Wide-coverage edge ring for enhanced shielding in substrate processing systems

US12567566B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12567566-B2
Application numberUS-202218711966-A
CountryUS
Kind codeB2
Filing dateFeb 7, 2022
Priority dateDec 3, 2021
Publication dateMar 3, 2026
Grant dateMar 3, 2026

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A wide-coverage edge ring configured to be arranged above a bottom ring in a substrate processing chamber includes an upper surface, a lower surface that includes a lower surface step that extends downward from the lower surface and is configured to be received within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber liner, an inner diameter, a ledge defined in the inner diameter of the edge ring, and an outer diameter. The outer diameter of the edge ring includes a projection that extends radially outward from the edge ring and defines an inward step in the outer diameter, the projection and the inward step are configured to interface with an upper end of the chamber liner, and the projection is configured to extend at least partially over the upper end of the chamber liner.

First claim

Opening claim text (preview).

What is claimed is: 1 . A wide-coverage edge ring configured to be arranged above a bottom ring in a substrate processing chamber, the wide-coverage edge ring comprising: an upper surface; a lower surface, wherein the lower surface of the edge ring includes a lower surface step extending downward from the lower surface, wherein the lower surface step is configured to be received within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber liner; an inner diameter, wherein a ledge is defined in the inner diameter of the edge ring; and an outer diameter, wherein the outer diameter of the edge ring includes a projection that extends radially outward from the edge ring and defines an inward step in the outer diameter, wherein the projection and the inward step are configured to interface with an upper end of the chamber liner, and wherein the projection is configured to extend at least partially over the upper end of the chamber liner. 2 . The edge ring of claim 1 , wherein the edge ring is a replaceable edge ring configured to be transferred into and out of the substrate processing chamber through a same opening as a substrate. 3 . The edge ring of claim 1 , wherein the edge ring is comprised of quartz. 4 . The edge ring of claim 1 , wherein the upper surface of the edge ring is generally flat. 5 . The edge ring of claim 1 , wherein the upper surface of the edge ring includes an angled upward step. 6 . The edge ring of claim 1 , wherein a lower, inner corner of the edge ring has a first radius and a lower, outer corner of the edge ring has a second radius. 7 . The edge ring of claim 6 , wherein the second radius is greater than the first radius. 8 . The edge ring of claim 1 , wherein a thickness of the projection is greater than or equal to a thickness of the ledge. 9 . An edge ring system comprising the edge ring of claim 1 and further comprising the bottom ring. 10 . The edge ring system of claim 9 , wherein the bottom ring is comprised of ceramic. 11 . The edge ring system of claim 10 , wherein the bottom ring includes a plurality of guide channels. 12 . The edge ring system of claim 10 , wherein an inner diameter of the bottom ring includes a rim extending upward toward the edge ring, and wherein the pocket is defined between the rim and the chamber liner. 13 . The edge ring system of claim 12 , further comprising the chamber liner, wherein the upper end of the chamber liner includes an outward step, and wherein the pocket is defined between the rim and the outward step. 14 . The edge ring system of claim 13 , wherein a radius of a lower, outer corner of the edge ring is configured to interface with a radius defined by the outward step of the chamber liner. 15 . The edge ring system of claim 13 , wherein a serpentine path is defined between the edge ring and the chamber liner. 16 . An edge ring system, comprising: a bottom ring, wherein a rim protrudes upward from an inner diameter of the bottom ring; a wide-coverage edge ring arranged on top of the bottom ring, the edge ring comprising an upper surface, a lower surface, wherein the lower surface of the edge ring includes a lower surface step extending downward from the lower surface radially outward of the rim, and wherein the lower surface step is configured to be received within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber liner, an inner diameter, wherein a ledge is defined in the inner diameter of the edge ring, and an outer diameter, wherein the outer diameter of the edge ring includes a projection that extends radially outward from the edge ring and defines an inward step in the outer diameter, wherein the projection and the inward step are configured to interface with an upper end of the chamber liner, and wherein the projection is configured to extend at least partially above the upper end of the chamber liner. 17 . The edge ring system of claim 16 , wherein the edge ring is comprised of quartz and the bottom ring is comprised of ceramic. 18 . The edge ring system of claim 16 , wherein a lower, inner corner of the edge ring has a first radius and a lower, outer corner of the edge ring has a second radius, and wherein the second radius is greater than the first radius. 19 . The edge ring system of claim 18 , further comprising the chamber liner, wherein the upper end of the chamber liner includes an outward step, wherein the pocket is defined between the rim and the outward step, and wherein the second radius of the lower, outer corner of the edge ring is configured to interface with a third radius defined by the outward step of the chamber liner. 20 . The edge ring system of claim 19 , wherein a serpentine path is defined between the edge ring and the chamber liner. 21 . An edge ring system, comprising: a bottom ring; a wide-coverage edge ring arranged on top of the bottom ring, the edge ring comprising an upper surface, a lower surface, configured to be supported within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber liner, an inner diameter, wherein a ledge is defined in the inner diameter of the edge ring, and an outer diameter, wherein the outer diameter of the edge ring includes a projection that extends radially outward from the edge ring and defines an inward step in the outer diameter, wherein the projection and the inward step are configured to interface with an upper end of the chamber liner, and wherein the projection is configured to extend at least partially above the upper end of the chamber liner.

Assignees

Inventors

Classifications

  • characterised by the mechanical construction of the susceptor, stage or support · CPC title

  • characterised by a coating, a hardness or a material · CPC title

  • Reactive etching · CPC title

  • CVD [Chemical Vapor Deposition] · CPC title

  • Construction (includes replacing parts of the apparatus) · CPC title

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Frequently asked questions

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What does patent US12567566B2 cover?
A wide-coverage edge ring configured to be arranged above a bottom ring in a substrate processing chamber includes an upper surface, a lower surface that includes a lower surface step that extends downward from the lower surface and is configured to be received within and interface with a pocket defined at least partially by an upper surface of the bottom ring and an inner surface of a chamber …
Who is the assignee on this patent?
Lam Res Corp
What technology area does this patent fall under?
Primary CPC classification H01J37/32642. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 03 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).