Undercoating coverage and resistance control for ESCS of substrate processing systems

Patent metadata

Field	Value
Publication number	US-12565701-B2
Application number	US-202218729093-A
Country	US
Kind code	B2
Filing date	Dec 13, 2022
Priority date	Jan 28, 2022
Publication date	Mar 3, 2026
Grant date	Mar 3, 2026

Abstract

An electrostatic chuck (ESC) undercoating system includes a memory and a controller. The memory stores an undercoat application. The controller configured to execute the undercoat application to: determine undercoat parameters; perform a full clean process to remove undercoat deposits in processing chamber of substrate processing system; and based on the undercoat parameters, perform one or more deposition processes to deposit one or more undercoat layers on the ESC to provide an overall undercoat layer having an overall thickness between 7-15 μm, the one or more undercoat layers providing protection of the ESC during subsequent deposition processing of a substrate on the ESC.

First claim

What is claimed is:

1 . A method for forming an overall undercoat layer on an electrostatic chuck (ESC), the method comprising:
determining undercoat parameters; performing a full clean process to remove undercoat deposits in processing chamber of substrate processing system; and based on the undercoat parameters, performing one or more deposition processes to deposit one or more undercoat layers on the ESC to provide the overall undercoat layer having an overall thickness between 7-15 μm, the one or more undercoat layers providing protection of the ESC during subsequent deposition processing of a substrate on the ESC.

2 . The method of claim 1 , wherein the undercoat parameters include radio frequency power levels, gas flow rates, gas flow pressures, gas species, and durations of deposition processes.

3 . The method of claim 1 , wherein the undercoat parameters include a size of a gap between the ESC and a showerhead for each undercoat layer formed during deposition of the one or more undercoat layers.

4 . The method of claim 1 , wherein the full clean process includes supplying ammonia to the processing chamber.

5 . The method of claim 1 , wherein the one or more undercoat layers comprise:
a first undercoat layer; and a second undercoat layer disposed on the first undercoat layer.

6 . The method of claim 5 , wherein each of the first undercoat layer and the second undercoat layer comprises at least one of silicon oxide or silicon nitride.

7 . The method of claim 5 , wherein the first undercoat layer and the second undercoat layer comprise silicon oxide.

8 . The method of claim 5 , wherein:
the first undercoat layer comprises silicon oxide or silicon oxynitride; and the second undercoat layer comprises silicon nitride or silicon oxynitride.

9 . The method of claim 5 , wherein:
the first undercoat layer comprises silicon oxide; and the second undercoat layer comprises silicon nitride or silicon oxynitride.

10 . The method of claim 5 , wherein the second undercoat layer is thinner than the first undercoat layer.

11 . The method of claim 5 , further comprising setting a size of a gap between the ESC and a showerhead to be greater for deposition of the second undercoat layer than for deposition of the first undercoat layer.

12 . The method of claim 5 , further comprising setting a size of a gap between the ESC and a showerhead for deposition of the first undercoat layer and refrain from changing the size of the gap for deposition of the second undercoat layer.

13 . The method of claim 1 , wherein the one or more undercoat layers comprise:
a first undercoat layer; one or more intermediate undercoat layers disposed on the first undercoat layer; and a last undercoat layer disposed on the one or more intermediate undercoat layers.

14 . The method of claim 13 , wherein:
the first undercoat layer is formed of silicon oxide or silicon oxynitride; and each of the one or more intermediate undercoat layers and the last undercoat layer is formed of at least one of silicon oxide or silicon nitride.

15 . The method of claim 13 , further comprising setting a size of a gap between the ESC and a showerhead to be greater for deposition of at least one of the one or more intermediate undercoat layers and the last undercoat layer than for deposition of the first undercoat layer.

16 . The method of claim 13 , further comprising setting a size of a gap between the ESC and a showerhead for deposition of the first undercoat layer and refrain from changing the size of gap for deposition of the one or more intermediate undercoat layers and the last undercoat layer.

17 . The method of claim 1 , further comprising, based on an amount of estimated bowing of a substrate to be processed, selecting the overall thickness.

18 . The method of claim 1 , further comprising introducing one or more precursors into the processing chamber for deposition of the one or more undercoat layers, wherein the one or more precursors are selected from silane, nitrous oxide and nitrogen.

19 . A substrate deposition method comprising:
the method of claim 1 ; supplying current to the ESC to electrostatically clamp the substrate to the ESC; controlling a gas delivery system and a radio frequency generating system to deposit the one or more undercoat layers on the ESC; and subsequent to forming the one or more undercoat layers on the ESC, performing the deposition processing of the substrate on the ESC.

Assignees

• Lam Res Corp

Inventors

• Hong Tu
• Ji Chunhai
• Zhang Pengyi
• Rana Niraj
• Bi Feng
• Li Ming

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H01J2237/3321

  CVD [Chemical Vapor Deposition] · CPC title

• H01J37/32449

  Gas control, e.g. control of the gas flow · CPC title

• C23C16/52

  Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title

• C23C16/5096

  Flat-bed apparatus · CPC title