Electronic device

Patent metadata

Field	Value
Publication number	US-12082371-B2
Application number	US-202017772787-A
Country	US
Kind code	B2
Filing date	Nov 2, 2020
Priority date	Nov 13, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

An electronic device includes a substrate which is provided in a housing and on which a heat generating member is mounted, a cooling member configured to cool the heat generating member, a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member, a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube, a support member fixed to the housing or the substrate, and a tube fixing portion configured to fix the first tube to the support member.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate which is provided in a housing and on which a heat generating member is mounted;
a cooling member configured to cool the heat generating member;
a first tube including one end connected to the cooling member and configured to supply a cooling medium to the cooling member or discharge the cooling medium from the cooling member;
a joint member including a first connection portion extending in a tube axial direction of the first tube and connected to another end of the first tube;
a support member fixed to the housing or the substrate;
a tube fixing portion configured to fix the first tube to the support member; and
a lower substrate disposed below the joint member,
wherein the support member includes a plate potion configured to separate the lower substrate and the joint member.

2. The electronic device according to claim 1 , wherein the support member further comprises a joint fixing portion configured to fix the joint member.

3. The electronic device according to claim 1 , wherein the plate portion comprises a recessed portion recessed downward.

4. The electronic device according to claim 1 , further comprising a cooling fan provided in the housing,
wherein the support member further comprises a ventilation portion configured to cause air from the cooling fan to pass toward an electronic component provided in the housing.

5. The electronic device according to claim 4 , wherein the support member further comprises a guide wall configured to guide the air from the cooling fan toward the electronic component provided in the housing.

6. The electronic device according to claim 1 , further comprising a second tube that extends in a direction different from that of the first tube,
wherein the joint member further comprises a second connection portion extending in a tube axial direction of the second tube and to which the second tube is connected.

7. The electronic device according to claim 6 , wherein the first tube, the joint member, and the second tube are provided so as to bypass a component mounted on the substrate.

8. The electronic device according to claim 6 , further comprising:
an electronic component module provided at a position different from that of the substrate in the housing; and
a third tube configured to supply the cooling medium to the electronic component module or discharge the cooling medium from the electronic component module,
wherein the second tube is connected to the third tube.

Assignees

• Nec Platforms Ltd

Inventors

• ISOYA Satoshi

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/40

  involving heat exchange by flowing fluids · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title