System and method for testing optical receivers

Patent metadata

Field	Value
Publication number	US-12560642-B2
Application number	US-202318227127-A
Country	US
Kind code	B2
Filing date	Jul 27, 2023
Priority date	Oct 29, 2020
Publication date	Feb 24, 2026
Grant date	Feb 24, 2026

Abstract

Disclosed are a testing unit, system, and method for testing and predicting failure of optical receivers. The testing unit and system are configured to apply different values of current, voltage, heat stress, and illumination load on the optical receivers during testing. The test methods are designed to check dark current, photo current, forward voltage, and drift over time of these parameters.

First claim

The invention claimed is:

1 . A method for testing optical receivers, the method comprising:
placing within a temperature controlled oven:
a testing board configured to support at least one socket, wherein each socket is configured to receive a substrate configured to support at least one optical receiver; and
an emitter board configured to support at least one optical emitter,
wherein the emitter board is supported above the testing board such that the emitter board is substantially parallel to the testing board and each of the one or more optical emitters on the emitter board is substantially aligned with a corresponding socket of the testing board; and
performing one or more testing operations without removal of the testing board or the emitter board from the temperature controlled oven, wherein the one or more testing operations further comprise a second testing procedure comprising:
increasing a temperature of the temperature controlled oven greater than an ambient temperature of the temperature controlled over;
applying an illumination load on the optical receiver;
applying a constant reverse voltage to the optical receiver;
iteratively measuring a substrate temperature to determine if the temperature is above or below a preset value;
iteratively measuring a photo current of the optical receiver to determine if the photo current is inside a designed operating range of the optical receiver;
halting the second testing procedure in an instance in which the substrate temperature is above or below the preset value; and
outputting a fail state for the optical receiver in response to halting the second testing procedure.

2 . The method according to claim 1 , wherein the one or more testing operations further comprise a pre-test procedure comprising:
determining a temperature of the substrate; and outputting a fail state in an instance in which the determined temperature of the substrate is outside an operating range of the optical receiver.

3 . The method according to claim 1 , wherein the one or more testing operations further comprise a pre-test procedure comprising:
determining an absence of the optical receiver supported by the substrate; and outputting a fail state in response to the absence of the optical receiver.

4 . The method according to claim 1 , wherein the one or more testing operations further comprise a pre-test procedure comprising:
applying a current to the optical receiver; measuring a voltage of the optical receiver; and outputting a fail state in an instance in which the measured voltage is outside an operating range of the optical receiver.

5 . The method according to claim 1 , wherein the one or more testing operations further comprise a pre-test procedure comprising:
determining an open circuit and/or leakage on the optical receiver; outputting a fail state in response to the determined open circuit and/or leakage.

6 . The method according to claim 1 , wherein the one or more testing operations further comprise a pre-test procedure comprising:
determining a temperature of the substrate; determining an absence of the optical receiver supported by the substrate; applying a current to the optical receiver; measuring a voltage of the optical receiver; determining an open circuit and/or leakage on the optical receiver; and outputting a fail state:
in an instance in which the determined temperature of the substrate is outside an operating range of the optical receiver;
in response to the absence of the optical receiver;
in an instance in which the measured voltage is outside an operating range of the optical receiver; or
in response to the determined open circuit and/or leakage.

7 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure comprising:
applying a reverse voltage to the optical receiver; determining a dark current for the optical receiver; outputting a fail state in an instance in which the determined dark current is outside of a designed operating range of the optical receiver; and storing the dark current and a temperature at a Time=0 in an instance in which the determined dark current is inside of a designed operating range of the optical receiver.

8 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure comprising:
applying a reverse voltage to the optical receiver; providing an illumination load on the optical receiver; determining a photo current for the optical receiver; outputting a fail state in an instance in which the determined photo current is outside of a designed operating range of the optical receiver; and storing the photo current and a temperature at a Time=0 in an instance in which the determined photo current is inside of a designed operating range of the optical receiver.

9 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure comprising:
applying a forward current to the optical receiver; determining a forward voltage for the optical receiver; outputting a fail state in an instance in which the determined forward voltage is outside of a designed operating range of the optical receiver; and storing the forward voltage and a temperature at a Time=0 in an instance in which the determined forward voltage is inside of a designed operating range of the optical receiver.

10 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure comprising:
applying a reverse voltage to the optical receiver; determining a dark current for the optical receiver; providing an illumination load on the optical receiver; determining a photo current for the optical receiver; applying a forward current to the optical receiver; determining a forward voltage for the optical receiver; outputting a fail state in an instance in which:
the determined dark current is outside of a designed operating range of the optical receiver;
the determined photo current is outside of a designed operating range of the optical receiver; and/or
the determined forward voltage is outside of a designed operating range of the optical receiver; and
storing the dark current, the photo current, the forward voltage, and a temperature at a Time=0 in an instance in which the determined dark current, the photo current, and the forward voltage are inside of a designed operating range of the optical receiver.

11 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure comprising:
increasing a temperature of the temperature controlled oven greater than an ambient temperature of the temperature controlled over; applying a constant reverse voltage to the optical receiver; iteratively measuring a substrate temperature to determine if the temperature is above or below a preset value; iteratively measuring a dark current of the optical receiver to determine if the dark current is inside a designed operating range of the optical receiver; halting the second testing procedure in an instance in which the substrate temperature is above or below the preset value; and outputting a fail state for the optical receiver in response to halting the second testing procedure.

12 . The method according to claim 11 , wherein the operations of the another testing procedure are completed at a constant temperature.

13 . The method according to claim 1 , wherein the one or more testing operations further comprise another testing procedure compri

Assignees

• Mellanox Technologies Ltd

Inventors

• Antonenko Tatyana
• Gridish Yaakov
• Sharkaz Tamir
• Kalifa Itshak
• Mentovich Elad

Classifications

• H01S5/0021

  Degradation or life time measurements · CPC title

• G01R1/0441

  Details · CPC title

• H04L41/149

  for prediction of maintenance · CPC title

• H04L43/50

  Testing arrangements · CPC title

• G01R31/2642 Primary

  Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests · CPC title