liquid leakage sensor is disposed in the liquid collection tray, and in response to at least detecting that there is leaked coolant in the liquid collection tray, the third liquid leakage sensor sends an alarm signal.

19 . The electronic device according to claim 18 , further comprising a second controller, wherein a liquid pipe is connected to a switch valve, and the second controller is connected to the switch valve and the third liquid leakage sensor and is configured to control, based on the alarm signal, the switch valve to close.

20 . The electronic device according to claim 14 , wherein the node further comprising: a liquid guide groove disposed between the liquid receiving tray and the liquid guide opening, wherein the leaked coolant in the liquid receiving tray is introduced into the liquid isolation area through the liquid guide groove after the liquid receiving tray is filled.

Assignees

• Huawei Tech Co Ltd

Inventors

• Sun Xiaoguang
• Gao Junen
• Peng Huan

Classifications

• F16L55/07

  Arrangement or mounting of devices, e.g. valves, for venting or aerating or draining (apparatus for draining F16T) · CPC title

• F16L55/00

  Devices or appurtenances for use in, or in connection with, pipes or pipe systems (F16L1/00 - F16L53/00, F16L57/00, F16L59/00 take precedence; repairing or joining pipes on or under water F16L1/26; cleaning of pipes B08B9/02, e.g. removal of blockages B08B9/027; devices for preventing bursting of water pipes by freezing E03B7/10) · CPC title

• H05K2201/064

  Fluid cooling, e.g. by integral pipes · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• G01M3/182 Primary

  for tubes · CPC title