Method for joining components and component composite

US12560188B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12560188-B2
Application numberUS-201815869413-A
CountryUS
Kind codeB2
Filing dateJan 12, 2018
Priority dateOct 13, 2015
Publication dateFeb 24, 2026
Grant dateFeb 24, 2026

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for joining a first component to a second component includes providing a first component with a first joining part receiving section and creating a joining part on and/or in the first joining part receiving section via a generative method. The method also includes providing a second component with a second joining part receiving section, and joining the joining part to the second joining part receiving section of the second component.

First claim

Opening claim text (preview).

What is claimed is: 1 . A method for joining a first component to a second component, the method comprising the acts of: a first step of providing the first component with a first joining part receiving section; after the first step, a second step of creating a joining part on and/or in the first joining part receiving section using a generative manufacturing method that deposits material in layers, wherein the joining part comprises an orienting aid which facilitates a relative orienting of the first component with the second component; after the second step, a third step of providing the second component with a second joining part receiving section; after the third step, a fourth step of creating an additional region of the joining part in the second joining part receiving section using the generative manufacturing method that deposits material in layers; and after the fourth step, a fifth step of connecting the joining part on and/or in the first joining part receiving section to the second joining part receiving section at the additional region in the second joining part, wherein the generative manufacturing method that deposits material in layers is one of a 3D printing process, a laser sintering process, a metal spray process, a selective laser melting process, a soldering process or a thixoforming process. 2 . The method as claimed in claim 1 , wherein the joining part is welded and/or soldered and/or adhesively bonded to the second joining part receiving section during the connection to the second joining part receiving section. 3 . The method as claimed in claim 2 , wherein the joining part is welded and/or soldered and/or adhesively bonded to the first joining part receiving section. 4 . The method as claimed in claim 3 , wherein the joining part is created from a joining part material which comprises at least a first material and a second material different from the first material, wherein the first material is integrally bonded to the first component and the second material is integrally bonded to the second component. 5 . The method as claimed in claim 1 , wherein during the creating of the joining part, an integrally bonded or force locking connection of the joining part with the first component and/or second component is formed. 6 . The method as claimed in claim 5 , wherein the joining part is created in the first joining part receiving section such that the joining part is held by form fit by a first form fitting section on the first joining part receiving section. 7 . The method as claimed in claim 6 , wherein the first form fitting section comprises a first undercut, wherein the joining part is created such that the joining part is held by form fit on the first undercut. 8 . The method as claimed in claim 1 , wherein the first joining part receiving section comprises a first bushing. 9 . The method as claimed in claim 8 , wherein the first bushing is entirely or at least partly closed by the joining part when creating the joining part. 10 . The method as claimed in claim 9 , wherein the first component has a first component material and the second component has a second component material, the first component material and the second component material being different materials. 11 . The method as claimed in claim 1 , wherein when providing the second component, the second joining part receiving section is arranged on the joining part such that the joining part protrudes into the second joining part receiving section. 12 . The method as claimed in claim 11 , wherein when creating the joining part, a spacing region of the joining part is created, which is formed in order to form a defined spacing between the first component and the second component.

Assignees

Inventors

Classifications

  • Laser welding for purposes other than joining · CPC title

  • taking account of the properties of the materials to be soldered · CPC title

  • by melting · CPC title

  • by welding · CPC title

  • by means of two electrodes placed opposite one another on both sides of the welded parts · CPC title

Patent family

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Frequently asked questions

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What does patent US12560188B2 cover?
A method for joining a first component to a second component includes providing a first component with a first joining part receiving section and creating a joining part on and/or in the first joining part receiving section via a generative method. The method also includes providing a second component with a second joining part receiving section, and joining the joining part to the second joini…
Who is the assignee on this patent?
Bayerische Motoren Werke Ag
What technology area does this patent fall under?
Primary CPC classification F16B5/08. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Feb 24 2026 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).