Circuit board and electronic device comprising same

Patent metadata

Field	Value
Publication number	US-12563660-B2
Application number	US-202318348003-A
Country	US
Kind code	B2
Filing date	Jul 6, 2023
Priority date	Jan 6, 2021
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

An electronic device is provided. The electronic device includes a housing including a first housing part and a second housing part movable with respect to the first housing part, and a circuit board positioned in the housing and including a first part bent in response to movement of the second housing part and a second part extending from the first part and more rigid than the first part, wherein the circuit board may comprise a flexible non-conductive film extending from the first part to the second part, a laminate structure including at least one conductive pattern positioned on the flexible non-conductive film, a coverlay extending from the first part to the second part, overlapping the laminate structure, and including an electromagnetic shielding material, and at least one conductive via positioned at the second part and electrically connecting the at least one conductive pattern and the coverlay.

First claim

What is claimed is:

1 . An electronic device comprising:
a housing comprising a first housing part and a second housing part configured to be movable relative to the first housing part; and a circuit board which is positioned in the housing and comprises a first portion bent in response to a movement of the second housing part, and a second portion which extends from the first portion and is more rigid than the first portion, wherein the circuit board comprises:
a flexible dielectric extending from the first portion to the second portion,
a first ground pattern extending from the first portion to the second portion and disposed on the flexible dielectric,
a second ground pattern positioned in the second portion,
a coverlay extending from the first portion to the second portion and comprising an electromagnetic shielding layer, a portion of the coverlay positioned between the first ground pattern and the second ground pattern at the second portion, and
a first conductive via positioned in the second portion and configured to electrically connect to the first ground pattern, the second ground pattern, and the coverlay,
a first signal line pattern extending from the first portion to the second portion, disposed on the flexible dielectric,
a second signal line pattern positioned in the second portion, and
a second conductive via positioned in the second portion and configured to electrically connect to the first signal line pattern and the second signal line pattern,
wherein the second conductive via is configured to penetrate the coverlay and to be electrically isolated from the electromagnetic shielding layer of the coverlay.

2 . The electronic device of claim 1 , wherein the portion of the coverlay is disposed inside the second portion.

3 . The electronic device of claim 2 , wherein another portion of the coverlay forms a part of a surface of the circuit board.

4 . The electronic device of claim 1 ,
wherein the coverlay further comprises:
a first insulation layer extending from the first portion to the second portion, and forming a part of a surface of the circuit board, and
a second insulation layer extending from the first portion to the second portion, and positioned between the first insulation layer and the flexible dielectric, and
wherein the electromagnetic shielding layer is disposed between the first insulation layer and the second insulation layer,
wherein the at least one first conductive via electrically connects the first ground pattern, the second ground pattern, and the conductive electromagnetic shielding layer of the coverlay.

5 . The electronic device of claim 4 , wherein the coverlay further comprises a non-conductive adhesive layer disposed on the second insulation layer, and
wherein the second insulation layer is disposed between the electromagnetic shielding layer and the non-conductive adhesive layer.

6 . The electronic device of claim 4 , wherein the second insulation layer has a thickness greater than the electromagnetic shielding layer or the first insulation layer.

7 . The electronic device of claim 1 , wherein the at least one first conductive via comprises a laser via hole (LVH) or a stacked via.

8 . The electronic device of claim 1 ,
wherein the second conductive via is configured to penetrate the coverlay through a hole formed in the coverlay, and wherein the circuit board comprises a non-conductive member disposed between the second conductive via and an inner surface of the hole such that the second conductive via is physically and electrically separated from the coverlay.

9 . The electronic device of claim 1 , wherein the second conductive via comprises a plated through hole (PTH).

10 . The electronic device of claim 1 , wherein the second portion has a thickness greater than the first portion.

11 . The electronic device of claim 1 , wherein the second portion protrudes with respect to the first portion.

12 . The electronic device of claim 1 , wherein the second portion further comprises a rigid dielectric compared to the first portion.

13 . The electronic device of claim 1 ,
wherein the circuit board is configured to electrically connect a first electrical element positioned in the first housing part and a second electrical element positioned in the second housing part, wherein the first electrical element comprises at least one antenna, and wherein the second electrical element comprises a wireless communication circuit configured to transmit or receive a signal of a selected or a designated frequency band through the at least one antenna.

14 . A circuit board comprising:
a first portion, and a second portion which extends from the first portion and is more rigid than the first portion; a flexible dielectric extending from the first portion to the second portion, a first ground pattern extending from the first portion to the second portion and disposed on the flexible dielectric; a second ground pattern positioned in the second portion; a coverlay extending from the first portion into the second portion and comprising an electromagnetic shielding layer, a portion of the coverlay positioned between the first ground pattern and the second ground pattern at the second portion; and a first conductive via positioned in the second portion and configured to electrically connect to the first ground pattern, the second ground pattern, and the coverlay; a first signal line pattern extending from the first portion to the second portion, disposed on the flexible dielectric; a second signal line pattern positioned in the second portion; and a second conductive via positioned in the second portion and configured to electrically connect to the first signal line pattern and the second signal line pattern, wherein the second conductive via is configured to penetrate the coverlay and to be electrically isolated from the electromagnetic shielding of the coverlay.

15 . The circuit board of claim 14 , wherein another portion of the coverlay forms a part of a surface of the circuit board.

16 . The circuit board of claim 14 ,
wherein the coverlay further comprises;
a first insulation layer extending from the first portion to the second portion, and forming a part of a surface of the circuit board, and
a second insulation layer extending from the first portion to the second portion, and positioned between the first insulation layer and the flexible dielectric, and
wherein the electromagnetic shielding layer is disposed between the first insulation layer and the second insulation layer,
wherein the at least one first conductive via electrically connects the first ground pattern, the second ground pattern, and the electromagnetic shielding layer.

17 . The circuit board of claim 14 , further comprising:
a non-conductive member disposed between the second conductive via and an inner surface of a hole formed in the coverlay such that the second conductive via is physically and electrically separated from the coverlay.

18 . The circuit board of claim 14 , wherein a first surface protective layer covers a first end of the at least one via and a second surface protective layer covers a second end of the at least one via.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Byeongkeol
• Hong Eunseok
• Lee Youngsun

Classifications

• H05K2201/09636

  Details of adjacent, not connected vias · CPC title

• H05K3/429

  Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/118

  specially for flexible printed circuits, e.g. using folded portions · CPC title

• H05K1/028

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title